• 마이크로전자및패키징학회지
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• 제20권2호
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• pp.11-15
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• 2013

The wafer bonding process becomes a flexible approach to material and device integration. The bonding strength in 3-dimensional process is crucial factor in various interface bonding process such as silicon to silicon, silicon to metals such as oxides to adhesive intermediates. A measurement method of bonding strength was proposed by utilizing AFM applied CNT probe tip which indicated the relative simplicity in preparation of sample and to have merit capable to measure regardless type of films. Also, New Tool was utilized to measure of tip radius. The cleaned $SiO_2$-Si bonding strength of SPFM indicated 0.089 $J/m^2$, and the cleaning result by RCA 1($NH_4OH:H_2O:H_2O_2$) measured 0.044 $J/m^2$, indicated negligible tolerance which verified the possibility capable to measure accurate bonding strength. And it could be confirmed the effective bonding is possible through SPFM cleaning.

• 마이크로전자및패키징학회지
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• 제14권1호
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• pp.19-26
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• 2007

본 연구의 목적은 CMOS 이미지 센서용 Au 플립칩 범프와 전해 도금된 Au 기판 사이의 초음파 접합의 가능성 연구이다. 초음파 접합 조건을 최적화하기 위해서, 대기압 플라즈마 세정 후 접합 압력과 시간을 달리하여 초음파 접합 후 전단 시험을 실시하였다. 범프의 접합 강도는 접합 압력과 시간 변수에 크게 좌우되었다. Au 플립칩 범프는 상온에서 성공적으로 하부 Au 도금 기판과 접합되었으며, 최적 조건 하에서 접합 강도는 약 73 MPa이었다.

• 반도체디스플레이기술학회지
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• 제4권2호
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• pp.33-37
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• 2005

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified fer other bonding methods such as ACF.

• 한국전기전자재료학회논문지
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• 제24권12호
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• pp.949-954
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• 2011

In this study, the characteristics and error ranges of the mechanical bonding strength were analyzed according to before and after thermal shock test for various chips of automotive application component using Sn-3.0Ag-0.5Cu solder. In the after thermal shock test, the mechanical bonding strengths tend to decrease, meanwhile decreasing rates of mechanical strengths were less then 12% at specimen's bonding area below 3.5$mm^2$, and were from 17 to 21% at specimen's bonding area above 12 $mm^2$. On the other hand, Specimen's mean deviation rates were about 5% at specimen's bonding area more than 12 $mm^2$. Inversely, at specimen's bonding area is less then 3.5 $mm^2$, mean deviation rates were increased to about 8%. It means that the smaller device size is, the larger mean deviation rate. In addition, error ranges and deviation rates of the mechanical bonding strengths may differ slightly depending on their bonding area. Furthermore, process conditions as well as method of mechanical reliability evaluation should be established to reduce the error ranges of bonding strength.

• 대한기계학회논문집A
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• 제36권4호
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• pp.395-403
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• 2012

오늘날 접합시 열에 의한 재료 손상과 접착제(ACA, NCA) 이용으로 부품간의 정렬이 문제가 되고있다. 따라서, 본 논문은 FPCB 와 HPCB 금속(Au) PAD를 직접 접합하였다. 이때 박막인 재료에 손상을 입히는 열, 부품간의 정렬에 문제가 되는 접착제(ACA, NCA)를 사용하지 않고 상온에서 접합을 하였다. 접합시 초음파 혼을 이용하여 접합을 하였으며, 초음파혼은 40kHz이다. 공정 조건은 접합압력 0.60MPa, 접합시간 0.5, 1.0, 1.5, 2.0sec이다. 또한, 산업에서 요구하는 접합강도는 필강도 테스트 결과값으로 0.60Kgf 이상이며, 본 실험에서는 접합강도가 0.80MPa 이상이 나왔다. 이로서, 열에 의한 재료 손상과, 접 착제(ACA, NCA)에 의한 정렬 문제를 해결하였다. 그리고 산업산업에서 바로 적용하고 생산할 수 있는 FPCB, HPCB 시료 제작을 하였다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.393-395
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• 2005

The bonding for Aluminum and Copper in the air is investigated in this study. This bonding method does not include the special process of removing aluminum oxide films. In case of this bending, each metal Is heated at bonding temperature where is above eutectic temperature of Al-Cu system and below melting point of Aluminum. The liquefaction around the bonding surface occurs after the diffusion at solid state of each metal. This phenomenon is predicted by the temperature range above eutectic temperature of Al-Cu equilibrium phase diagram.

• 마이크로전자및패키징학회지
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• 제18권2호
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• pp.63-67
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• 2011

본 연구에서는 interlayer로 Sn을 사용하여 경성 인쇄 회로 기판(Rigid printed circuit board, RPCB)과 연성 인쇄 회로 기판(Flexible printed circuit board, FPCB) 간의 열압착 접합(Thermo-compression bonding) 조건을 최적화하는 연구를 진행하였다. 접합에 앞서 FPCB를 다양한 온도와 시간조건 하에서 Sn이 용융된 솔더 배스 안에서 침지(Dipping) 공정을 수행하였고, 열압착법을 이용하여 FPCB와 RPCB의 접합을 수행하였다. FPCB/RPCB 접합부의 접합 강도를 $90^{\circ}$ 필 테스트(Peel test)를 이용하여 측정하였다. 그 결과 $270^{\circ}C$, 1s의 침지 조건에서 FPCB의 polyimide(PI)와 Cu 전극 계면에서 파단되고, 이때, 최대 박리 강도를 얻었다. FPCB와 RPCB의 열압착 접합시 주요 변수로는 압력, 온도, 시간이 있으며, 특히 온도의 증가에 따라 접합 강도가 크게 증가하였다. 접합부 계면 관찰 결과, 접합 온도와 시간이 증가함에 따라 접합 면적이 증가하였으며, 이로 인해 접합 강도가 증가하는 것으로 사료된다. 필 테스트 과정에서 나타나는 F-x(Forcedisplacement) 곡선을 토대로 산출한 파괴 에너지와 접합 강도는 $280^{\circ}C$, 10s의 접합 조건에서 가장 높게 나타났으며, 이 조건이 최적 접합 조건으로 도출되었다.

• 대한치과교정학회지
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• 제41권6호
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• pp.447-453
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• 2011

Objective: We compared the shear bond strength (SBS) of lingual retainers bonded to bovine enamel with three different resins using direct and indirect methods. Methods: Both ends of pre-fabricated twisted ligature wires were bonded to bovine enamel surfaces using Light-Core, Tetric N-Flow, or Transbond XT. Phosphoric acid-etched enamel surfaces were primed with One-Step prior to bonding with Light-Core or Tetric N-Flow. Transbond XT primer was used prior to bonding with Transbond XT. After 24 hours in water at $37^{\circ}C$, we performed SBS tests on the samples. We also assigned adhesive remnant index (ARI) scores after debonding and predicted the clinical performance of materials and bonding techniques from Weibull analyses. Results: Direct bonding produced significantly higher SBS values than indirect bonding for all materials. The SBS for Light-Core was significantly higher than that for Tetric N-Flow, and there was no significant difference between the direct bonding SBS of Transbond XT and that of Light-Core. Weibull analysis indicated Light-Core performed better than other indirectly bonded resins. Conclusions: When the SBS of a wire retainer is of primary concern, direct bonding methods are superior to indirect bonding methods. Light-Core may perform better than Transbond XT or Tetric N-Flow when bonded indirectly.

• 비파괴검사학회지
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• 제27권3호
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• pp.224-230
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• 2007

This work is aimed to explore a possibility of using the generalized Lamb waves for nondestructive evaluation of the bonding quality of layered substrates. For this purpose, we prepared two sets of specimens with imperfect bonding at their interfaces; 1) TiN-coated specimens with various wear conditions, and 2) CVD diamond specimens with various cleaning conditions. A dispersion simulation performed for layered substrates with imperfect interfaces are carried out to get the characteristics of dispersion curves that can be used for bonding quality evaluation. Then the characteristics of dispersion curves of the fabricated specimens are experimentally determined by use of an ultrasonic backward radiation measurement technique. The results obtained in the present study show that the lowest velocity mode (Rayleigh-like) of the generalized Lamb waves are sensitively affected by the bonding quality. Therefore, the generalized Lamb waves can be applied for nondestructive evaluation of imperfect bonding quality in various layered substrates.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 추계학술대회 논문집 전기물성,응용부문
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• pp.30-32
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• 2005

This paper reports on an LTCC-based packaging method using Au/Sn eutectic bonding process for RF MEMS applications. The proposed packaging structure was realized by a micromachining technology. An LTCC substrate consists of metal filled vertical via feedthroughs for electrical interconnection and Au/Sn sealing rim for eutectic bonding. The LTCC capping substrate and the glass bottom substrate were aligned and bonded together by a flip-chip bonding technology. From now on, shear strength and He leak rate will be measured then the fabricated package will be compared with the LTCC package using BCB adhesive bonding method which has been researched in our previous work.