• Korean Journal of Computational Design and Engineering
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• v.19 no.3
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• pp.214-223
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• 2014

This paper presents a bottleneck detection framework using simulation approach in a wafer FAB (Fabrication). In a semiconductor manufacturing industry, wafer FAB facility contains various equipment and dozens kinds of wafer products. The wafer FAB has many characteristics, such as re-entrant processing flow, batch tools. The performance of a complex manufacturing system (i.e. semiconductor wafer FAB) is mainly decided by a bottleneck. This paper defines the problem of a bottleneck process and propose a simulation based framework for bottleneck detection. The bottleneck is not the viewpoint of a machine, but the viewpoint of a step with the highest WIP in its upstream buffer and severe fluctuation. In this paper, focus on the classification of bottleneck steps and then verify the steps are not in a starvation state in last, regardless of dispatching rules. By the proposed framework of this paper, the performance of a wafer FAB is improved in on-time delivery and the mean of minimum of cycle time.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.76.1-76.1
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• 2013

Atomic Layer Deposition (ALD) has remarkably developed in semiconductor and nano-structure applications since early 1990. Now, the advantages of ALD process are well-known as controlling atomic-level-thickness, manipulating atomic-level-composition control, and depositing impurity-free films uniformly. These unique properties may accelerate ALD related industries and applications in various functional thin film markets. On the other hand, one of big markets, Display industry, just starts to look at the potential to adopt ALD functional films in emerging display applications, such as transparent and flexible displays. Unlike conventional ALD process strategies (good quality films and stable precursors at high deposition processes), recently major display industries have suggested the following requirements: large area equipment, reasonable throughput, low temperature process, and cost-effective functional precursors. In this talk, it will be mentioned some demands of display industries for applying ALD processes and/or functional films, in terms of emerging display technologies. In fact, the AMOLED (active matrix organic light emitting diode) Television markets are just starting at early 2013. There are a few possibilities and needs to be developing for AMOLED, Flexible and transparent Display markets. Moreover, some basic results will be shown to specify ALD display applications, including transparent conduction oxide, oxide semiconductor, passivation and barrier films.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.74-84
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• 2022

As the semiconductor industry develops, the difficulty of newly required process technology becomes difficult, and the importance of production yield and product reliability increases. As an effort to minimize yield loss in the manufacturing process, interests in the process defect process for facility diagnosis and defect identification are continuously increasing. This research observed the plasma condition changes in the multi oxide/nitride layer deposition (MOLD) process, which is one of the 3D-NAND manufacturing processes through optical emission spectroscopy (OES) and monitored the result of whether the change in plasma characteristics generated in repeated deposition of oxide film and nitride film could directly affect the film. Based on these results, it was confirmed that if a change over a certain period occurs, a change in the plasma characteristics was detected. The change may affect the quality of oxide film, such as the film thickness as well as the interfacial surface roughness when the oxide and nitride thin film deposited by plasma enhenced chemical vapor deposition (PECVD) method.

• Journal of Powder Materials
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• v.30 no.2
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• pp.156-168
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• 2023

The semiconductor industry faces physical limitations due to its top-down manufacturing processes. High cost of EUV equipment, time loss during tens or hundreds of photolithography steps, overlay, etch process errors, and contamination issues owing to photolithography still exist and may become more serious with the miniaturization of semiconductor devices. Therefore, a bottom-up approach is required to overcome these issues. The key technology that enables bottom-up semiconductor manufacturing is area-selective atomic layer deposition (ASALD). Here, various ASALD processes for elemental metals, such as Co, Cu, Ir, Ni, Pt, and Ru, are reviewed. Surface treatments using chemical species, such as self-assembled monolayers and small-molecule inhibitors, to control the hydrophilicity of the surface have been introduced. Finally, we discuss the future applications of metal ASALD processes.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.8-13
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• 2023

High bandwidth memory a core technology of the future memory semiconductor industry, is attracting attention. Temporary bonding and debonding process technology, which plays an important role in high bandwidth memory process technology, is also being studied. In this process, total thickness variation is a major factor determining wafer performance. In this study, the reliability of the equipment measuring total thickness variation is identified, and the servo motor settling, and wafer total thickness variation measurement accuracy are analyzed. As for the experimental variables, vacuum, acceleration time, and speed are changed to find the most efficient value by comparing the stabilization time. The smaller the vacuum and the larger the radius, the longer the settling time. If the radius is small, high-speed rotation performance is good, and if the radius is large, low-speed rotation performance is good. In the future, we plan to conduct an experiment to measure the entire of the wafer.

• Journal of Surface Science and Engineering
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• v.57 no.3
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• pp.165-178
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• 2024

In semiconductor memory device manufacturing, the capability for high aspect ratio contact (HARC) etching determines the density of memory device. Given that there is no standardized definition of "high" in high aspect ratio, it is crucial to continuously monitor recent technology trends to address technological gaps. Not only semiconductor memory manufacturing companies such as Samsung Electronics, SK Hynix, and Micron but also semiconductor manufacturing equipment companies such as Lam Research, Applied Materials, Tokyo Electron, and SEMES release annual reports on HARC etching technology. Although there is a gap in technological focus between semiconductor mass production environments and various research institutes, the results from these institutes significantly contribute by demonstrating fundamental mechanisms with empirical evidence, often in collaboration with industry researchers. This paper reviews recent studies on HARC etching and the study of dielectric etching in various technologies.

• Journal of the Semiconductor & Display Technology
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• v.23 no.2
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• pp.1-5
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• 2024

In the electronics industry, a lot of research and development is being conducted on electronic component supply, component alignment and insertion, and automation of soldering on the back side of the PCB for automatic PCB assembly. Additionally, as the use of electronic components increases in the automotive component field, there is a growing need to automate the alignment and insertion of components with leads such as transistors, coils, and fuses on PCB. In response to these demands, the types of PCB and parts used have been more various, and as this industrial trend, the quantity and placement of automation equipment that supplies, aligns, inserts, and solders components has become important in PCB manufacturing plants. It is also necessary to reduce the pre-setting time before using each automation equipment. In this study, we propose a method in which a vision system recognizes the type of component and simultaneously corrects alignment errors during the process of aligning and inserting various types of electronic components. The proposed method is effective in manufacturing various types of PCBs by minimizing the amount of automatic equipment inserted after alignment with the component supply device and omitting the preset process depending on the type of component supplied. Also the advantage of the proposed method is that the structure of the existing automatic insertion machine can be easily modified and utilized without major changes.

• The Journal of Information Systems
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• v.26 no.2
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• pp.105-121
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• 2017

Purpose It is a major goal to improve the product yields during production operations in the manufacturing industry. Therefore, factory is trying to keep the good quality materials and proper production resources, also find the proper condition of facilities and manufacturing environment for yields improvement. Design/methodology/approach We propose the hybrid framework to analyze to dataset extracted from MES. Those data is about the alarm information generated from equipment, both measurement and equipment process value from production and cycle/pitch time measured from production data these covered products during production. We adapt a data warehousing techniques for organizing dataset, a logistic regression for finding out the significant factors, and a association analysis for drawing the rules which affect the product yields. And then we validate the framework by applying the real data generated from the discrete process in secondary cell battery manufacturing. Findings This paper deals with challenges to apply the full potential of modeling and simulation within CPPS(Cyber-Physical Production System) and Smart Factory implementation. The framework is being applied in one of the most advanced and complex industrial sectors like semiconductor, display, and automotive industry.

• Clean Technology
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• v.4 no.1
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• pp.6-23
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• 1998

Recently, semiconductor industry has grown rapidly because of the large demand for electronic devices and equipment. The semiconductor industries have also played an important role on the economic growth in Korea. As the environmental regulations become strict, the proper environmental management and the well-developed waste minimization technologies in semiconductor industries are two of urgent problems to be solved. The semiconductor manufacturing process consists of a series of continuous chemical processes, such as cleaning, oxidation, diffusion, photolithography, etching and film deposition. During the processes, various environmentally hazardous wastes are produced. The wastes may be classified as wastewater, gaseous pollutants, and solid wastes. For waste minimization, the substitution of raw materials and process optimization techniques are used, while the selective destruction technologies of toxic chemicals contained in the wastes have been reported. Also, new technologies have been developed for source reduction and waste reduction, such as reduction of toxic chemical use and substitution of hazardous liquids with gaseous reactants or solvent.

• The Journal of the Korea institute of electronic communication sciences
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• v.15 no.3
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• pp.389-396
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• 2020

In order to obtain a good quality product, a proper verification of production/test facilities must be preceded before the quality conformity inspection of the product. Among the various production/test facilities, ATE is widely used in the civilian industry such as the automotive industry, aerospace industry, semiconductor industry today. In addition, ATE is actively used in the defense industry production and performance tests. This paper is the result of systematically verifying the Design Conformance of ATS which is ATE of military FM radio set using various methods. And It is expected to be a good reference at the present time when the design conformity verification procedure for ATE for military supplies is not documented.