• 한국안전학회지
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• 제38권3호
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• pp.27-34
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• 2023

With the technological development of the semiconductor industry, the roles of electrical and thermal energy supply and control of semiconductor equipment in ultrafine processes have become very important. However, instances of electrical fires in the chiller heater, which is used for cooling in the semiconductor manufacturing process, are increasing. A fire occurs in combustibles due to high heat at the connection part of the chiller heater, that is, when the number of electrical wires in the connection part is reduced or when the wires are completely disconnected. In this study, the temperature characteristics were compared and analyzed through experiments and 3D simulations. The number of electrical wires, which is the connection part of the chiller heater, was reduced by 90%, 50%, 30%, 10%, and 5%, and the wires were completely disconnected. When the number of electrical wires was reduced by 5%, heat of up to 80℃ was generated, which is a relatively high temperature but insufficient to cause a fire in combustibles. Complete disconnection occurred due to the vibration of the motor and other components, and sparks and arcs were generated, resulting in a rapid increase in temperature to up to 680℃. When completely disconnected, the temperature increase was sufficient to cause a fire in the combustibles covering the terminal block. Therefore, in this study, the causes of electrical fires in chiller heaters were investigated and preventive measures were proposed by analyzing abnormal signals and thermal characteristics caused by the electrical wiring being reduced and completely disconnected.

• 한국안전학회지
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• 제15권4호
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• pp.62-68
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• 2000

Static electricity in electronics manufacturing plants causes the economic loss, yet it is one of the least understood and least recognized effects haunting the industry today. Today's challenge in semiconductor devices is to achieve greater functional density pattern and to miniaturize electronic systems of being more fragile by electrostatic discharges(ESD) phenomena. As the use of automatic handling equipment for static-sensitive semiconductor components is rapidly increased, most manufacturers need to be more alert to the problem of ESD. One of the most common causes of electrostatic damage is the direct transfer of electrostatic charge from the human body or a charged material to the static-sensitive devices. To evaluate the ESD hazards by charged human body and devices, in this paper, characteristics of electrostatic attenuation in domestic semiconductor devices is investigated and the voltage to cause electronic component failures is investigated by field-induced charged device model(FCDM) tester. The FCDM simulator provides a fast and inexpensive test that faithfully represents ESD hazards in plants. Also the results obtained in this paper can be used for the prevention of semiconductor failure from ESD hazards.

• Journal of Information Processing Systems
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• 제10권3호
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• pp.429-442
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• 2014

In this paper, we investigated the use of seasonal autoregressive integrated moving average (SARIMA) time series models for fault detection in semiconductor etch equipment data. The derivative dynamic time warping algorithm was employed for the synchronization of data. The models were generated using a set of data from healthy runs, and the established models were compared with the experimental runs to find the faulty runs. It has been shown that the SARIMA modeling for this data can detect faults in the etch tool data from the semiconductor industry with an accuracy of 80% and 90% using the parameter-wise error computation and the step-wise error computation, respectively. We found that SARIMA is useful to detect incipient faults in semiconductor fabrication.

• 반도체디스플레이기술학회지
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• 제9권4호
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• pp.71-76
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• 2010

According to recent changes in industry for semiconductor devices, a low-temperature treatment has become a necessity. These changes relate to size refinement and the development of new materials. While variation in cooling efficiency does not affect the yield when using a high-temperature treatment, uniform cooling efficiency is necessary avoid "inconsistencies/bends" in low temperature treatments. However it is difficult to increase temperature stabilization in low temperature treatments. In this paper, using CFD (Computer Fluid Dynamics), we analyze and manipulate the design and input of the low-temperature system to attempt to control for temperature variations within the quartz tube, of which airflow appears to be a predominant factor. This simulation includes variable inputs such as airflow rate, head pressure, and design manipulations in the S.C.U. (Super Cooling Unit).

• 한국산학기술학회논문지
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• 제13권6호
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• pp.2472-2478
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• 2012

본 연구는 반도체 산업에서 반도체장비 유지보수에 사용되어지는 반도체장비 유지보수 분야의 전문기술인력을 효과적으로 양성할 수 있는 반도체장비 유지보수의 자격종목을 개발하고자 하는데 그 목적이 있다. 연구의 목적을 달성하기 위하여 반도체장비 유지보수 분야의 국내외 실태 조사, 문헌조사를 통하여 반도체장비 유지보수 관련 교육훈련기관 및 검정 수요 예상 인력을 파악했으며, 유사자격제도(전자부품장착기능사, 전자부품장착산업기사, 생산자동화기능사, 생산자동화산업기사)를 분석하였고, 직무분석을 통하여 반도체장비유지보수기능사의 직무 및 교육내용을 분석하였다. 또한 반도체장비 유지보수 자격종목 신설에 대한 설문조사를 실시했으며, 반도체장비유지보수기능사 자격종목의 출제기준 및 채점 방법을 제시했고, 필기시험과 실기시험에 대한 모의 검정시험도 실시하였다. 이러한 결과를 토대로 반도체장비유지보수기능사에 대한 교육프로그램을 만들었으며, 자격검정을 실시할 수 있는 출제기준을 제시하였다.

• 한국산업보건학회지
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• 제25권3호
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• pp.294-300
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• 2015

Objectives: The aim of this study is to identify physicochemical properties such as chemical composition, size, shape and crystal structure of powder byproducts generated from a metallization process and its 1st scrubber in the semiconductor industry. Methods: Powder samples were collected from inner chambers during maintenance of the W-plug process equipment (using tungsten hexafluoride as a precursor material) and its 1st scrubber. The chemical composition, size and shape of the powder particles were determined by field emission scanning electron microscopy (SEM) and transmission electron microscopy (TEM) equipped with an energy dispersive spectroscope (EDS). The crystal structure of the powders was analyzed by X-ray diffraction (XRD). Results: From the SEM-EDS and TEM-EDS analyses, O and W were mainly detected, which indicates the powder byproducts are tungsten trioxide ($WO_3$), whereas Al, F and Ti were detected as low peaks. The powder particles were spherical and nearly spherical, and the particle size collected from the process equipment and its 1st scrubber showed 10-20 nm (agglomerates: 55-90 nm) and 16-20 nm (agglomerates: 80-120 nm) as primary particles, respectively. The XRD patterns of the yellow powder byproducts exhibit five peaks at $23.8^{\circ}$ $33.9^{\circ}$ $41.74^{\circ}$ $48.86^{\circ}$ and $54.78^{\circ}$ which correspond to the (200), (220), (222), (400), and (420) planes of cubic $WO_3$. Conclusions: We elucidated the physicochemical characteristics of the powder byproducts collected from W-plug process equipment and its 1st scrubber. This study should provide useful information for the development of alternative strategies to improve the working environment and workers' health.

• 지식경영연구
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• 제3권2호
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• pp.49-70
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• 2002

The purpose of this study is to investigate the process and its influencing factors of technological capability building in a small and medium-sized capital goods sector. This paper first reviews the influencing factors of accumulating technological capability-technology trajectory, technology sources, technological capability, technological learning, technology strategy, and entrepreneurship. The paper then presents the integrative model of technological capability building. The experience of Mirae Corporation, the first generation of venture company in Korea, is also discussed as a case in point to analyse the process of technological capability building in a small and medium-sized capital goods company. Finally, the implications and limitations of the study arc discussed.

• 반도체디스플레이기술학회지
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• 제10권4호
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• pp.15-20
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• 2011

The lithography system installed inside precision industry's (e.g. TFT-LCD) production factories are increasing in size, thereby increasing its dynamic load along with it. Such condition causes vibration within the area where the system is installed, which then negatively affects the production line to produce defective products. To prevent this type of situation, the facilities should adopt dynamic design that considers the lithography system's dynamic load. This study predicts the maximum value allowed for dynamic stiffness (which is a ratio of vibration response against a single unit of the dynamic load) of the lithography system and explains the result of its application on actual structures inside the facilities.

• 반도체디스플레이기술학회지
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• 제10권2호
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• pp.1-5
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• 2011

In recent years, worldwide production of solar wafers increased rapidly. Therefore, the solar wafer technology in the developed countries already has become an industry, and related industries such as solar wafer manufacturing equipment have developed rapidly. In this paper we propose the color classification method of the polycrystalline solar wafer that needed in manufacturing equipment. The solar wafer produced in the manufacturing process does not have a uniform color. Therefore, the solar wafer panels made with insensitive color uniformity will fall off the aesthetics. Gaussian mixture models (GMM) are among the most statistically mature methods for clustering and we use the Gaussian mixture models for the classification of the polycrystalline solar wafers. In addition, we compare the performance of the color feature vector from various color space for color classification. Experimental results show that the feature vector from YCbCr color space has the most efficient performance and the correct classification rate is 97.4%.

• 반도체디스플레이기술학회지
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• 제17권4호
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• pp.51-55
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• 2018

As the OLED industry develops, display equipment is becoming larger. As a result, the stage required for display equipment is getting bigger. This enlargement led to increase in OLED production and industrial development. However, due to the large scale of the stage, other problems due to overheating and overheating caused by heavy load on the linear motor, which is mainly used in the stage, must be solved. In this study, a linear motor equipped with a cooling channel is modeled and the three - dimensional heat conduction flow analysis for this model is simulated using Fluent to analyze the cooling efficiency and cooling efficiency according to the cooling water flow rate. As a result, the cooling channel was effective and the cooling effect and efficiency were the best when the flow rate was about 5 ~ 10 L./min. In addition, the cooling effect is increased when the flow rate is increased, but the efficiency is significantly lowered when the flow rate is more than the predetermined value.