• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.8 no.2
• /
• pp.233-239
• /
• 1998

SiC thin films were deposited by chemical vapor deposition method using tetramethylsilane (TMS) and hexamethyldisilane (HMDS). The chamber pressure during the deposition was kept at about 1 torr. Precursor was transported to the reaction chamber by $H_2$gas and SiC deposition was carried out at the reaction temperature of $1200^{\circ}C$. Si-wafer masked with tantalum and MgO single crystal covered with platinum and molybdenum were used as substrates. The selectivity of SiC deposition was observed by comparing the microstructure between metal (Ta, Pt, and Mo) surfaces and substrate surfaces (Si and MgO). The deposited films were identified as the $\beta-SiC$ phase by X-ray diffraction pattern. Also, the deposition -behavior of SiC on each surface was investigated by the scanning electron microscope analysis.

• ETRI Journal
• /
• v.25 no.6
• /
• pp.503-509
• /
• 2003

Selective epitaxial growth (SEG) of silicon has attracted considerable attention for its good electrical properties and advantages in building microstructures in high-density devices. However, SEG problems, such as an unclear process window, selectivity loss, and nonuniformity have often made application difficult. In our study, we derived processing diagrams for SEG from thermodynamics on gas-phase reactions so that we could predict the SEG process zone for low pressure chemical vapor deposition. In addition, with the help of both the concept of the effective supersaturation ratio and three kinds of E-beam patterns, we evaluated and controlled selectivity loss and non-uniformity in SEG, which is affected by the loading effect. To optimize the SEG process, we propose two practical methods: One deals with cleaning the wafer, and the other involves inserting dummy active patterns into the wide insulator to prevent the silicon from nucleating.

• Journal of the Korean Vacuum Society
• /
• v.7 no.s1
• /
• pp.167-170
• /
• 1998

To apply diamond films in microelectromechanical systems(MEMS), it is necessary to develop the patterning technologies of diamond films in the micrometer scale. In this paper, three different kinds of technologies for patterning CVD diamond films carried out by us were demonstrated: selective growth by improved diamond nucleation in DC bias-enhanced microwave plasma chemical vapor deposition (MPCVD) system, selective growth of seeding using diamond-particle-mixed photoresist, and selective etching of oxygen ion beam using Al as the mask. It was show that high selectivity and precise patterns had been achieved, and all the processes were compatible with IC process.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2006.08a
• /
• pp.1229-1232
• /
• 2006

We have grown well-aligned carbon nanotube arrays on the selective areas by plasma enhanced chemical vapor deposition at the substrate temperature of $580\;^{\circ}C$. The selective areas for CNTs growth can be defined by photo lithography technology. The CNTs are uniformly grown on the areas regardless of island diameters. Electron emission currents were measured in a vacuum with a diode structure at room temperature. Uniform electron emission currents were achieved with $40\;{\mu}m$ island spacing with $5{\mu}m$ island diameter.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 1997.10a
• /
• pp.95-95
• /
• 1997

• Proceedings of the Optical Society of Korea Conference
• /
• 2006.07a
• /
• pp.151-152
• /
• 2006

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2010.11a
• /
• pp.401-402
• /
• 2010

• Current Photovoltaic Research
• /
• v.7 no.1
• /
• pp.9-14
• /
• 2019

Carrier selective solar cell structure has allured curiosity of photovoltaic researchers due to the use of wide band gap transition metal oxide (TMO). Distinctive p/n-type character, broad range of work functions (2 to 7 eV) and risk free fabrication of TMO has evolved new concept of heterojunction intrinsic thin layer (HIT) solar cell employing carrier selective layers such as $MoO_x$, $WO_x$, $V_2O_5$ and $TiO_2$ replacing the doped a-Si layers on either front side or back side. The p/n-doped hydrogenated amorphous silicon (a-Si:H) layers are deposited by Plasma-Enhanced Chemical Vapor Deposition (PECVD), which includes the flammable and toxic boron/phosphorous gas precursors. Due to this, carrier selective TMO is gaining popularity as analternative risk-free material in place of conventional a-Si:H. In this work hole selective materials such as $MoO_x$, $WO_x$ and $V_2O_5$has been investigated. Recently $MoO_x$, $WO_x$ & $V_2O_5$ hetero-structures showed conversion efficiency of 22.5%, 12.6% & 15.7% respectively at temperature below $200^{\circ}C$. In this work a concise review on few important aspects of the hole selective material solar cell such as historical developments, device structure, fabrication, factors effecting cell performance and dependency on temperature has been reported.

• 한국신재생에너지학회:학술대회논문집
• /
• 2011.05a
• /
• pp.121.2-121.2
• /
• 2011

Aluminum-doped Zinc Oxide (AZO) is considered as an excellent candidate to replace Indium Tin Oxide (ITO), which is widely used as transparent conductive oxide (TCO) for electronic devices such as liquid crystal displays (LCDs), organic light emitting diodes (OLEDs) and organic solar cells (OSCs). In the present study, AZO thin film was applied to the transparent electrode of a channel-shaped flexible organic solar cell using a low-temperature selective-area atomic layer deposition (ALD) process. AZO thin films were deposited on Poly-Ethylene-Naphthalate (PEN) substrates with Di-Ethyl-Zinc (DEZ) and Tri-Methyl-Aluminum (TMA) as precursors and $H_2O$ as an oxidant for the atomic layer deposition at the deposition temperature of $130^{\circ}C$. The pulse time of TMA, DEZ and $H_2O$, and purge time were 0.1 second and 20 second, respectively. The electrical and optical properties of the AZO films were characterized as a function of film thickness. The 300 nm-thick AZO film grown on a PEN substrate exhibited sheet resistance of $87{\Omega}$/square and optical transmittance of 84.3% at a wavelength between 400 and 800 nm.

• Proceedings of the Korean Magnestics Society Conference
• /
• 2010.06a
• /
• pp.70-71
• /
• 2010

In this study, We fabricated FePt-based perpendicular patterned media using a selective combination of E-beam lithography and either Ar plasma etching (deposition-first process) or FePt lift-off (deposition-last process). We employed the deposition-last process to avoid chemical and structural disordering by impinging Ar ions (deposition-first process). For a patterned medium with 100 nm patterns made by this process, the out-of-plane coercivity was measured to be 5 fold larger than its in-plane value. The deposition-last process may be a promising way to achieve ultra-high density patterned media.