• Journal of the Semiconductor & Display Technology
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• v.8 no.2
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• pp.15-21
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• 2009

Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.4
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• pp.1812-1816
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• 2011

This research developed chemical flow control system(CFCS) essential for spinner equipment in nano semiconductor manufacturing process under the 100nm to prevent complex process defect due to missing spread after chemical injection. The devices developed in this research, which can be swiftly replaced in case abnormal state element changes or wafer manufacturing defect occurs, are anticipated to improve module yield as well as real-time monitoring on the state element. In addition, as a result of mounting H/W and S/W system to control detailed operation sequence in production line and executing performance check and verification, we can be exactly detected in five abnomal process type.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.33 no.3
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• pp.184-191
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• 2010

In the environment of 450mm wafers production known as the next-generation semiconductor production process, one of the most significant features is the full automation over the whole manufacturing processes involved. The full automation system for 450mm wafer production will minimize the human workers' involvement in the manufacturing process as much as possible. In addition, since the importance of an individual wafer processing increases noticeably, it is necessary to develop more robust scheduling systems in the whole manufacturing process than so ever. The scheduling systems for the next-generation semiconductor production processes also should be capable of monitoring individual wafers and collecting useful data on them in real time. Based on the information gathered from these processes, the system should finally have a real-time scheduling functions controlling whole the semiconductor manufacturing processes. In this study, preliminary investigations on the requirements and needed functions for constructing the real time scheduling system and transforming manufacturing environments for 300mm wafers to those of 400mm are conducted and through which the next generation semiconductor processes for efficient scheduling in a clustered production system architecture of the scheduler is proposed. Our scheduling architecture is composed of the modules for real-time scheduling, the clustered production type supporting, the optimal scheduling and so on. The specifications of modules to define the major required functions, capabilities, and the relationship between them are presented.

• Journal of the Semiconductor & Display Technology
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• v.16 no.1
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• pp.29-33
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• 2017

This paper presents a development of vision aligner with three channels for the wafer and plate bonding machine in manufacturing of LED. The developed vision aligner consists of three cameras and performs wafer alignment of rotation and translation, flipped wafer detection, and UV Tape detection on the target wafer and plate. Normally the process step of wafer bonding is not defined by standards in semiconductor's manufacturing which steps are used depends on the wafer types so, a lot of processing steps has many unexpected problems by the workers and environment of manufacturing such as the above mentioned. For the mass production, the machine operation related to production time and worker's safety so the operation process should be operated at one time with considering of unexpected problem. The developed system solved the 4 kinds of unexpected problems and it will apply on the massproduction environment.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.34 no.4
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• pp.57-65
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• 2011

Monitoring auto correlated processes is prevalent in recent manufacturing environments. As a proactive control for manufacturing processes is emphasized especially in the semiconductor industry, it is natural to monitor real-time status of equipment through sensor rather than resultant output status of the processes. Equipment's sensor data show various forms of correlation features. Among them, considerable amount of sensor data, statistically autocorrelated, is well represented by Box-Jenkins autoregressive moving average (ARMA) model. In this paper, we present a design method of statistical process control (SPC) used for monitoring processes represented by the ARMA model. The proposed method shows benefits in the power of detecting process changes, and considers robustness to ARMA modeling errors simultaneously. We prove benefits through Monte carlo simulation-based investigations.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.335-336
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• 2006

Compound semiconductor manufacturing environment also has been emerged as mass customization and open foundry service so integrated manufacturing system is needed. In this study, we design data acquisition system of compound semiconductor fabrication that has monitoring and control of process. The developed DAS is consisted of key-in system inputted by operator and automatic acquisition system by GEM protocol. And we implemented them in the actual compound semiconductor. It is expected that using developed system would offer precise process information to buyer, reduce a lead-time, and obey a due-dates and so on.

• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.62-66
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• 2022

Semiconductor is one of the most internationally competitive areas among domestic industries, the major concern of which is the stability of the wafer manufacturing processes. The packaging process is the final step in wafer manufacturing. Problems in the wafer packaging process cause large losses. The vibrations are supposed to be the most important factors for the packaging quality. In this study, the structure of a packaging box was analyzed through experiments and computer simulations, and further the effects of design alterations to suppress the vibrations have been investigated. The final result shows that the vibrations can be reduced substantially to improve the stability of the structure.

• International Journal of Quality Innovation
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• v.6 no.1
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• pp.58-73
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• 2005

The objective of this study is to evaluate the equipment risk before and after SEMI S2-93A implementation, thus providing a guideline for safety improvement. Semiconductor Plant A located in Taiwan's Hsinchu Science Based Industrial Park with 147 manufacturing machines was used for risk assessment. This study was carried out in three steps. First, a preliminary hazard analysis was conducted. A detailed process safety evaluation was conducted (Hazard and Operability Study, HAZOP); and finally, the equipment risk comparison before and after Semiconductor Equipment Manufacturing Instruction (SEMI S2-93A) implementation. The preliminary hazard analysis results showed high risk in 21.77% of the manufacturing machines under risk assessment at Plant A. The largest percentage existed in the Diffusion Department. The machine types specified by the hazardous work site review and inspection according to Article 26 of Labor Inspection Regulation (the machines that use such chemicals as, $SiH_4$, HF, HCL, etc. and that are determined to be highly hazardous through preliminary hazard analysis) were added to the detailed process analysis and evaluation. In the third part of this evaluation, the machines at Plant A used for detailed process safety assessment were divided into two groups based on the manufacturing data before and after 1993. The severity, possibility, and actual accident analysis before and after SEMI S2-93A implementation were compared. The Semiconductor Equipment Manufacturing Instruction (SEMI S2-93A) implementation can reduce the severity and possibility of hazard occurrence.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.9
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• pp.1-11
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• 2022

Recently, there has been continuous technological development in the semiconductor industry, and semiconductor manufacturing technologies are being advanced and highly integrated. For this reason, ceramic material having excellent heat resistance, wear resistance, and conductivity are used as components in semiconductor manufacturing. Among them, the probe card's space transformer is used as ceramic material to prevent electronic signal noise during the electrical die sorting of semiconductor function testing. However, implementing a bulk-type space transformer with a thickness of 5.6 mm or more is challenging, and thus it is produced in a structure with a stacked ceramic film. The stacked space transformer has low productivity because it is difficult to ensure hole clogging and a precise shape. In this research, an ultrasonic horn is designed to manufacture a bulk-type ceramic space transformer through ultrasonic drilling. Vibration characteristics were analyzed according to the ultrasonic horn, and the natural frequency was measured.

• Journal of Korean Institute of Industrial Engineers
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• v.22 no.2
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• pp.231-245
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• 1996

Semiconductor manufacturing line includes several batch processes which are to be controlled effectively to enhance the productivity of the line. The key problem in batch processes is a dynamic batch sizing problem which determines number of lots processed simultaneously in a single botch. The batch sizing problem in semiconductor manufacturing has to consider delay of lots, setup cost of the process, machine utilization and so on. However, an optimal solution cannot be attainable due to dynamic arrival pattern of lots, and difficulties in forecasting future arrival times of lots of the process. This paper proposes an efficient batch sizing heuristic, which considers delay cost, setup cost, and effect of the forecast errors in determining the botch size dynamically. Extensive numerical experiments through simulation are carried out to investigate the effectiveness of the proposed heuristic in four key performance criteria: average delay, variance of delay, overage lot size and total cost. The results show that the proposed heuristic works effectively and efficiently.