• Geomechanics and Engineering
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• v.19 no.2
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• pp.105-114
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• 2019

In this paper, simulation tests were conducted with similar materials to study the distribution of residual voids in longwall goaf. Short-time step loading was used to simulate the obvious deformation period in the later stage of arch breeding. Long-time constant loading was used to simulate the rheological stage of the arch forming. The results show that the irregular caving zone is the key area of old goaf for the subsidence control. The evolution process of the stress arch and fracture arch in stope can be divided into two stages: arch breeding stage and arch forming stage. In the arch breeding stage, broken rocks are initially caved and accumulated in the goaf, followed by the step deformation. Arch forming stage is the rheological deformation period of broken rocks. In addition, under the certain loads, the broken rock mass undergoes single sliding deformation and composite crushing deformation. The void of broken rock mass decreases gradually in short-time step loading stage. Under the water lubrication, a secondary sliding deformation occurs, leading to the acceleration of the broken rock mass deformation. Based on above research, the concept of equivalent height of residual voids was proposed, and whose calculation equations were developed. Finally, the conceptual model was verified by the field measurement data.

• Geomechanics and Engineering
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• v.21 no.5
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• pp.423-432
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• 2020

Hydraulic conductivity is one of the engineering properties of soil. This study focusses on the influence of cement content on the hydraulic conductivity of cemented sand, which is investigated based on the results from numerical analysis and laboratory testing. For numerical analysis the cemented samples were scanned using X-ray Computed Tomography (CT) while laboratory testing was carried out using a triaxial setup. Numerical analysis enables us to simulate flow through the sample and provides insight to the microstructure. It quantifies the pore volume, proportion of interconnected voids and pore size distribution in both cemented and uncemented samples, which could be computed only through empirical equations in case of laboratory testing. With reduction in global voids, the interconnecting voids within the samples also reduce with cement content. Gamma cumulative distribution function is used to predict the percentage of voids lesser than a given pore volume. Finally, the results obtained from both numerical analysis and laboratory testing are compared.

• Journal of Electrical Engineering and Technology
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• v.10 no.5
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• pp.2089-2098
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• 2015

With the continuous development in insulation of electrical equipment design, the reliability of the system has been enhanced. However, in the manufacturing process and during operation under continues stresses introduce local defects, such as voids between interfaces that can responsible to occurrence of partial discharge (PD), electric field distortion and accumulation of charges. These defects may lead to localize corrosion and material degradation of insulation system, and a serious threat to the equipment. A model of three layers of PI film with air gap is presented to understand the influence of interface and voids on exploitation conditions such as strong electrical field, PD activity and charge movement. The analytical analysis, and experimental results are good agreement and show that the lose contact between interfaces accumulate more residual charges and in consequences increase the electric field intensity and accelerates internal discharges. These residual charges are trapped charges, injected by the electrodes has often same polarity, so the electric field in cavities increases significantly and thus partial discharge inception voltage (PDIV) decreases. Contrary, number of PD discharge quantity increases due to interface. Interfacial polarization effect has opposite impact on electric field and PDIV as compare to void.

• Journal of the Korean Vacuum Society
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• v.9 no.2
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• pp.162-166
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• 2000

High quality $Si_3N_4$ metal-insulator-metal (MIM) capacitors were realized by plasma enhanced chemical vapor deposition (PECVD). Titanium nitride (TiN) adapted as a diffusion barrier reduced the interfacial reaction between $Si_3N_4$ dielectric layer and aluminum metal electrode showing neither hillock nor observable precipitate along the interface. The capacitance and the current-voltage characteristics of the MIM capacitors showed that the minimum thickness of $Si_3N_4$ layer should be limited to 500 $\AA$ under the present process, below which most of the capacitors were electrically shorted resulting in the devastation of on-wafer yield. According to the transmission electron microscopy (TEM) on the cross-sectional microstructure of the capacitors, the dielectric breakdown was caused by slit-like voids formed at the interface between TiN and $Si_3N_4$ layers when the thickness of $Si_3N_4$ layer was less than 500 $\AA$. Based on the calculation of thermally-induced residual stress, the formation of voids was understood from the mechanistic point of view.

• Journal of Industrial Technology
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• v.35
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• pp.3-8
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• 2015

A study has been made on defects which are formed in manufacturing processes of engine bearing and also on fatigue crack growth behavior in each step of bearing metal manufacturing. After the first step(sinter brass powder on steel plate ; Series A) many voids are made on brass surface and its size is decreased by the second step(rolling process of sintered plate ; Series B). After the third step(re-sintering step of brass powder and rolling ; Series C) the number of voids is decreased and its type shows line. The time of fatigue crack initiation and the growth rate of fatigue crack are in order of Series A, Series B, Series C. These reasons are that void fosters the crack initiation and growth, and residual stress made by rolling process effects on the crack growth rate in Series B, C. In forming and machining processes by use of final bearing metal, crack was observed at internal corner of flange and peeling off was observed at junction between steel and brass. Owing to the above crack and peeling off, it is considered that there is a possibility of fatigue fracture during the application time.

• Journal of Industrial Technology
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• v.31 no.A
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• pp.45-51
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• 2011

A study has been made on defects which are formed in manufacturing processes of engine bearing and also on fatigue crack growth behavior in each step of bearing metal manufacturing. After the first step (sinter brass powder on steel plate ; Series A) many voids are made on brass surface and its size is decreased at the second step (rolling process of sintered plate ; Series B). After the third step (re-sintering step of brass powder and rolling ; Series C) the number of voids is decreased and its type shows line. The time of fatigue crack initiation and the growth rate of fatigue crack are in order of Series A, Series B, Series C. These reasons are that void fosters the crack initiation and growth, and residual stress made by rolling process affects on the crack growth rate in Series B, C. In forming and machining processes by use of final bearing metal, crack was observed at internal corner of flange and peeling off was observed at interface between steel and brass. Owing to the above crack and peeling off, it is considered that there is a possibility of fatigue fracture during the application time.

• Composites Research
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• v.17 no.3
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• pp.1-7
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• 2004

In the vacuum assisted RTM (VARTM) process that has become the center of attention for manufacturing massive composite structures, a good evacuation of air in the fiber preform is recognized as the prime factor. The microvoids, or the dry spots, are formed as a result of improper gate/vent locations and the mold geometry. The non-uniform resin velocity at the flow front leads to the formation of microvoids in the fibers, whereas the air in the microvoids can migrate along with the resin flow during mold filling. The residual air in the internal voids of a composite structure may cause a degradation of the mechanical properties as well as the structural failure. In this study, a unified macro- and micro analysis methods were developed to investigate the formation and transport of air in resin during VARTM process. A numerical simulation program was developed to analyze the three-dimensional flow pattern as well as the macro- and microscopic distribution of air in a composite part fabricated by VARTM process.

• Tribology and Lubricants
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• v.13 no.1
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• pp.42-52
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• 1997

This paper deals with wear characteristics of ion-nitrided metal theoretically and experimentally in order to analysis of wear phenomena. Wear tests show that compound layer of ion-nitrided metal reduces wear rate when the applied wear load is mall. However, as th load becomes large, the existence of compound layer tends to increase wear rate. The residual stress at the surface of ion-nitrided metal is measured, and the internal stress distribution is calculated when the normal and tangential forces are applied to the surface of metal. Compressive residual stress is largeest at the compound layer, and decreases as the depth from the surface increases. Calculation shows that the maximum stress exists at a certain depth from the surface when normal and tangential force are applied, and that the larger the wear load is the deeper the location of maximum stress becomes. In the analysis, it is found that under small applied wear load the critical depth, where voids and cracks may be created and propagated, is located at the compound layer, as the adhesive wear, where hardness is an important factor, is created the existence of compound layer reduces the amount of wear. When the load becomes large the critical depth is located below the compound layer, and delamination, which may be explained by surface deformation, crack nucleation and propagation, is created, and the existence of compound layer increases wear rate.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.2
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• pp.98-102
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• 2010

This paper describes that single crystalline 3C-SiC (cubic silicon carbide) thin films have been deposited on carbonized Si(100) substrates using hexamethyldisilane (HMDS, $Si_2(CH_3){_6}$) as a safe organosilane single precursor and a nonflammable mixture of Ar and $H_2$ gas as the carrier gas by APCVD at $1280^{\circ}C$. The deposition was performed under various conditions to determine the optimized growth condition. The crystallinity of the 3C-SiC thin film was analyzed by XRD (X-ray diffraction). The surface morphology was also observed by AFM (atomic force microscopy) and voids between SiC and Si interfaces were measured by SEM (scanning electron microscopy). Finally, residual strain and hall mobility was investigated by surface profiler and hall measurement, respectively. From these results, the single crystalline 3C-SiC film had a good crystal quality without defects due to viods, a low residual stress, a very low roughness.

• Journal of Sensor Science and Technology
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• v.22 no.3
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• pp.175-180
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• 2013

This paper describes the characteristics of cubic silicon carbide (3C-SiC) films grown on a carbonized Si(100) substrate, using hexamethyldisilane (HMDS, $Si_2(CH_3)_6$) as a safe organosilane single precursor in a nonflammable $H_2$/Ar ($H_2$ in Ar) mixture carrier gas by atmospheric pressure chemical vapor deposition (APCVD) at $1280^{\circ}C$. The growth process was performed under various conditions to determine the optimized growth and carbonization condition. Under the optimized condition, grown film has a single crystalline 3C-SiC with well crystallinity, small voids, low residual stress, low carrier concentration, and low RMS. Therefore, the 3C-SiC film on the carbonized Si (100) substrate is suitable to power device and MEMS fields.