• Title/Summary/Keyword: rf sputter

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A Study on CdS Deposition using Sputtering (Sputtering을 이용한 CdS 증착에 관한 연구)

  • Lee, Dal-Ho;Park, Jung-Cheul
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.13 no.4
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    • pp.293-297
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    • 2020
  • This paper tried to find the best conditions that could be applied to solar cells by deposition of CdS thin film on ITO glass using multiplex displacement sputter system. RF power was changed to 50W, 100W, and 150W and sputtering time was set to 10 minutes. As a result of the measurement of transmittance, the average transmittance in the area of 400 to 800 nm was measured from 60% to 80% and the best characteristic was measured at 150W at 84%. The band gap was also measured at 3.762eV at 50W, 4.037eV at 100W and 4.052eV at 150W. In XRD analysis, even as RF power was increased, it was observed as a structure called Wurtzite (hexagonal) of CdS. And as RF power increased, the particles were large and uniformly deposited, but at 100W the particles were densely composed and dense. And the thickness measurement showed that the RF power increased uniformly.

Properties of Transparent Conducting Zinc Oxide Films Prepared by RF Sputtering (RF Sputter 방법으로 제조한 투명전도막 ZnO 특성)

  • Choe, Byung-Ho
    • Korean Journal of Materials Research
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    • v.2 no.5
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    • pp.360-365
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    • 1992
  • Ga-doped polycrystalline ZnO films on glass substrates were prepared by sputtering the targets, which had been prepared by sintering discs consisting of ZnO powder and various amounts of G$a_2O_3$, to investigate the effects of gallium doping and sputtering conditions on electrical properties. Optimizing the RF power density, argon gas pressure and gallium content, transparent Ga-doped ZnO films with resistivity less than 1$0^{-3}$ohm-cm are obtained. Electron concentration of undoped and Ga-doped ZnO films are order of $10^{18}$, $10^{21}$/c$m^2$respectively. After heat treatment in air and $N_2atmosphere, $ the resistivity of Ga-doped ZnO films increases by about two orders of magnitude. The optical transmission is above 80% in the visible range and the optical band widens as the Ga content increases.

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Characterization of zinc tin oxide thin films by UHV RF magnetron co-sputter deposition

  • Hong, Seunghwan;Oh, Gyujin;Kim, Eun Kyu
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.307.1-307.1
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    • 2016
  • Amorphous zinc tin oxide (ZTO) thin films are being widely studied for a variety electronic applications such as the transparent conducting oxide (TCO) in the field of photoelectric elements and thin film transistors (TFTs). Thin film transistors (TFTs) with transparent amorphous oxide semiconductors (TAOS) represent a major advance in the field of thin film electronics. Examples of TAOS materials include zinc tin oxide (ZTO), indium gallium zinc oxide (IGZO), indium zinc oxide, and indium zinc tin oxide. Among them, ZTO has good optical and electrical properties (high transmittance and larger than 3eV band gap energy). Furthermore ZTO does not contain indium or gallium and is relatively inexpensive and non-toxic. In this study, ZTO thin films were formed by UHV RF magnetron co-sputter deposition on silicon substrates and sapphires. The films were deposited from ZnO and SnO2 target in an RF argon and oxygen plasma. The deposition condition of ZTO thin films were controlled by RF power and post anneal temperature using rapid thermal annealing (RTA). The deposited and annealed films were characterized by X-ray diffraction (XRD), atomic force microscope (AFM), ultraviolet and visible light (UV-VIS) spectrophotometer.

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The crystalline characteristics of ZnO deposited on various cooling rates by RF sputter (RF 스퍼터링 법에 의한 ZnO 박막의 결정성과 기판의 냉각속도)

  • Park, Sung-Hyun;Lee, Neung-Hun;Ji, Seung-Han;Jeon, Seok-Hwan;Lee, Sang-Hoon;Chu, Soon-Nam
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.11a
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    • pp.257-258
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    • 2006
  • ZnO thin films were prepared by RF magnetron sputter deposition on p-Si(100) wafer with various cooling rates of substrate temperature such as the substrates were pre-heated to $400^{\circ}C$ before the deposition and then cooled down naturally or slowly to $300^{\circ}C$, $200^{\circ}C$, $100^{\circ}C$, and R.T., by the temperature controller during the deposition. The crystall me and micro-structural characteristics of the films were investigated by XRD and SEM ZnO films which cooled down naturally or slowly by temperature controller during deposition, especially the film were deposited with cooling down from $400^{\circ}C$ to $200^{\circ}C$ slowly, showed the most outstanding c-axis preferred orientation.

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A thin film condition of material for AR and HR coating by the DC/RF Magnetron Sputter (DC/RF Magnetron Sputter를 이용한 무반사 및 고반사 박막증착)

  • Yang, Jin-Seok;Jo, Woon-Jo;Lee, Cheon;Kim, Dong-Woo;Shinn, Chun-Kyo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.04a
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    • pp.206-209
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    • 2003
  • The purpose of AR and HR coating is acquire the very low reflection rate and the high reflection rate through the deposition of a thin film using the refraction ofmaterial. Basically if the high refractive material and the low refractive material are chosen and the condition for the experiment is determined, then we solve theproject with the optical design and multi thin film coating. First of all, we choose $SiO_2$for the low refractive material and $TiO_2$ for the high refractive material and apply Sputtering System easy to control the refraction rate and excellent in reconstruction to the equipment of thin film multiplication. For the control of the refraction rate and growth rate we modify RF Power and the ratio of Gas(Ar:O2), And we use Ellipsometer for estimation and analysis of the refraction rate and growth rate and AFM&SEM for the analysis of surface and component.

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DC/RF Magnetron Co-Sputter를 이용하여 성막한 유기 태양 전지용 Si-Doped $In_2O_3$ (ISO) 박막의 특성 연구

  • Lee, Hye-Min;Gang, Sin-Bi;Jeong, Gwon-Beom;Kim, Han-Gi
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.327-327
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    • 2013
  • 본 연구에서는 $SiO_2$ Target과 $In_2O_3$ Target으로 co-sputtering방법을 이용해 증착한 Si-doped $In_2O_3$ (ISO) 박막의 Si 도핑 농도에 따른 전기적, 광학적, 구조적 특성에 대해 연구하였고, 이를 유기태양 전지(OPVs) 에 적용함으로써 그 가능성을 타진하였다. $In_2O_3$ target의 DC power를 100 W로 고정시킨 채 $SiO_2$ target의 RF power 크기를 20~60 W 변화시키면서 상온에서 실험을 진행한 결과 최적 조건은 박막의 두께가 200 nm일 때 Working pressure는 3 mTorr이고, RF power는 50 W이었다. 이 조건으로 제작된 ISO 박막은 550 nm에서 81.51%의 광투과율과 51.91 Ohm/sq.의 비교적 낮은 면저항이 나타남을 Hall measurement 및 UV/Vis spectroscopy 분석을 통해 알 수 있었다. 또한 X-ray diffraction 분석법과 Transmission Electron Microscope 분석법을 통해 $SiO_2$ 도핑 power가 50 W 이상으로 증가할 경우 ISO 박막의 결정성이 감소하여 완벽한 비정질상의 ISO 투명박막이 형성됨을 확인할 수 있었다. 비정질 특성을 갖는 ISO 투명 전극을 이용하여 유기 박막형 태양전지를 제작한 결과 Voc (0.576 V), Jsc (7.671 mA/$cm^2$), FF (62.96%), PCE (2.78%)의 특성을 나타냄으로서 co-sputtering 공정을 통해 최적화된 ISO 박막을 유기 박막형 태양전지에 적용함으로써 광전소자로의 적용 가능성을 확인할 수 있었다.

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Characteristic of Copper Films on PET Substrate Deposited by Cyclic Operation of RF-magnetron-sputtering Coupled with Continuous Operation of ECR-CVD (연속 ECR-CVD 조업하에 RF-magnetron-sputter의 싸이클조업을 통해 PET위에 올려진 구리박막의 특성)

  • Myung JongYun;Jeon Bupju;Byun Dongjin;Lee Joongkee
    • Korean Journal of Materials Research
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    • v.15 no.7
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    • pp.465-472
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    • 2005
  • Preparation of copper film on PET substrate was carried out by cyclic operation of RF-magnetron­sputtering under continuous operation of ECR-CVD. The purpose of this study is aimed to an increase in deposition rate with keeping excellent adhesion between copper film and PET. In order to optimize the sputtering time under continuous ECR-CVD, cyclic operation concept is employed. By changing parameters of cyclic operation such as split of e and cycle time of A, the characteristics and thickness of the deposited copper film are controlled. As $\theta$ value increase, film thickness could confirm to increase and its surface resistivity value decreases. The highest adhesive strength appears at $\theta=0.33$ and cycle time of 30 min. The uniformity of copper film shows $5\%$ in our experimental range.

The electrical properties of Ni/Cr/Si thin film with sputtering process parameters (스퍼터링 조건변화에 따른 Ni/Cr/Si 박막의 전기적 특성)

  • Lee, Boong-Joo;Park, Gu-Bum;Kim, Byung-Soo;Lee, Duck-Chool
    • The Transactions of the Korean Institute of Electrical Engineers P
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    • v.52 no.2
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    • pp.56-60
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    • 2003
  • In this work, we have fabricated thin film resistors using the DC/RF magnetron sputter of 51wt%Ni-41wt%Cr-8wt%Si alloy target and studied the effect of the process parameters on the electrical properties. In fabrication process, sputtering power, substrate temperature and annealing temperature have been varied as controllable parameters. TCR decreases with increasing the substrate temperature, but TCR increases over 300 [$^{\circ}C$]. The films are annealed to 400 [$^{\circ}C$] in air atmosphere, TCR increases with increasing the annealing temperature. The resistivity was 172 [${\mu}{\Omega}{\cdot}cm$] and 209 [${\mu}{\Omega}{\cdot}cm$] for the RF and DC as a sputtering power sources, respectively. Also, TCR was -52 [$ppm/^{\circ}C$] and -25 [$ppm/^{\circ}C$]. As a results of them, it is suggested that the sheet resistance and TCR of thin films can be controlled by variation of sputter process parameter and annealing of thin film.