• 한국산업융합학회 논문집
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• 제27권1호
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• pp.17-24
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• 2024

Recently, retail technology has been developed by the rapid evolution of e-commerce and a representative example is ESL technology. In this study, we investigate ESL technology, market status and forecasts, and analyze the competitive structure between relational companies. Market analysis refers to data from market reports of Marketsandmarkets and Research, and internet media. In ESL, the display field is predicted to account for 43% of the total market in 2026, and is converting from LCD to electronic paper. The segmented type is becoming more advanced into the full-graphic type, and CAGR of 18.7% for 3-7 inches and 20.6% for 7-10 inches is predicted. The demand for ESL is greatest in North America and Europe, but CAGR is the highest in the Asia-Pacific region at 19.1%. Since ESL technology has a lot of overlap with semiconductor and display technology, the Asia-Pacific region is relatively advantageous, and this has led to rapid growth of domestic companies. However, it is expected that competition from European companies that are actually owned by Chinese companies will increase in the future, so continuous technological development and new market development are necessary.

• 제어로봇시스템학회논문지
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• 제14권6호
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• pp.519-522
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• 2008

As industry of a semiconductor and LCD industry have been rapidly growing, precision technologies of machining such as etching and 3D measurement are required. Stylus has been important measuring method in traditional manufacturing process. However, its disadvantages are low measuring speed and damage possibility at contacting point. To overcome mentioned disadvantage, non-contacting measurement method is needed such as PMP(Phase Measuring Profilometry), WSI(white scanning interferometer) and Confocal Profilometry. Among above 3 well-known methods, WSI started to be applied to FPD(flat panel display) manufacturing process. Even though it overcomes 21t ambiguity of PMP method and can measure objects which has specular surface, the measuring speed and vibration coming from manufacturing machine are one of main issue to apply full automatic total inspection. In this study, We develop high speed WSI system and algorithm to reduce unknown noise. The developing WSI and algorithm are implemented to measure 3D surface of wafer. Experimental results revealed that the proposed system and algorithm are able to measure 3D surface profile of wafer with a good precision and high speed.

• 산업공학
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• 제20권3호
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• pp.288-297
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• 2007

Success of semiconductor/LCD industry depends on its yield and quality of product. For the purpose, FDC (Fault Detection and Classification) system is used to diagnose fault state in main manufacturing processes by monitoring time series data collected by equipment sensors which represent various conditions of the equipment. The data set is segmented at the start and end of each product lot processing by a trigger event module. However, in practice, segmented sensor data usually have the features of data asynchronization such as different start points, end points, and data lengths. Due to the asynchronization problem, false alarm (type I error) and missed alarm (type II error) occur frequently. In this paper, we propose a robust process fault detection system by integrating a process event detection method and a similarity measuring method based on dynamic time warping algorithm. An experiment shows that the proposed system is able to recognize abnormal condition correctly under the asynchronous data situation.

• 제어로봇시스템학회논문지
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• 제22권3호
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• pp.186-191
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• 2016

This paper addresses the development of 3D data acquisition system (3D scanner) based laser structured-light image. The 3D scanner consists of a stripe laser generator, a conventional camera, and a rotation table. The stripe laser onto an object has distortion according to 3D shape of an object. By analyzing the distortion of the laser stripe in a camera image, the scanner obtains a group of 3D point data of the object. A simple semiconductor stripe laser diode is adopted instead of an expensive LCD projector for complex structured-light pattern. The camera has an optical filter to remove illumination noise and improve the performance of the distance measurement. Experimental results show the 3D data acquisition performance of the scanner with less than 0.2mm measurement error in 2 minutes. It is possible to reconstruct a 3D shape of an object and to reproduce the object by a commercially available 3D printer.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2010년도 춘계학술발표대회
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• pp.19.1-19.1
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• 2010

The process of manufacturing printed electronics using printing technology is attracting attention because its process cost is lower than that of the conventional semiconductor process. This technology, which offers both a lower cost and higher productivity, can be applied in the production of organic TFT (thin film transistor), solar cell, RFID(radio frequency identification) tag, printed battery, E-paper, touch screen panel, black matrix for LCD(liquid crystal display), flexible display, and so forth. In general, in order to implement printed electronics, narrow width and gap printing, registration of multi-layer printing by several printing units, and printing accuracy of under $20\;{\mu}m$ are all required. These electronic products require high precision to the degree of tens of microns - in a large area with flexible material, and mass productivity at low cost. As such, the roll-to-roll printing process is attracting attention as a mass production system for these printed electronic devices. For the commercialization of this process, two basic electronic ink technologies, such as conductive ink and polymers, and printing equipment have to be developed. Therefore, this paper addressed basis design and test to develop fine patterning equipment employing the roll-to-roll printing equipment and electronic ink.

• 한국기계가공학회지
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• 제6권1호
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• pp.34-42
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• 2007

Powder blasting technique has been considered one of the most appropriate micro machining methods for hard and brittle materials, since the productivity is high and the heat layers caused by material removal are very thin. Recent development of special purposed parts, such as the parts for semiconductor processing, the parts for LCD, sensors for micro machine fabrication and so on, has been expanded. Thus, it is essential to develop powder blasting technologies for micromachining of hard and brittle materials such as glass, ceramics and so on. In this paper, the characteristics of powder blasted glass surface were tested under various blasting parameters. Finally, we proposed a predictive model for powder blasting process using the neural network and the response surface method. Detail analysis of the simulation results is carried out and the performance of two predictive models is compared.

• 한국유체기계학회 논문집
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• 제17권4호
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• pp.76-80
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• 2014

PFA fluoropolymer lined technology revolutionized ball valve development and design decades ago and continues to be pivotal for many products and valve solutions in diverse industries and applications, such as chemical process, semiconductor/LCD manufacturing processes, pharmaceutical and others. Because of the extreme operating conditions such as high-temperature (${\sim}120^{\circ}C$) and high-pressure (~10 bar), the reliability of the valve is very important for minimizing in-line leakage and fugitive emissions of strong corrosive chemicals (hydrochloric acid, hydrofluoric acid, nitric acid, etc.) transported through the lines. In this study, we investigated the flow characteristics with flow coefficient in a PFA lined ball valve for different opening degrees using CFD analyses. The results should be the guidance for a new PFA lined ball valve design that will incorporate all the acclaimed and demonstrated benefits of the current design approaches.

• Journal of Information Display
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• 제13권3호
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• pp.113-118
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• 2012

Metal oxide semiconductors were considered promising materials as backplanes of future displays. Moreover, the adoption of carrier-suppressing metal into indium-zinc oxide (IZO) has become one of the most important themes in the metal oxide research field. In this paper, efforts to realize and optimize IZO with diverse types of carrier suppressors are summarized. Properties such as the band gap of metal in the oxidized form and its electronegativity were examined to confirm their relationship with the metal's carrier-suppressing ability. It was concluded that those two properties could be used as indicators of the carrier-suppressing ability of a material. As predicted by the properties, the alkali earth metals and early transition metals used in the research effectively suppressed the carrier and optimized the electrical properties of the metal oxide semiconductors. With the carrier-suppressing metals, IZO-based thin-film transistors with high (above $1cm^2/V{\cdot}s$) mobility, a lower than 0.6V/dec sub-threshold gate swing, and an over $3{\times}10^6$ on-to-off current ratio could be achieved.

• 한국인쇄학회지
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• 제28권1호
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• pp.51-63
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• 2010

Ink-jet is part of the non impact printing that shooting the ink drop from the nozzle to paper. It is very silence and express good color. There are two types of printing that continuous and drop on demand. But drop on demand process is becoming the mainstream. these days, LCD, PDP is passed more than semiconductor industry. And we expect organic EL, FED as a next display. But product equipment, main component and technology have a gap between an advanced country and us nevertheless physical development. Expecially, previous process part is depended on imports. Ink-jet printing technology that there isn't complicated photo lithography process is attracted, so ink-jet printing resolution is more embossed. But there were not many of ink-jet resolution thesis but ink-jet head or nozzle. Because, to out of the ink from the nozzle is unseeable and hard to experiment. Therefore this thesis was experimented and simulated how can ink-jet printer improved resolution by flow-3d simulation package program.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.375-375
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• 2014

Layered semiconductor materials can be a promising candidate for large-area thin film transistors (TFTs) due to their relatively high mobility, low-power switching, mechanically flexibility, optically transparency, and amenability to a low-cost, large-area growth technique like thermal chemical vapor deposition (CVD). Unlike 2D graphene, series of transition metal dichalcogenides (TMDCs), $MX_2$ (M=Ta, Mo, W, X=S, Se, Te), have a finite bandgap (1~2 eV), which makes them highly attractive for electronics switching devices. Recently, 2D $MoS_2$ materials can be expected as next generation high-mobility thin-film transistors for OLED and LCD backplane. In this paper, we investigate in detail the electrical characteristics of 2D layered $MoS_2$ local bottom-gated transistor with the same device structure of the conventional thin film transistor, and expect the feasibility of display application.