• 제목/요약/키워드: scanning electron microscope(SEM) image

검색결과 93건 처리시간 0.03초

수치해석을 통한 SEM 챔버내의 이차전자 거동해석 및 이차전자 검출기의 최적 장착 위치 선정 (The Behavior of Secondary Electrons and Optimal Mounting Position of a Secondary Electron Detector in SEM with a Numerical Analysis)

  • 부경석;전종업
    • 한국공작기계학회논문집
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    • 제17권4호
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    • pp.15-21
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    • 2008
  • Secondary electron detectors used in scanning electron microscope accept secondary electrons emitted from the specimen and convert them to an electrical signal that, after amplification, is used to modulate the gray-level intensities on a cathode ray tube, producing an image of the specimen. In order to acquire images with good qualities, as many secondary electrons as possible should be reached to the detector. To realize this it is very important to select an appropriate mounting position and angle of the detector inside the chamber of scanning electron microscope. In this paper, a number of numerical simulations are performed to explore the relationships between detection rates of secondary electrons and the values of some parameters, such as distances between the detector and sample, relative mounting positions of scintillator positioned inside the detector with respect to detector cover, two types of mounting angles of the detector. The relationships between detection rates and applied voltages to corona ring and faraday cage, and energies of secondary electrons are investigated as well.

열전자방사형 주사전자 현미경 전자광학계의 유한요소해석 (Finite Element Analysis for Electron Optical System of a Thermionic SEM)

  • 박근;정현우;김동환;장동영
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회A
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    • pp.1288-1293
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    • 2007
  • The present study covers the design and analysis of a thermionic scanning electron microscope (SEM) column. The SEM column contains an electron optical system in which electrons are emitted and moved to form a focused beam, and this generates secondary electrons from the specimen surfaces, eventually making an image. The electron optical system mainly consists of a thermionic electron gun as the beam source, the lens system, the electron control unit, and the vacuum unit. In the design process, the dimension and capacity of the SEM components need to be optimally determined with the aid of finite element analyses. Considering the geometry of the filament, a three-dimensional (3D) finite element analysis is utilized. Through the analysis, the beam emission characteristics and relevant trajectories are predicted from which a systematic design of the electron optical system is enabled. The validity of the proposed 3D analysis is also discussed by comparing the directional beam spot radius. As a result, a prototype of a thermionic SEM is successfully developed with a relatively short time and low investment costs, which proves the adoptability of the proposed 3D analysis.

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전자현미경의 이미지 향상을 위한 주사시스템의 안정성 (Scanning System Stability for Improving SEM Image)

  • 김승재;김동환
    • 한국생산제조학회지
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    • 제18권5호
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    • pp.455-461
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    • 2009
  • In a scanning electron microscopy, image distortion is a critical issue and it is needed to be eliminated by some kinds of schemes. In this work, scanning frequency and scanning wave form are adjusted to have an improved image. The relationship between scan coil and its driver is investigated and appropriate frequency and wave form are suggested. It is proved that the selected frequency and wave form showed an enhanced image with less distortion, which were done by experiments. In addition, a noise elimination is addressed, providing improved image with a GROUND signal integration with the amplifier and the scan driver.

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전자빔 몬테 카를로 시물레이션 프로그램 개발 및 전자현미경 이미징 특성 분석 (Development of Electron Beam Monte Carlo Simulation and Analysis of SEM Imaging Characteristics)

  • 김흥배
    • 한국정밀공학회지
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    • 제29권5호
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    • pp.554-562
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    • 2012
  • Processing of Scanning electron microscope imaging has been analyzed in both secondary electron (SE) imaging and backscattered electron (BSE) image. Because of unique characteristics of both secondary electron and backscattered electron image, mechanism of imaging process and image quality are quite different each other. For the sake of characterize imaging process, Monte Carlo simulation code have been developed. It simulates electron penetration and depth profile in certain material. In addition, secondary electron and backscattered electron generation process as well as their spatial distribution and energy characteristics can be simulated. Geometries that has fundamental feature have been imaged using the developed Monte Carlo code. Two, SE and BSE images generation process will be discussed. BSE imaging process can be readily used to discriminate in both material and geometry by simply changing position and direction of BSE detector. The developed MC code could be useful to design BSE detector and their position. Furthermore, surface reconstruction technique is possibly developed at the further research efforts. Basics of Monte Carlo simulation method will be discussed as well as characteristics of SE and BSE images.

원자층 증착법과 스퍼터링을 이용한 고체산화물 연료전지용 YSZ 전해질에 관한 연구 (Comparison of Yittria Stabilized Zirconia Electrolytes(YSZ) for Thin Film Solid Oxide Fuel Cell by Atomic Layer Deposition and Sputtering)

  • 탄비르 와카스하산;하승범;지상훈;차석원
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2011년도 추계학술대회 초록집
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    • pp.84.2-84.2
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    • 2011
  • In this research, two thin film deposition techniques, Atomic Layer Deposition and Sputtering are carried out for the fabrication of Yittria Stabilized Zirconia electrolyte for thin film Solid Oxide Fuel Cell. Zirconium to Yittrium ratio for both cases is about 1/8. Scanning Electron Microscope(SEM) image shows that the growth rate per hour for Atomic Layer Deposition is faster than for sputtering. X-ray Photo-electron Spectroscopy(XPS) shows that the peaks of both Zirconia and Yittria shift towards higher bending energy for the case of Atomic Layer deposition and thus are more strongly attached to the substrate. Later, Nyquist plot was used to compare the conductivity of Yittria Stabilized Electrolyte for both cases. The conductivity at $300^{\circ}C$ for Atomic Layer Deposited Yittria Stabilized Zirconia is found to be $5{\times}10^{-4}S/cm$ while that for sputtered Yittria Stabilized Zirconia is $2{\times}10^{-5}S/cm$ at the same temperature. The reason for better performance for Atomic Layered YSZ is believed to be the Nano-structured layer fabrication that aids in along the plane conduction as compared to the columnarly structured Sputtered YSZ.

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전자빔 가공기의 제어기 구성 (Controller Design for Electron Beam Manufacturing System)

  • 임선종;강재훈;이찬홍
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.1862-1865
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    • 2005
  • We have a plan to design a controller for electron beam manufacturing system. At first, we designed a controller for SEM. The controller consists of five parts (power source, beam controller, scanning controller, optic controller and main controller). Beam controller supplies pulse wave for generating high voltage and can monitor the status of high voltage instrument through emission current. Optic controller controls focus, spot size and image shift. Main controller transmits variables from operating program to each part and monitors the status of peripheral device.

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전자현미경 영상을 이용한 나노 비주얼 서보잉 (Nano Visual Servoing Loop Using SEM Image)

  • 최진호;안상정;박병천;유준
    • 전기학회논문지
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    • 제57권10호
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    • pp.1876-1882
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    • 2008
  • Nano manipulator is used to manufacture Carbon NanoTube(CNT) tips. Using nano manipulator, operator attaches a CNT at the apex of Atomic Force Microscope(AFM) tip, which requires a mastery of mechanics and long manufacture time. Nano manipulator is installed inside a Scanning Electron Microscope(SEM) chamber to observe the operation. This paper presents a control scheme for horizontal axes of nano manipulator via processing SEM image. Edges of AFM tip and CNT are first detected, and the position information so obtained is fed to control horizontal axes of nano manipulator. That is, a visual servoing loop is realized to control the axes more precisely in nano scale.

전자현미경내 마이크로 절삭의 화상처리에 의한 절삭 기구 해석 (Analysis of Cutting Mechanism by Image Processing on Micro-Cutting in SEM)

  • 허성중
    • 한국공작기계학회논문집
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    • 제12권3호
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    • pp.89-95
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    • 2003
  • This research analyzes the cutting mechanism of A1100-H18 of commercially pure aluminum by image processing in SEM(Scanning Electron Microscope) for the measurement of strain rate distribution near a cutting edge in orthogonal micro-cutting. The distribution is measured using various methods in order. The methods are in-situ observations of cutting process in SEM, inputting image data, a computer image processing, calculating displacements by SSDA(Sequential Similarity Detection Algorithm) and calculating strain rates by FEM. The min results obtained are as follows: (1)It enables to measure a microscopic displacement near a cutting edge. (2) An application of this system to cutting process of various materials will help to make cutting mechanism clear.