• Journal of the Korean Society for Precision Engineering
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• v.31 no.5
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• pp.441-449
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• 2014

Thermoplastic fusion bonding is widely used to seal polymer microfluidic devices and optimal bonding protocol is required to obtain a successful bonding, strong bonding force without channel deformation. Besides, UV modification of the PMMA (poly-methyl methacrylate) is commonly used for chemical or biological application before the bonding process. However, study of thermal bonding for the UV modified PMMA was not reported yet. Unlike pristine PMMA, the optimal bonding parameters of the UV modified PMMA were $103^{\circ}C$, 71 kPa, and 35 minutes. A very low aspect ratio micro channel (AR=1:100, $20{\mu}m$ depth and $2000{\mu}m$ width) was successfully bonded (over 95%, n>100). Moreover, thermal bonding of multi stack PMMA chips was successfully demonstrated in this study. The results may applicable to fabricate a complex 3 dimensional microchannel networks.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.11-15
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• 2010

In this paper, we focused on the optimization of bonding conditions for the successful thermo-compression bonding of electrodes between the RPCB and FPCB with Sn-Pb solder. The peel strength was proportionally affected by the bonding conditions, such as pressure, temperature, and time. In order to figure out an optimized bonding condition, fracture energies were calculated through F-x (force-displacement) curves in the peel test. The optimum condition for the thermo-compression bonding of electrodes between the RPCB and FPCB was found to be temperature of $225^{\circ}C$ and time of 7 s, and its peel strength was 22 N/cm.

• Journal of the Korean Society of Industry Convergence
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• v.17 no.4
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• pp.194-202
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• 2014

Bonding Machine is new concept of semi industry. In this study, bonding machine is designed with aximatic design, then manufactured based on it. Axiomatic design offers a scientific base for design in an efficient way. Many application of the independence axiom have been pulished, however, the information axiom has been mainly applied to FR - DP problems except for few case studies.

• Steel and Composite Structures
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• v.19 no.3
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• pp.735-757
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• 2015

Composite bonding steel plate (CBSP) is a newly developed type of structure strengthened technique applicable to the existing RC beam. This composite structure is applicable to strengthening the existing beam bearing high load. The strengthened beam consists of two layers of epoxy bonding prestressed steel plates and the RC beam sandwiched in between. The bonding enclosed and prestressed U-shaped steel jackets are applied at the beam sides. This technique is adopted in case of structures with high longitudinal reinforcing bar ratio and impracticable unloading. The prestress can be generated on the strengthening steel plates and jackets by using the CBSP technique before loading. The test results of full-scale CBSP strengthened beams show that the strength and stiffness are enhanced without reduction of their ductility. It is demonstrated that the strain hysteresis effect can be effectively overcome after prestressing on the steel plates by using such technique. The applied plates and jackets can jointly behave together with the existing beam under the action of epoxy bonding and the mechanical anchorage of the steel jackets. The simplified formulas are proposed to calculate the prestress and the ultimate capacities of strengthened beams. The accuracy of formulas was verified with the experimental results.

• The Journal of Korean Academy of Prosthodontics
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• v.38 no.3
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• pp.328-335
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• 2000

Statement of the problem. Recently an innovative method of fabricating indirect restorations by gold electroforming has been developed. But the bond quality and strength of the gold coping to the porcelain is uncertain. Purpose of study. The purpose of this study is to analyze and evaluate the electroformed gold surface for mechanical bonding between the gold and the ceramic veneering. Methods/material. Electroformed disks were made using electroforming technique. And the surface of the electroformed coping was analyzed after sandblasting, heat-treatment, bonding agent application, opaque porcelain firing with scanning electron microscopy and energy dispersive x-ray analysis. Results. In the analysis with SEM, Sandblasting made the sharp edges and undercuts on the electroformed surface, and after bonding agent application, net-like structure were created on the electroformed surface. In the energy dispersive x-ray analysis it is confirmed that electroformed surface contains some impurities. Conclusion. With the use of sandblasting and bonding agent, electroformed surface seems to be enough to bond with veneering porcelain.

• Journal of Sensor Science and Technology
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• v.8 no.1
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• pp.89-94
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• 1999

In this study, a new technology to bond the PZT with connection board, which is a core technology for the fabrication of medical micro high frequency sensors, was developed. Two technologies were adopted. One is bonding of In using thermal heating, he other is bonding of Pb using a high frequency heating machine. In case of thermal eating, bonding was failed because of the contaminations of In surface. But, when using high frequency healing machine, we developed good bonding characteristics at various experimental conditions and thickness of the electrode material.

• International Journal of Automotive Technology
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• v.7 no.5
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• pp.565-570
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• 2006

The development of a light-weight vehicle is in great demand for enhancement of fule efficiency and dynamic performance. The vehicle weight can be reduced effectively by using lightweight materials such as aluminum and magnesium. However, if such materials are used in vehicles, there are often instances when different materials such as aluminum and steel need to be joined to each other. The conventional joining method, namely resistance spot welding, cannot be used in joining different materials. Self-piercing rivet(SPR) and adhesive bonding, however, are good alternatives to resistance spot welding. This paper is concerned with the crushing test of double hat-shaped member made by resistance spot welding, SPR and adhesive bonding. Various parameters of crashworthiness are analyzed and evaluated. Based on these results, the applicability of SPR and adhesive bonding are proposed as an alternative to resistance spot welding.

• Bulletin of the Korean Chemical Society
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• v.25 no.8
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• pp.1161-1164
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• 2004

Calculations are presented for phenol ?acetonitrile - $(water)_n$ (n = 1-3) clusters. We examine the nature of interactions in the mixed clusters by calculating and comparing the structures, relative energies and harmonic frequencies of isomers with different type of hydrogen bonding. The conformers exhibit quite different patterns in the shifts of the CN and OH stretching frequencies, depending on the type of hydrogen bonding. Cyclic hydrogen bonding among the water molecule(s), acetonitrile and phenolic OH proves very important in determining the relative stability. It is also shown that acetonitrile tends to bind to the OH group of phenol in low energy conformers.

• Journal of Families and Better Life
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• v.17 no.2
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• pp.121-136
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• 1999

The purpose of this study was to investigate the effect of parent-bonding patterns & environmental variables on rural adolescent's trait-anxiety. The main results were as follows. Frist mother had more affection and father had more overprotection in parent-bonding patterns. Trait-anxiety was the level of medium. Second home atmosphere home life satisfaction parents' scolding health conditions allowance satisfaction friendship the relationship with home teachers school life satisfaction and teacher's scolding were significnat variables on trait anxiety Third an analysis of parent-bonding relationship environmental variable and trait-anxiety showed that school life satisfaction family atmosphere friendship and health conditions were the most crucial environmental variable while father's care and mother's overprotection were the most crucial parent-bonding variables on rural adolescent's trait-anxiety.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.31-38
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• 2015

In order to achieve a high speed and high quality silicon wafer bonding, the room-temperature direct bonding using atmospheric pressure plasma and sprayed water vapor was developed. Effects of different plasma fabrication parameters, such as flow rate of $N_2$ gas, flow rate of CDA (clear dry air), gap between the plasma head and wafer surface, and plasma applied voltage, on plasma activation were investigated using the measurements of the contact angle. Influences of the annealing temperature and the annealing time on bonding strength were also investigated. The bonding strength of the bonded wafers was measured using a crack opening method. The optimized condition for the highest bonding strength was an annealing temperature of $400^{\circ}C$ and an annealing time of 2 hours. For the plasma activation conditions, the highest bonding strength was achieved at the plasma scan speed of 30 mm/sec and the number of plasma treatment of 4 times. After optimization of the plasma activation conditions and annealing conditions, the direct bonding of the silicon wafers was performed. The infrared transmission image and the cross sectional image of bonded interface indicated that there is no void and defects on the bonded wafers. The bonded wafer exhibited a bonding strength of average $2.3J/m^2$.