• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.444-449
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• 1996

The semiconductor, which is precision product, requires many inspection processes. The surface conditions of the semiconductor chip affect on the functions of the semiconductors. The defects of the chip surface are cracks or voids. As general inspection method requires many inspection procedure, the inspection system which searches immediately and precisely the defects of the semiconductor chip surface is required. We suggest the detection algorithm for inspecting the surface defects of the semiconductor surface. The proposed algorithm first regards the semiconductor surface as random texture and point spread function, and secondly presents the character of texture by linear estimation theorem. This paper assumes that the gray level of each pixel of an image is estimated from a weighted sum of gray levels of its neighbor pixels by linear estimation theorem. The weight coefficients are determined so that the mean square error is minimized. The obtained estimation window(two-dimensional estimation window) characterizes the surface texture of semiconductor and is used to discriminate the defects of semiconductor surface.

• Journal of the Semiconductor & Display Technology
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• v.19 no.4
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• pp.135-138
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• 2020

This paper suggests a method of automatic clustering to search of relevant digital photos using geo-coded information. The provided scheme labels photo images with their corresponding global positioning system coordinates and date/time at the moment of capture, and the labels are used as clustering metadata of the images when they are in the use of retrieval. Experimental results show that geo-location information can improve the accuracy of image retrieval, and the information embedded within the images are effective and precise on the image clustering.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.26 no.4
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• pp.263-279
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• 2022

This paper presents an automatic inspection of defects in semiconductor images. We devise a statistical method to find defects on homogeneous background from the observation that it has a log-normal distribution. If computer aided design (CAD) data is available, we use it to construct a signed distance function (SDF) and change the pixel values so that the average of pixel values along the level curve of the SDF is zero, so that the image has a homogeneous background. In the absence of CAD data, we devise a hybrid method consisting of a model-based algorithm and two neural networks. The model-based algorithm uses the first right singular vector to determine whether the image has a linear or complex structure. For an image with a linear structure, we remove the structure using the rank 1 approximation so that it has a homogeneous background. An image with a complex structure is inspected by two neural networks. We provide results of numerical experiments for the proposed methods.

• JSTS:Journal of Semiconductor Technology and Science
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• v.6 no.2
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• pp.87-89
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• 2006

This paper proposes a sense amplifier with non-volatile memory in order to improve the image quality of LCD by enhancing the matching of the driving voltages between the panel and driver. The sense amplifier having a wide sensing margin and fast response adjusts LCD driver voltage of display driver. The CSTN-LCD with the sense amplifier results improved image quality than that with conventional 6 bit column driver without it.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.4
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• pp.388-396
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• 2012

In this paper, a $320{\times}240$ pixel, 80 frame/s CMOS image sensor with a low power dual correlated double sampling (CDS) scheme is presented. A novel 8-bit hold-and-go counter in each column is proposed to obtain 10-bit resolution. Furthermore, dual CDS and a configurable counter scheme are also discussed to realize efficient power reduction. With these techniques, the digital counter consumes at least 43% and at most 61% less power compared with the column-counters type, and the frame rate is approximately 40% faster than the double memory type due to a partial pipeline structure without additional memories. The prototype sensor was fabricated in a Samsung $0.13{\mu}m$ 1P4M CMOS process and used a 4T APS with a pixel pitch of $2.25{\mu}m$. The measured column fixed pattern noise (FPN) is 0.10 LSB.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.345-350
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• 2002

In this study, researchers classifying the artificial flaws in semiconductor packages are performed by pattern recognition technology. For this purposes, image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtration, binary process, edge detection and classifier design is treated by Backpropagation Neural Network. Specially, it is compared with various weights of Backpropagation Neural Network and it is compared with threshold level of edge detection in preprocessing method fur entrance into Multi-Layer Perceptron(Backpropagation Neural network). Also, the pattern recognition techniques is applied to the classification problem of defects in semiconductor packages as normal, crack, delamination. According to this results, it is possible to acquire the recognition rate of 100% for Backpropagation Neural Network.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.721-726
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• 2005

In this study, researchers classifying the artificial flaws in semiconductor. packages are performed by pattern recognition technology. For this purposes, image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtration, binary process, edge detection and classifier design is treated by Backpropagation Neural Network. Specially, it is compared with various weights of Backpropagation Neural Network and it is compared with threshold level of edge detection in preprocessing method for entrance into Multi-Layer Perceptron(Backpropagation Neural network). Also, the pattern recognition techniques is applied to the classification problem of defects in semiconductor packages as normal, crack, delamination. According to this results, it is possible to acquire the recognition rate of 100% for Backpropagation Neural Network.

• Journal of the Semiconductor & Display Technology
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• v.21 no.3
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• pp.12-16
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• 2022

In this paper, a method for measuring image pattern widths is proposed using gaussian interpolation, in order to improve inconsistent results coming from the different directions in image patterns. The performance of our method is evaluated using image patterns with 9 directions, and compared with previous methods. It is confirmed that the proposed method gives accurate and consistent width results regardless of pattern directions.

• Journal of the Semiconductor & Display Technology
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• v.15 no.3
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• pp.51-56
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• 2016

This paper proposes a new image enhancement method for an infrared thermal image. The proposed method uses both Laplacian and Prewitt edge detectors. Without a visible light, it uses an infrared image for the edge detection. The method subtracts contour images from the infrared thermal image. It results black contours of objects in the infrared thermal image. That makes the objects in the infrared thermal image distinguished clearly. The proposed method is implemented using C language in an embedded Linux system for a high-speed real-time image processing. Experiments were conducted by using various infrared thermal images. The results show that the proposed method is successful for image enhancement of an infrared thermal image.

• Journal of the Semiconductor & Display Technology
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• v.19 no.1
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• pp.6-10
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• 2020

Unlike modern photography technology, in the early days, efforts to physically compose an image with a concept similar to the current photograph have not been popular or commercially successful. The limitation of the use of images as artistic media or recordings has reached the stage of introducing the technology of image analysis to automate the function that humans recognize and judge through vision. In addition, the accuracy of the image has exceeded the human visual ability, enabling the technology that enables the step of recognizing and informing the fact that the human is not aware of it. Based on such a base, the range that can be applied through the image data in the future era can be said to be unpredictable, and the technology that targets large scale image database instead of an image is also expanding the possibilities as a new application technology. In order to identify a particular image from a massive database, different methodologies have been introduced. In this paper, we discuss image identifier production methods based on multi-resolution pyramid.