• 제목/요약/키워드: semiconductor and LCD

검색결과 190건 처리시간 0.026초

기류방출형 연X선 조사에 의한 정전기 제거 장치에 관한 연구 (A Study on the Removal of Electrostatic using Transmitted Ions Generated Soft X-ray with Compressed Air)

  • 귄승열;이동훈;최재욱;서민석
    • 한국안전학회지
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    • 제25권1호
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    • pp.27-31
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    • 2010
  • It is a well known fact that the LCD and Semiconductor Devices are a central part of IT industry which is important in the present and the future. But the biggest problem of Semiconductor and LCD manufacturing is maintaining a cleaning room environment. For this reason, the soft X-ray type Ionizer was used as the electrostatic reducer device, which protects damage of the product against electrostatic discharge in the manufacturing process. Therefore it is a essential important factor during Semiconductor and LCD production process. But the soft X-ray has a intrinsic problem with harmful to human being in case of soft X-ray exposure. That's reason we have the research to solve above problem and made an apparatus that it was covered with shielding structure to protect X-ray radiation to outside. And besides, it has a possibility to eliminate the charged electrostatic in the narrow space through the slot for Ion emissions with dual soft X-ray sources on the both side. It is also not make the particles from itself when it has been operated.

Effects of Process Induced Damages on Organic Gate Dielectrics of Organic Thin-Film Transistors

  • Kim, Doo-Hyun;Kim, D.W.;Kim, K.S.;Moon, J.S.;KIM, H.J.;Kim, D.C.;Oh, K.S.;Lee, B.J.;You, S.J.;Choi, S.W.;Park, Y.C.;Kim, B.S.;Shin, J.H.;Kim, Y.M.;Shin, S.S.;Hong, Mun-Pyo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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    • pp.1220-1224
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    • 2007
  • The effects of plasma damages to the organic thin film transistor (OTFT) during the fabrication process are investigated; metal deposition process on the organic gate insulator by plasma sputtering mainly generates the process induced damages of bottom contact structured OTFTs. For this study, various deposition methods (thermal evaporation, plasma sputtering, and neutral beam based sputtering) and metals (gold and Indium-Tin Oxide) have been tested for their damage effects onto the Poly 4-vinylphenol(PVP) layer surface as an organic gate insulator. The surface damages are estimated by measuring surface energies and grain shapes of organic semiconductor on the gate insulator. Unlike thermal evaporation and neutral beam based sputtering, conventional plasma sputtering process induces serious damages onto the organic surface as increasing surface energy, decreasing grain sizes, and degrading TFT performance.

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선형전동기를 적용한 LCD 패널 자동반송용 순환궤도차량 시스템 개발 (Development of OHS System Driven by Linear Motor for Automatic Transfer of LCD Panels)

  • 김원곤;윤종보;박건우;황계호
    • 반도체디스플레이기술학회지
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    • 제7권3호
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    • pp.11-16
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    • 2008
  • The authors investigated an overhead shuttle (OHS) system for automatic transferring the liquid crystal display (LCD) panels. The constructed tracks of OHS system include the linear and curve regions and have been installed on the ceiling to transfer the cassette of LCD glass along the closed-loop and open-loop tracks. In this study, the OHS system was implemented by a proposed linear motor to solve encoder installation and the system cost problems of the long distance transfer system. In addition, we utilized a new algorithm of the position detection and a new control algorithm for driving linear motor. The newly developed control algorithm was demonstrated from both a computer simulation and an experimentation, indicating that the highly reliable and speedy transfer system can enhance the LCD panel productivity of commercial OHS system.

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Liquid Crystal Mixtures of High Response Time and High $T_{NI}$ for LCD-TV Application

  • Ban, Byeong-Seob;Kim, Bong-Hee;Seo, Bong-Sung;Yun, Yong-Kuk;Sakong, Dong-Sik;Chung, Kyu-Ha;Kim, Yong-Bae
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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    • pp.498-499
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    • 2002
  • In In order to develop liquid crystal mixtures of high response time and high nematic-isotropic transition temperature ($T_{NI}$) for LCD-TV application, novel liquid crystal molecules with a fluoro-isothiocyanate moiety were synthesized. They showed remarkably high $T_{NI}$ over 200 $^{\circ}C$, wide mesophase range of 170 $^{\circ}C$, high dielectric anisotropy of 14 and high optical anisotropy of 0.19. New LC Mixtures of the high $T_{NI}$ ($85{\sim}100 ^{\circ}C$) and fast response time ($8{\sim}10ms$) were blended with the novel fluoro-isothiocyanate containing LC molecules, phenylcyclohexanes, bicyclohexanes and ester compounds. It was also studied on optimum pitch of liquid crystal for high speed twisted nematic LCD-TV applicaton. The LC mixtures show a fast speed of the below one frame rate in real 17" TV panel.

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Liquid Crystal Mixtures of High Response Time and High $T_{NI}$ for LCD-TV Application

  • Ban, Byeong-Seob;Kim, Bong-Hee;Seo, Bong-Sung;Yun, Yong-Kuk;Sakong, Dong-Sik;Chung, Kyu-Ha;Kim, Yong-Bae
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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    • pp.413-414
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    • 2002
  • In In order to develop liquid crystal mixtures of high response time and high nematic-isotropic transition temperature ($T_{NI}$) for LCD-TV application, novel liquid crystal molecules with a fluoroisothiocyanate moiety were synthesized. They showed remarkably high $T_{NI}$ over 200 $^{\circ}C$, wide mesophase range of 170 $^{\circ}C$, high dielectric anisotropy of 14 and high optical anisotropy of 0.19. New LC Mixtures of the high $T_{NI}$ (85${\sim}$100 $^{\circ}C$) and fast response time (8${\sim}$10ms) were blended with the novel fluoroisothiocyanate containing LC molecules, phenylcyclohexanes, bicyclohexanes and ester compounds. It was also studied on optimum pitch of liquid crystal for high speed twisted nematic LCD-TV applicaton. The LC mixtures show a fast speed of the below one frame rate in real 17" TV panel.

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TFT LCD 용 Power Inductor Full Automation Winding/Welding System 개발

  • 이우영;진경복;김경수
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2004년도 춘계학술대회 발표 논문집
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    • pp.154-158
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    • 2004
  • Power inductor is usually used in the field of the power circuit of a cellular phone, TFT LCD module etc.. This paper presents the development process of Power Inductor Full Automation Winding/Welding System for TFT LCD. This process, the process algorithm, high precision welding current control, design of welding head, high speed, high precision feeding mechanism, and user interface process control program technologies are included.

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면광원을 사용한 Scanning Backlight System의 설계 및 제작 (Design and Fabrication of Scanning Backlight System using Flat Fluorescent Lamp)

  • 채형준;허정욱;황선남;이준영;임성규
    • 반도체디스플레이기술학회지
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    • 제7권2호
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    • pp.29-33
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    • 2008
  • LCD panels are increasingly used to show moving image material, for example in LCD television sets. However, moving images become blurred on LCD panels. One of the causes of motion blur is the slow reaction of LC(liquid crystal) cell to change in the pixel value. Another cause of motion blur is the hold-type characteristic of the LCD panel, during the frame time the image is shown continuously. This type of motion blur can be reduced with a scanning backlight. We have designed and fabricated a scanning backlight system that solves the hold-type characteristic problem in a way that Flat fluorescent lamp divided 6 blocks was scanned 60Hz.

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TFT LCD 자동생산시스템에서 Data 통신 및 응용 (Data Communications and their Applications in the Automated TFT LCD Manufacturing System)

  • 조민호
    • 산업공학
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    • 제9권3호
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    • pp.225-235
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    • 1996
  • The SECS Ⅰ and Ⅱ Protocol has been widely used for the TFT LCD and semiconductor industry. This paper shows how the SECS protocol is implemented for data communications between the Host (CAM) and the TFT LCD equipments. In addition, this study introduces a way to apply the SECS protocol to the manufacturing systems control. It provides better throughput in terms of production and faster control of the automated TFT LCD manufacturing system by way of shortcut and distribution of control and data communications. The SECS protocol is successfully used for the control of the real TFT LCD manufacturing system.

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반도체 및 LCD 제조 공정의 AGV Controller 개발 (Development of an AGV Controller in Semiconductor and LCD Production Systems)

  • 서정대;장재진;구평회
    • 대한산업공학회지
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    • 제29권1호
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    • pp.1-13
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    • 2003
  • In this paper, LAC(Look-ahead AGV Controller) has been developed for efficient routing of parts in semiconductor and LCD production systems. Several procedures have been developed as sub-modules. LACP(Look-ahead AGV Control Procedure) which controls AGVs using the information on the current and future status of the systems is the main element of the LAC. To support LACP, DSP(Destination Selection Procedure) which determines a destination of a part and AGV call time, SSP(Source Selection Procedure)which selects a part coming next to a buffer when the buffer becomes available. and RTM(Response Time Model) which estimates empty travel time of AGVs and waiting time for an available AGV have been developed. A simulation experiment shows that LAC reduces part's flow time, AGV utilization, average and maximum inventory level of a central buffer, empty travel time of an AGV, and waiting time for an available AGV.

정밀산업(TFT-LCD) 공장 내 노광장치의 대형 세대별 동강성 허용규제치 예측 및 평가에 관한 연구 (A Study on How to Predict and Evaluate the Dynamic Stiffness Criteria of Exposure Equipment in Precision Industrial Factory(TFT-LCD))

  • 백재호;전종균;박상곤
    • 반도체디스플레이기술학회지
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    • 제10권4호
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    • pp.15-20
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    • 2011
  • The lithography system installed inside precision industry's (e.g. TFT-LCD) production factories are increasing in size, thereby increasing its dynamic load along with it. Such condition causes vibration within the area where the system is installed, which then negatively affects the production line to produce defective products. To prevent this type of situation, the facilities should adopt dynamic design that considers the lithography system's dynamic load. This study predicts the maximum value allowed for dynamic stiffness (which is a ratio of vibration response against a single unit of the dynamic load) of the lithography system and explains the result of its application on actual structures inside the facilities.