• Title/Summary/Keyword: school bonding

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THE EFFECTS OF CRYSTAL GROWTH ON SHEAR BOND STRENGTH OF ORTHODONTIC BRACKET ADHESIVES TO ENAMEL SURFACE (Crystal growth에 의한 법랑질 표면처리가 교정용 브라켓 접착제의 전단결합강도에 미치는 영향)

  • Lee, Young-Jun;Park, Young-Guk
    • The korean journal of orthodontics
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    • v.27 no.5 s.64
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    • pp.839-852
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    • 1997
  • It has been submitted that different ion solutions containing sulfate induce crystal growth and might substitute conventional acid etching for pretreatment of enamel in orthodontic bonding(${\AA}rtun$ et al., Am. J. Orthod. 85, 333, 1984). This investigation was designed to evaluate the relevance of crystal growth on the enamel surface as an alternative to conventional acid etching in direct bonding of orthodontic brackets. Annexing Li2SO4, MgSO4, K2SO4 respectively in the solution with $25\%$ polyacrylic md 0.3M sulfuric acids were employed to enhance the crystal growth. Human bicuspids were treated with various parameters as combinations of crystal growth and glass ionomer cement, crystal growth and orthodontic resin, acid etching and orthodontic resin for an investigative purpose. Crystal growth solution containing MgSO4 showed the highest shear bond strength(15.6MPa) within the groups of bonding brackets with glass ionomer cement(p<0.01). Bonding with glass ionomer cement on the surface of crystal growth demonstrated higher shear bond strength than with orthodontic resin(p<0.001). Bonding with glass ionomer cement on the surface treated with crystal growth solution containing MgSO4 or K2SO4 was not different shear bond strength statistically from bonding with orthodontic resin on the acid-etched surface. It suggests that bonding brackets with glass ionomer cement on the surface treated with crystal growth solution containing MgSO4 or K2SO4 is a potential alternative to bonding with resin on the acid etched sufrace.

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EFFECT OF TEMPORARY CEMENT ON TENSILE BOND STRENGTH OF DENTIN BONDING AGENT (Temporary Cement가 상아질 접착제의 접착성능에 미치는 영향)

  • Chang, Heon-Soo;Cho, Kyeu-Zeung
    • Restorative Dentistry and Endodontics
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    • v.20 no.2
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    • pp.685-698
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    • 1995
  • This study was conducted to the effect of temporary cement on the adhesiveness of dentin bonding agent to dentin surface. One hundred freshly extracted bovine mandibular incisors were grinded to expose flat labial dentin surface. The dentin surfaces were temporarized with either eugenol-containing temporary cement(TemBond and Zinc Oxide Eugenol cement) or non-eugenol temporary cement(Nogenol and TempBond NE) for 7days, and then the temporarization was removed with surgical currette and the exposed dentin surfaces were water-rinsed. Bonding specimens were made by use of All-Bond 2 and Super-Bond C&B dentin bonding agent, and stored in $37^{\circ}C$ distilled water for 24hours. The tensile bond strenth and the cohesive failure rate were measured, and then the pretreated dentin surfaces which the temporary cement had been applied to and removed from and the fractured dentin surfaces after bonding test were examined under scanning electron microscope. The results were as follows : In case of bonding with All-Bond 2, tensile bond strength of each experimental group was lower than that of the control group(p<0.05), but there was no significant difference between the bond strengths of the control group and each experimental group in case of bonding with Super-Bond C&B(p>0.05). No significant difference between tensile bond strength of experimental group, whether temporary cement contains eugenol or not, was seen(p>0.05). In case of bonding with All-Bond 2, the control group showed cohesive-adhesive mixed failure mode and the experimental groups mainly showed adhesive failure mode, but in case of bonding with Super-Bond C&B, almost of the control and the experimental groups mainly showed cohesive failure mode. On SEM examination, all of the dentin specimens pretreated with either 10 % phosphoric acid or 10% citric acid after application of the temporary cements demonstrated remnants of temporary cement attached to dentin surface.

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Impact of Social Relations on Youth School Adjustment (사회적 관계요인이 청소년의 학교적응에 미치는 영향)

  • Jung, Kyu-Suk
    • Korean Journal of Social Welfare
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    • v.56 no.1
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    • pp.235-252
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    • 2004
  • The purpose of this study was to construct and test a social relation model of youth school adjustment, based on Hirschi's social bonding theory and the previous findings in the area of youth school adjustment. The social relation model included parent-child relation, peer relation, and teacher-student relation variables. The sample consisted of two groups, 494 adolescents: 351 high school students and 143 adolescent residents at the shelter for runaways. For data analysis, descriptive statistics, correlation analysis, and multiple regression analysis were performed. The main finding was that the social relation model of youth school adjustment was significant in explaining the general school adjustment and academic performance. Specifically, the better relations with parents, peer, and teachers, the higher the degree of youth school adjustment. Among the significant variables, teacher-students relation was the most important variable. Based on these results, this study provided some practical suggestions to effectively enhance the relations with teachers, peer, and parents.

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Bonding Characteristics of Directly Bonded Si wafer and Oxidized Si wafer by using Linear Annealing Method (선형열처리법으로 직접 접합된 Si 기판 및 산화된 Si 기판의 접합 특성)

  • Lee, Jin-Woo;Gang, Choon-Sik;Song, Oh-Seong;Ryu, Ji-Ho
    • Korean Journal of Materials Research
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    • v.10 no.10
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    • pp.665-670
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    • 2000
  • Linear annealing method was developed to increase the bond strength of Si wafer pair mated at room tem­perature instead of conventional furnace annealing method. It has been known that the interval of the two mating wafer surfaces decreases and the density of gaseous phases generated at the interface increases with increase in an-nealing temperature. The new annealing method consisting of one heat source and light reflecting mirror used these two phenomena and was applied to Si$\mid$$\mid$Si and Si$\mid$$\mid$$SiO_2/Si$ bonding. The bonding interface observed directly by using IR camera and HRTEM showed clear bonding interface without any unbonded areas except the area generated by the dusts inserted into the mating interface at the room temperature. Crack opening method and direct tensile test was ap­pplied to measure the bond strength. The two methods showed similar results. The bond strength increased continuous­tly with the increase of annealing temperature.

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PSYCHO-PHYSICS

  • Oh, Hung-Kuk
    • Proceedings of the Korean Society for Emotion and Sensibility Conference
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    • 2000.04a
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    • pp.35-38
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    • 2000
  • Conventional atom model must be criticized on the following four points.(1) natural motions between positive and negative entities are not circular motions but linear going and returning ones, for examples sexual motion, tidal motion, day and night etc.(2) Potential energy generation was neglected when electron changes its orbit from outer one to inner one. The hv is the kinetic energy of the photo-electron. The total energy difference between orbits comprises kinetic and potential energies. (3) The structure of the space must be taken into consideration because the properties of the electron do not changed during the transition from outer orbit to inner one even though it produces photon. (4) Total energy conservation law applies to the energy flow between mind and matter because we daily experiences a interconnection between mind and body.New atomic model 9the crystallizing $\pi$-bonding) was proposed in the journal of material processing technology since 1997 for the explanation of the mechanical behaviors in terms of physics. $\prod$-ray physics proved that the electrons can come out from in the nucleus and modern chemistry corresponds to the $\pi$-bonding by the nuclear electrons. The $\pi$-bonding structure of the protons outside the nucleus is that electrons move between protons of the different atoms. The perception step and the characteristic frequency in signal transduction is due to the accumulation of the $\pi$-rays outside of the proton before their absorption to the nucleus.

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Relationship between Contrast Ratio of Conductive Particle and Contact Resistance on COG Bonding using ACF (ACF를 이용한 COG 접합 공정에서 도전볼의 음영비와 접촉 저항과의 관계)

  • Jin, Songwan;Jeong, Young Hun;Choi, Eun Soo;Kim, Bosun;Yun, Won-Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.9
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    • pp.831-838
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    • 2014
  • Chip on glass (COG) bonding using anisotropic conductive film (ACF) is a key technology to assemble a driver IC onto a LCD glass panel. In this paper, an experimental investigation was conducted to investigate the correlation between contact resistance and characteristics of image taken by machine vision based inspection system. The results show that the contact resistance was strongly influenced by the contrast ratio of conductive particle rather than the number of conductive particles. Also, number of conductive particles whose contrast ratio is below 0.75 is crucial for determining the quality of the assembled samples. On the other hand, in the result of high temperature high humidity storage test, the contrast ratio of samples was increased. However, in the case of open-circuit samples after temperature humidity storage test, the number of conductive particles whose contrast ratio is above 0.75 was more than that of the closed-circuit samples.

PSYCHO-PHYSICS

  • Oh, Hung-Kuk
    • Proceedings of the Korean Society for Cognitive Science Conference
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    • 2000.05a
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    • pp.71-75
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    • 2000
  • Conventional atom model must be criticized on the following four points. (1) Natural motions between positive and negative entities are not circular motions but linear going and returning ones, for examples sexual motion, tidal motion, day and night etc. (2) Potential energy generation was neglected when electron changes its orbit from outer one to inner one. The hv is the Kinetic energy of the photo-electron. The total energy difference between orbits comprises kinetic and potential energies. (3) The structure of the space must be taken into consideration because the properties of the electron do not change during the transition form outer orbit to inner one even though it produces photon. (4) Total energy conservation law applies to the energy flow between mind and matter because we daily experiences a interconnection between mind and body. New atomic model (the crystallizing $\pi$-bonding) was proposed in the journal of material processing technology since 1997 for the explanation of the mechanical behaviors in terms of physics. $\prod$-ray physics proved that the electrons can come out from in the nucleus and modern chemistry corresponds to the $\pi$-bonding by the nuclear electrons. The $\pi$-bonding structure of the protons outside the nucleus is that electrons move between protons of the different atoms. The perception step and the characteristic frequency in signal transduction is due to the accumulation of the $\pi$-rays outside fo the proton before their absorption to the nucleus.

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The Effect of Acid Treatment Time for Ni Plating on the Joint of α-Al2O3 and Ni Metal (α-Al2O3와 Ni 금속 접합을 위한 Ni 무전해 도금시 산처리의 영향)

  • YI, EUNJEONG;AN, YONGTAE;CHOI, BYUNGHYUN;JI, MIJUNG;HWANG, HAEJIN
    • Transactions of the Korean hydrogen and new energy society
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    • v.27 no.3
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    • pp.306-310
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    • 2016
  • In Na-base Battery for ESS, ${\alpha}-Al_2O_3$ and metal bonding was used to prevent direct reaction between electrolyte and electrode. The hard metal was metalized at $1600^{\circ}C$ in a flowing hydrogen gas for high bonding strength. In this study, instead of hard metal metalizing, Ni was plated on ${\alpha}-Al_2O_3$ by electroless Ni plating technique and then bonded with metal. To enhance the bonding strength, surface of ${\alpha}-Al_2O_3$ was treated with $H_3PO_4$. The effects of strength and leakage of joining as a function of acid treatment time on ${\alpha}-Al_2O_3$ are described.

Adhesive Fracture Characteristic of DCB Specimen due to Single and Heterogeneous Materials under Tearing Load (찢김 하중에서 단일 재료 및 이종 접합 재료에 따른 이중외팔보 시험편의 접착제 파손 특성)

  • Kim, Jae-Won;Cho, Jae-Ung
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.20 no.4
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    • pp.127-134
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    • 2021
  • In this study, the adhesive fracturing characteristics of a DCB specimen due to single and heterogeneous bonding materials under tearing load was investigated. The experiments were conducted to examine the fracturing properties of the adhesive DCB specimen. As an experimental condition, a forced displacement of 3mm/min was applied to one side while the other side was fixed. As a result of the experiment, it was found that the AL6061-T6 material was superior to the CFRP material in terms of maximum stress, specific strength, and energy release rate when compared to the adhesive fracturing property of a single material. We tested CFRP-AL, a heterogeneous bonding material, and compared its experimental results to the results from the single materials. Based on these results, CFRP-AL with a heterogeneous bonding material was observed to have the superior structural safety compared to single materials for the mode III fracture type.