• 제목/요약/키워드: rigid stamp

검색결과 8건 처리시간 0.019초

Application of artificial neural networks to a double receding contact problem with a rigid stamp

  • Cakiroglu, Erdogan;Comez, Isa;Erdol, Ragip
    • Structural Engineering and Mechanics
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    • 제21권2호
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    • pp.205-220
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    • 2005
  • This paper presents the possibilities of adapting artificial neural networks (ANNs) to predict the dimensionless parameters related to the maximum contact pressures of an elasticity problem. The plane symmetric double receding contact problem for a rigid stamp and two elastic strips having different elastic constants and heights is considered. The external load is applied to the upper elastic strip by means of a rigid stamp and the lower elastic strip is bonded to a rigid support. The problem is solved under the assumptions that the contact between two elastic strips also between the rigid stamp and the upper elastic strip are frictionless, the effect of gravity force is neglected and only compressive normal tractions can be transmitted through the interfaces. A three layered ANN with backpropagation (BP) algorithm is utilized for prediction of the dimensionless parameters related to the maximum contact pressures. Training and testing patterns are formed by using the theory of elasticity with integral transformation technique. ANN predictions and theoretical solutions are compared and seen that ANN predictions are quite close to the theoretical solutions. It is demonstrated that ANNs is a suitable numerical tool and if properly used, can reduce time consumed.

Continuous and discontinuous contact problem for a layered composite resting on simple supports

  • Birinci, Ahmet;Erdol, Ragip
    • Structural Engineering and Mechanics
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    • 제12권1호
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    • pp.17-34
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    • 2001
  • The frictionless contact problem for a layered composite which consists of two elastic layers having different elastic constants and heights resting on two simple supports is considered. The external load is applied to the layered composite through a rigid stamp. For values of the resultant compressive force P acting on the stamp vertically which are less than a critical value $P_{cr}$ and for small flexibility of the layered composite, the continuous contact along the layer - the layer and the stamp - the layered composite is maintained. However, if the flexibility of the layered composite increases and if tensile tractions are not allowed on the interface, for P > $P_{cr}$, a separation may be occurred between the stamp and the layered composite or two elastic layers interface along a certain finite region. The problem is formulated and solved for both cases by using Theory of Elasticity and Integral Transform Technique. Numerical results for $P_{cr}$, separation initiation distance, contact stresses, distances determining the separation area, and the vertical displacement in the separation zone between two elastic layers are given.

Numerical analysis of the receding contact problem of two bonded layers resting on an elastic half plane

  • Yaylaci, Murat;Terzi, Cemalettin;Avcar, Mehmet
    • Structural Engineering and Mechanics
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    • 제72권6호
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    • pp.775-783
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    • 2019
  • The present study deals with the numerical analysis of the symmetric contact problem of two bonded layers resting on an elastic half plane compressed with a rigid punch. In this context, Finite Element Method (FEM) based software called ANSYS and ABAQUS are used. It is assumed that the elastic layers have different elastic constants and heights and the external load is applied to the upper elastic layer by means of a rigid stamp. The problem is solved under the assumptions that the contact between two elastic layers, and between the rigid stamp are frictionless, the effect of gravity force is neglected. To validate the constructed model and obtained results a comparison is performed with the analytical results in literature. The numerical results for normal stresses and shear stresses are obtained for various parameters of load, material and geometry and are tabulated and illustrated.

전사공정을 위한 UV 경화성 범프형 스탬프의 점착특성 평가 (Evaluation for Adhesion Characteristics of UV-curable Bump Shape Stamp for Transfer Process)

  • 정연우;김경식;이충우;이재학;김재현;김광섭
    • Tribology and Lubricants
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    • 제32권3호
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    • pp.75-81
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    • 2016
  • Future electronics such as electronic paper and foldable cellphone are required to be flexible and transparent and should have a high performance. In order to fabricate the flexible electronics using flexibility transfer process, techniques for transferring various devices from rigid substrate onto flexible substrate by elastomeric stamp, have been developed. Adhesion between the elastomeric stamp and various devices is crucial for successful transfer process. The adhesion can be controlled by the thickness of the stamp, separation velocity, contact load, and stamp surface treatment. In this study, we fabricated the bump shape stamp consisting of a UV-curable polymer and investigated the effects of curing condition, separation velocity, and contact load on the adhesion characteristics of bumps. The bumps with hemispherical shape were fabricated using a dispensing process, which is one of the ink-jet printing techniques. Curing conditions of the bumps were controlled by the amount of UV irradiation energy. The adhesion characteristics of bumps are evaluated by adhesion test. The results show that the pull-off forces of bumps were increased and decreased as UV irradiation energy increased. For UV irradiation energies of 300 and 500 mJ/cm2, the pull-off forces were increased as the separation velocity increased. The pull-off forces also increased with the increase of contact load. In the case of UV irradiation energy above 600 mJ/cm2, however, the pull-off forces were not changed. Therefore, we believe that the bump shape stamp can be applied to roll-based transfer process and selective transfer process as an elastomeric stamp.

유한요소법을 이용한 축대칭 다단계 딥드로잉 금형 설계 해석 (Axisymmetric Multi-Stage Deep Drawing Dies Design Analysis Using Finite Element Method)

  • 이동호;금영탁
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 1998년도 제2회 박판성형심포지엄 논문집 박판성형기술의 현재와 미래
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    • pp.65-73
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    • 1998
  • The design analysis of axisymmetric, multi-stage deep drawing dies was performed using the rigid-viscoplastic finite element formulation. In the formulation, the axisymmetric CFS algorithm was employed. Hill's non-quadratic normal anisotropic yield criterion and isotropic hardening rule were considered. For trial initial displacements and tool contact points, the geometric force equilibrium method was adopted. In order to see the validity of the formulation, the multi-stage deep drawing processes of shell-cylinder front part of hydraulic booster were simulated. The simulation showed good agreements with measurements and PAM-STAMP.

유한요소법을 이용한 축대칭 다단계 딥드로잉 금형 설계 해석 (Axisymmetric Multi-Stage Deep Drawing Die Design Analysis Using Finite Element Method)

  • 이동호;이승열;금영탁
    • 소성∙가공
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    • 제7권6호
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    • pp.594-602
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    • 1998
  • The design analysis of axisymmetric, multi-stage deep drawing dies was performed using the rigid-viscoplastic finite element formulation. In the formulation the axisymmetric CFS algorithm was employed. Hill's non-quadratic normal anisotropic yield criterion and isotropic hardening rule were considered. For trial initial displacements and tool contact points. the geometric force equilibrium method was adopted. In order to see the validity of the formulation, the multi-stage deep drawing processes of shell-cylinder front part of hydraulic booster were simulated. The simulation showed good agreements with measurments and PAM-STAMP results.

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Simulate of edge and an internal crack problem and estimation of stress intensity factor through finite element method

  • Yaylaci, Murat
    • Advances in nano research
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    • 제12권4호
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    • pp.405-414
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    • 2022
  • In this study, the elastic plane problem of a layered composite containing an internal or edge crack perpendicular to its boundaries in its lower layer is examined using numerical analysis. The layered composite consists of two elastic layers having different elastic constants and heights. Two bonded layers rest on a homogeneous elastic half plane and are pressed by a rigid cylindrical stamp. In this context, the Finite Element Method (FEM) based software called ANSYS is used for numerical solutions. The problem is solved under the assumptions that the contacts are frictionless, and the effect of gravity force is neglected. A comparison is made with analytical results in the literature to verify the model created and the results obtained. It was found that the results obtained from analytical formulation were in perfect agreements with the FEM study. The numerical results for the stress-intensity factor (SIF) are obtained for various dimensionless quantities related to the geometric and material parameters. Consequently, the effects of these parameters on the stress-intensity factor are discussed. If the FEM analysis is used correctly, it can be an efficient alternative method to the analytical solutions that need time.

플라스틱 기판위의 기계적으로 유연성을 가진 PZT 박막 (Mechanically Flexible PZT thin films on Plastic Substrates)

  • 노종현;안종현;안정호;이내응;김상진;이환수
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.13-13
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    • 2009
  • We have investigated the fabrication and properties of bendable PZT film formed on plastic substrates for the application in flexible memory. These devices used the PZT active layer formed on $SiO_2/Si$ wafer by sol-gel method with optimized device layouts and Pt electrodes. After etching Pt/PZT/Pt layers, patterned by photolithography process. these layers were transferred on PET plastic substrate using elastomeric stamp. The level of performance that can be achieved approaches that of traditional PZT. devices on rigid bulk wafers.

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