• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.03a
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• pp.143-147
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• 1998

As the accuracy of manufactured goods needed high-accuracy processing has made the efficiency of NC and measurment technology develop, the innovation of machine tools has influence the development of the semi-conductor and optical technology. We can mention that a traction role of the acceleration for the development like that depends on the development of the measurement technics - Stylus instrument method, STM, SEM, Laser interferometer method - which are used for measuring the movement accuracy of machine tools. The movement error factors in movement accuracy are expressed as yaw, roll, and pitch etc. Machining center has 21 movement error factors including of 3 axies joint errors because that has 3 axies and has been measured as the standard of the unloaded condition until now inspite of getting static, dynamic, and servo-gain errors in the case of expending the error range. Therefore, this study tries to measure position accuracy according to loading on the X-Y table of the machining center.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.289-296
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• 1999

The integration of the LSI has been greatly improved and the circuit patters on the LSI are becoming finer line and pitch. The high-density electronic packaging technology is improved. In order to realize the high-density packaging technology, the density of the circuit wiring of the printed circuit boards have also been more dense. The build-up process multilayer printed circuit board technology have a lot of vias, possibilities of the finer conductor wirings and have a freedom of capabilities of wiring design. The build-up process printed circuit boards have the wiring rules which are the pattern width: $100-20\mu\textrm{m}$, the via hole diameter: $100-50\mu\textrm{m}$. There three kinds of build-up processes as far materials and hole drilling. In this paper, the recent technology trends of the build-up printed circuit board technologies are described.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.1-5
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• 2019

This study has been focused on properties of surface technology for large diameter upper electrode using in high density plasma process as like semi-conductor manufacturing process. The experimental studies have been carried out to get mirror surface for upper electrode. For a formation of high surface quality upper electrode, single crystal silicon upper electrode has been mechanical and chemical machining worked. Mechanical machining work of the upper electrode is carried out with varying mesh type using diamond wheel. In case of chemical machining work, upper electrode surface roughness was observed to be strongly dependent upon the etchant. The different surface roughness characteristics were observed according to etchant. The machining result of the surface roughness and surface morphology have been analyzed by use of surface roughness tester, laser microscope and ICP-MS.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.738-742
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• 2005

Rapid Prototype has been used to design and Production of part in a variety of fields ; Car, Electronic products, Aviation, Heavy industry etc. Moreover development of hardware gave rise to use the method of Rapid Prototype more and more at high precision and complicated shapes. Expecially, to be using process of products that shapes of Micro-hole ; Cellular phones, Antennas, Jewels, Semi conductor cases. In case of Micro-shape, precision of the shape turns on various condition ; Laser size, Laminate height, scanning speed, overcure, viscosity of resin, etc. Sometimes breaks out the case that interner hole of shape is blocked by viscosity of resin. The phenomenon has solved easily to reduce viscosity of resin. But, in case of the method brings about the problem that strength goes down in actuality products hardening. This study on verify to change of shape of Micro-hole and makes the semiconductor case which has shape of Micro-hole by using resin of higher viscosity, scanning speed and overcure

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.4
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• pp.44-48
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• 2006

Recently, demand the ultra precision product which is increasing rapidly is used extensively frontier industry field such as semi-conductor, computer, aerospace, precision machine. Ultra precision processing is the portion that is very needed to NT in the field of mechanical engineering. The latest date, together with radical advancement of electronic and photonics industry, necessity of ultra precision processing is on the increase for the manufacture of various kernel parts those are connected with these industrial fields. Specially, require motion accuracy of high resolution of nm order in stroke of hundreds millimeters according as diameter of processing object great and processing accuracy rises. In this case ,the response speed absolute delay because inertial mass of moving part is very large. Therefore, real time motion error compensation becomes very hardly. In this paper, we used ultra precision cutting unit(UPCU) to cope such problem. a UPCU is designed and tested to obtain sub-micrometer from accuracy in diamond turning of flat surfaces. The thermal growth spindle error is compensated for real time using a UPCU driven by piezoelectric actuator along with a laser encoder displacement sensor.

• Proceedings of the Optical Society of Korea Conference
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• 2000.02a
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• pp.276.2-278
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• 2000

In a recent years, a number of approaches have been studied, including passive, active, and hybrid mode-locking of semi-conductor lasers for short pulse generation and research has been devoted to achieve low timing-jitter operation since the timing jitter is unfavorable for system applications. Among the methods of mode locking, passive mode locking does not need external rf drives, and therefore the operation and fabrication procedures are simplified. In spite of these attractive advantages of passive mode-locked laser, it has critical drawbacks such as large timing jitter and the difficulty in synchronization with external circuits. Their inherent large timing jitter value was shown to be suppressed to certain levels by means of hybrid mode-locking technique$^{(1)}$ , where the saturable absorber section was modulated by an external signal with the cavity round trip frequency. Furthermore, the subharmonic mode-locking (SHML) technique alleviates the restrictions of high speed driving electronics. It has been demonstrated experimentally$^{(1)}$ that the hybrid subharmonic mode-locking technique has lead to significant reduction of the timing jitter. (omitted)

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.6
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• pp.55-63
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• 1999

The acceleration of the performance of machine tools influences the development of the semi-conductor and optical technology as the development of NC and measurement technology. Because the measurement has been done to unload condition without considering of mechanical stiffness in the case of machining center as we measure the quasi-static error of machine tools on general study people who works on the spot has many problems on the data value. Also there are no satisfiable results until now in spite of many studys about this because the deflections of the table and the shaft supporting a workpiece influence, influence the accuracy of the table and shaft supporting a workpiece influence the accuracy of the workpiece. And there is doubt about the inspection method of measured error. In this paper Therefor we will help working more accurately on the spot by measuring analyzing displaying the defoec-tion of the table and support shaft when we load on the table and the support shaft of machining center using laser interfer-ometer. Also we try to settle new conception of the measurement method and more accurate grasp of the deflection tenden-cy by verifing the tendency of the error measured through the comparison of the simulated error measured through the comparison of the simulated error using ANSYS a common finite element analysis program which is able to measure heat deformation material deformation and error resulted from this study.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.46 no.1
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• pp.43-48
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• 2009

We constructed a simple wavelength readout system for a tunable fiber laser which was used for a fiber Bragg grating sensor array system. A quadrature sampling method was used to demodulate wavelength variations of the tunable laser which consisted of a SOA(semi-conductor optical amplifier) and a fiber-optic Fabry-Perot filter. Internal triggers, which have a 90 degree phase period, have been generated by using a double-pass Mach-Zehnder interferometer. From Lissajous plots with quadrature sampled data, a mean phase error of ${\sim}2.51$ mrad was obtained. From the wavelength readout experiments, an accurate and fast linear wavelength demodulation has been confirmed.

• Journal of the Korean Association of Oral and Maxillofacial Surgeons
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• v.26 no.5
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• pp.481-489
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• 2000

This research was focused on overall examination of tissue alteration, wound healing promotion. After the hair on the dorsal surface was shaved, $5{\times}5mm$ oval skin defect was formed. Experimental wounds of right side were irradiated on every day for 90 second with Ga-Al-As semi-conductor laser. Left side wounds served as control group. The rats were sacrificed on the 1st, 3rd, 5th, 7th, 14th, 21th day. For light microscopically, parafin section were stained with H&E, MT. The outcomes were as follows : 1. On 1st day, experimental and control group were seen acute inflammatory cell infiltration, edema. 2. On the 3rd days, both groups were seen crust development, collagen, blood vessel proliferation. 3. On the 5th days, experimental group were reduced edema and inflammatory cell infiltration than control group. 4. On the 7th days, both groups were observed edema, inflammatory cell infiltration disappearance and keratinocytes motility from wound defect. 5. On the 14th days, experimental group appeared collagen, blood vessel proliferation and hair follicle than control group. 6. On the 21th days, both groups were seen normal status re-epithelization. According to the above results, The wound-healing stimulated by laser radiation involves an increased rate of epithelial growth. LLLT was confirmed that it has fibroblast, blood vessel proliferation, influence initial wound healing process.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.434-438
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• 2003

The shearing process for the sheet metal is normally used in the precision elements such as semi-conductor components. In these precision elements, the burr formation brings a bad effect on the system assembly and demands the additional de-burring process. In this paper, we have developed the desktop-type precision punching system to investigate the burr formation mechanism and present kinematically Punch-die auto aligning methodology, for the purpose of burr unifomizing and minimizing, between the rectangular shaped punch and die. By using the scanning electron microscope, the aligned punching results are compared with the miss-aligned ones. Also, we measured the relative burr heights using the self-designed laser measuring device for insitu self aligning. Since it is hard to get the perfect, so called, burr-free edges during the shearing process, we introduced the ultrasonic do-burring machine. The de-burring operation was carried out by a novel do-burring method, the reversal flow resistance method, under different machining loads and abrasive types. The final do-burring results show the validity of our punching do-burring system pursuing the burr-free punched elements.