• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.39 no.1
• /
• pp.31-38
• /
• 2002

In order to improve the 0.35 $mutextrm{m}$-via hole etching process the etching characteristic of the gas $C_2F_{6}$ has been analyzed. The samples were triple-layer films(TEOS/SOG/TEOS) on 8-inch wafers and the orthogonal array matrix technique was used for the process. The equipment for etching was the transformer coupled plasma (TCP) source which is a type of high density plasma(HDP). This experiment showed the etching rate for $C_2F_{6}$ was 0.8 $mutextrm{m}$/min-1.1 $mutextrm{m}$/min and the measured uniformity was under $pm$6.9% in the matrix window. The CD skew comparison between pre and post-etching was under 10% which is an outstanding results in the window of profile in anisotropic etching. There was no problem in C2F6 with the flow rate of 20sccm, but when 14sccm of $C_2F_{6}$ was supplied there was a recess problem on the inner wall of SOG film. Consequently the etching characteristic of $C_2F_{6}$ shows a fast etching rate and a very wide process window in HDP TCP.

• Korean Chemical Engineering Research
• /
• v.54 no.4
• /
• pp.527-532
• /
• 2016

The effects of gas velocity and solid circulation rate on the axial solid holdup distribution have been determined in a 10 mm-I.D. ${\times}$ 800 mm-high circulating fluidized bed plasma reactor under reduced pressure (1torr). Polystyrene polymer powder and nitrogen gas are used as solid and gas materials respectively. The change of solid circulation rate by a large gas flow rate of the riser (40~80 sccm) is also possible by a relatively small gas flow rate of the solid recirculation part (6.6~9.9 sccm). The solid circulation rate in the reactor under reduced pressure increases with increasing aeration velocity in the solid recirculation part. The axial solid holdup in the riser decreases from the dense at the bottom to the dilute phase at the top section of the riser. Solid holdups at the axial positions in the riser increase linearly with increasing solid circulating velocity. From these results, we could determine the position of plasma load for good plasma ignition, maintain and plasma reaction.

• Resources Recycling
• /
• v.25 no.2
• /
• pp.10-16
• /
• 2016

In this study, the Ni base superalloy was recycled by Argon oxygen decarburization(AOD) process using an inconel 713C scrap. During AOD process, argon gas was continuously injected 1,000 sccm and oxygen gas was injected into 10, 20 and 30 minutes of 100, 250 and 500 sccm.. In early stage of oxygen injection, the oxygen dose increased with increasing Al, Cr, and Mo content and decreasing C content. And Al content was decreased by carburization with added elements in late stage Because of oxidation was occurred with Al, Cr etc. after the reaction of carbon has been finished. From the results, the ratio of ${\gamma}^{\prime}$ phase reduced due to decreasing of Al content for that reason Al is the main element to form the ${\gamma}^{\prime}$ phase. Also carbide reduced owing to decreasing of C content so the mechanical properties of the specimens excessively injected by excess $O_2$ gas were decreased.

• Journal of the Korean institute of surface engineering
• /
• v.41 no.6
• /
• pp.269-273
• /
• 2008

The etch of $(Na_{0.5}K_{0.5})NbO_3$ (NKN) thin film was performed in $BCl_3/Cl_2/Ar$ inductively coupled plasma. It was found that the 1sccm addition $BCl_3$ (5%) into $Cl_2/Ar$ plasma caused a non-monotonic behavior of the NKN etch rate. The maximum etch rate of NKN was 95.3 nm/min at $BCl_3$ (1 sccm)/$Cl_2$ (16 sccm)/Ar (4 sccm), 800 W ICP power, 1 Pa pressure and 400 W bias power. The NKN etch rate shows a monotonic behavior a s the bias power increases. The analysis of the narrow scan spectra of XPS for both a s-deposited and etched NKN films allowed one to assume ion assisted etch mechanism. The most probable reason for the maximum etch rate can be defined as a concurrence of chemical and physical etch pathways.

• Journal of the Korean institute of surface engineering
• /
• v.46 no.4
• /
• pp.168-174
• /
• 2013

In this study, low-cost, high-speed deposition, excellent processability, high mechanical strength and electrical conductivity, chemical stability and corrosion resistance of stainless steel to meet the obsessive-compulsive (0.1 mm or less) were selected CrN thin film. new price reduction to sputter deposition causes - the possibility of sublimation source for inductively coupled plasma Cr rods were attempts by DC bias. 0.6 Pa Ar inductively coupled plasmas of 2.4 MHz, 500 W, keeping Cr Rod DC bias power 30 W (900 V, 0.02 A) is applied, $N_2$ flow rate of 0.5, 1.0, 1.5 sccm by varying the characteristics of were analyzed. $N_2$ flow rate increases, decreases and $Cr_2N$, CrN was found to increase. In addition to corrosion resistance and contact resistance, corrosion resistance, electrical conductivity was evaluated. corrosion current density than $N_2$ 0 sccm was sure to rise in all, $N_2$ 1 sccm at $4.390{\times}10^{-7}$ (at 0.6 V) $A{\cdot}cm^{-2}$, respectively. electrical conductivity process results when $N_2$ 1 sccm 28.8 $m{\Omega}/cm^2$ with the lowest value of the contact resistance was confirmed that came out. The OES (SQ-2000) and QMS (CPM-300) using a reactive deposition process to add $N_2$ to maintain a uniform deposition rate was confirmed that.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.02a
• /
• pp.157-157
• /
• 2011

박막형태로 제작이 가능한 비정질 실리콘은 결정질 실리콘에 비하여 AM-1 (Air Mass 1:100mW/cm2)조건하에서 10-3 S/cm 정도의 높은 광전기전도도와 가시광선 영역($4000{\sim}7000{\AA}$)에서 약 10배의 높은 광흡수계수를 가지며, $300^{\circ}C$ 이하의 낮은 기판온도에서 다양한 기판위에 대면적으로 제작이 가능할 뿐만 아니라 제작공정이 단순하여 제작비용이 저렴하다는 이점이 있다. 본 실험에서 제작된 모든 박막은 PECVD로 증착하였으며 구조는 p-i-n superstrate형 구조를 사용하였고, 각 박막의 두께는 p-a-Si:H/i-a-SiGe:H/n-a-Si:H ($300{\AA}/2000{\AA}/600{\AA}$)으로 고정하였다. a-Si:H (hydrogenated amorphous silicon) 태양전지의 광 흡수층인 i-layer에서의 germane 가스 유량 변화(0, 20, 40. 60, 80, 100 sccm)에 대한 흡수율의 차이를 UV/Vis/Nir spectrophotometer (ultraviolet/visible/near infrared spectrophotometer)를 통해 확인하고, 그에 따른 a-Si:H 박막 태양전지를 제작하여 solar simulator를 사용하여 AM 1.5 G의 환경 조건에서 태양전지 특성을 평가하였다. 그 결과 germane 가스 유량이 증가함에 따라 파장에 대한 absorptance (a.u.)값이 증가함을 알 수 있었으며, 흡수되는 파장영역의 범위가 장파장으로 확대됨을 확인할 수 있었다. 또한 germane 가스 유량이 60 sccm 일때 a-SiGe:H 박막 태양전지 변환효율이 3.80%로 최대값을 가졌다. 실험에서 germane 가스 유량이 증가할수록 흡수율이 높아져 태양전지특성이 향상될 거라 예상 했지만, 100 sccm보다 60 sccm일 때가 단락전류밀도 값과 변환효율이 높다는 것을 확인할 수 있었다. 이는 각 layer사이에 계면상의 문제가 있을 거라 예상되며 직렬저항측정을 통해 확인할 수 있다.

• Journal of the Korean institute of surface engineering
• /
• v.47 no.3
• /
• pp.99-103
• /
• 2014

The encapsulation method of flexible organic light emitting devices (OLEDs) was investigated for the structure of ITO / 2-TNATA / NPB / $Alq_3$ : Rubrene (1 vol.%) / $Alq_3$ / LiF / Al / $Alq_3$ / LiF / Al (OLED #1), on which $SiN_x$ thin film was deposited and metal film was attached to protect the damage of OLED from oxygen and moisture. The $SiN_x$ thin film was deposited by plasma enhanced chemical vapor deposition (PECVD) method using $SiH_4$ of 20 sccm and $N_2$ of 15~35 sccm as reactor gases. The optimum $SiN_x$ deposition condition was found to be 20 sccm $SiH_4$ and 20 sccm $N_2$ from the Ca test of the fabricated $SiN_x$ thin film. The life time of OLED #1, OLED #1 / $SiN_x$ 200 nm, OLED #1 / $SiN_x$ 400 nm and OLED #1 / $SiN_x$ 400 nm / metal film was 7, 12, 25, and 45 hours, respectively. In conclusion, it has been shown that the lifetime of OLEDs can be improved more than 6 times by $SiN_x$ film and a metal film encapsulation.

• Polymer(Korea)
• /
• v.32 no.1
• /
• pp.38-42
• /
• 2008

Ultrathin films were coated on low density Polyethylene (LDPE) food packaging films by plasma polymerization of methane, acetylene, hexamethyldisiloxane (HMDSO), and HMDSO+oxygen to improve the barrier property of the LDPE films. The film coated in HMDSO +oxygen (flow rate: 0.6+ 9.0 SCCM) plasma at 40 W for 10 min showed the highest improvement in the barrier property against oxygen, reducing the permeability of oxygen as much as 18.6 times. The film coated in acetylene (flow rate 0.75 SCCM) plasma at 10 W for 10 min showed the highest improvement in the barrier property against carbon dioxide and moisture, reducing the permeability of carbon dioxide and moisture as much as 12.0 and 3.0 times, respectively. In addition, cherry tomato, cucumber, and mushroom (Flammulina velutipes) wrapped with the coated films were kept fresh $1.5{\sim}3.0$ times longer than those wrapped with an LDPE film.

• Journal of the Semiconductor & Display Technology
• /
• v.7 no.4
• /
• pp.7-11
• /
• 2008

ITO (Indium Tin Oxide) thin films have been extensively studied for OLED devices because they have high transparent properties in the visible wavelength and a low electrical resistivity. These ITO films are deposited by rf-magnetron sputtering under different ambient gases (Ar, Ar+$O_2$ and Ar+$H_2$) at $300^{\circ}C$. In order to investigate the influences of the oxygen and hydrogen, the flow rate of oxygen and hydrogen in argon has been changed from 0.5sccm to 5sccm and from 0.01sccm to 0.25sccm respectively. The resistivity of ITO film increased with increasing flow rate of $O_2$ under Ar+$O_2$ while it is nearly constant under Ar+$H_2$. And the peak of ITO films obtained (222) and (400) orientations and the average transmittance was over 80% in the visible range. The OLED device fabricated with different ITO substrates made by configuration of ITO/$\alpha$-NPD/Alq3/LiF/Al to elucidate the performance of ITO substrate for OLED device.

• Korean Journal of Materials Research
• /
• v.9 no.11
• /
• pp.1055-1061
• /
• 1999

Indium Tin Oxide (ITO) films were fabricated by vacuum deposition technique and their microwave shielding properties were investigated for the application to the transparent shield material. The vacuum coating was conducted in a RF co-sputtering machine. The film composition and structure associated with the sputtering conditions (argon and oxygen pressure. substrate temperature. RF input power) were investigated for the attainment of high electrical conductivity and good transparency. The electrical conductivity of IT0 films fabricated under the optimum deposition conditions (substrate temperature : $300^{\circ}C$. Ar flow rate : 20 sccm, Oxygen flow rate : 10 sccm, In/Sn input power : 50/30 W) showed 5.6$\times10^4$mho/m. The optical transparency is also considerably good. The microwave shielding properties including the dominant shielding mechanism are investigated from the electrical conductivity, thickness and skin depth of the ITO films. The total shielding effectiveness is then estimated to be 26 dB, which provides a suggestion that the IT0 films can be effectively used as the transparent shield material.