• Journal of The Korean Society of Agricultural Engineers
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• v.63 no.2
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• pp.19-31
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• 2021

The Ministry of Maritime Affairs and Fisheries has been promoting the 'Fishing Village Specialization Capacity Enhancement Project' to pursue sustainable development of villages such as income generation by using local tangible and intangible resources led by local residents at the village level since 2013. For the fishing village-Specialization capacity enhancement project, six training sessions (mainly in the village unit) are selected by the public offering method, and the project (income generating business, village development project, etc.) is developed for the selected village residents. It has a process of establishing a village project plan (a preliminary plan for village development or a sixth preliminary industrialization plan) based on the training of experts 5 times, practice or excursion 1 time). In this study, four villages in Gangwon-do fishing villages (two coastal villages and two inland water villages) were surveyed on the perception and satisfaction of fishing village development projects before and after training. The survey analysis was conducted by dividing the analysis of resident capacity and satisfaction into personal, interpersonal, and social dimensions. The survey was conducted by distributing a survey before and after training, and a 1:1 survey was conducted according to the residents' cognitive status. Based on the survey, factor analysis, reliability analysis, and analysis using the corresponding sample t-test showed an increase of 0.02 for Yangyang Mulchi fishing village, 0.11 for Samcheok Jangho fishing village, and 0.36 for Hongcheon River fishing industry, but Yanggu Jinmok fishing industry was -0.29, unlike other regions. As a result of this analysis, it has been empirically proven that provision of training projects through resident participation is a very important factor for the success of the fishing village project. Therefore, rather than fostering local leaders, training and community activities to strengthen personal capacities of residents participating in the project, it is necessary to operate the software business with a focus.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.10
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• pp.597-602
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• 2017

A method is proposed to secure the reliability of the antibacterial test method for textile materials used in the military. Antibacterial activity refers to the inhibition of bacterial growth and removal of harmful bacteria. Through KS K 0693 'Antibacterial Test Method for Textile Material', it is considered that there is a high possibility of error due to the human eye measurement. Therefore, the measurement reliability is improved by applying the image processing. As a result of the measurement, the proposed method showed a difference of about 0.9% compared with the results by conventional test method. The proposed method has the merits that the reliability can be secured by eliminating the error of the measurer, and the measurement time can be reduced.

• Journal of Internet Computing and Services
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• v.7 no.6
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• pp.175-183
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• 2006

An ad-hoc network is a group of mobile nodes acting as routers. The of hoc node has a precondition of mobility, allowing path to be easily disconnected when transmitting data, thereby increasing network overhead. However, most of hoc routing protocols set up the path based only on the number of hops without considering other practical factors. Here we consider a path with the least substantial number of transmission (SNT) from source to destination based on reliabilities of links. This includes retransmissions due to unreliable links. In this paper, an efficient ad-hoc link reliability based routing (PU) protocol suitable for mobile ah-hoc network in terms of SNT, is proposed. The network overhead and data transmission delay ore reduced, by considering both ad-hoc link reliability and the number of hops. Our empirical performance evaluation comparing to AODV (8) shows that the enhancement is up to about 31% for SNT depending upon the mobility of nodes.

• KIPS Transactions on Software and Data Engineering
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• v.8 no.7
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• pp.265-274
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• 2019

The reliability test performed when developing the weapon system software is classified into static test and dynamic test. In static test, checking the coding rules, vulnerabilities and source code metric are performed without executing the software. In dynamic test, its functions are verified by executing the actual software based on requirements and the code coverage is measured. The purpose of this static/dynamic test is to find out defects that exist in the software. However, there still exist defects that can't be detected only by the current reliability test on the weapon system software. In this paper, whether defects that may occur in the software can be detected by static test and dynamic test of the current reliability test on the weapon system is analyzed through experiments. As a result, we provide guidance on improving the reliability test of weapon system software, especially the dynamic test.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.7
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• pp.406-418
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• 2020

When developing weapons systems, it is important to implement the functions and performance of equipment suitable for development purposes, but it is very important to ensure that the equipment is capable of operating without any vacuum with reliability after development. Therefore, various activities are carried out to enhance reliability of equipment. Reliability is enhanced by using high-specification parts in development, reliability verification through analysis, and testing using development prototypes to reinforce and improve the parts that are lacking in equipment. However, recently, development schedules are shortened due to rapidly changing external conditions and technologies, and there are cases where sufficient reliability growth activities were not carried out due to problems such as cost. Examples are projects that perform reliability activities only in analytical methods (reliability, FMECA). In this paper, analyzing and testing methods for analysis and testing were carried out on the same equipment through FMECA and super-accelerated life test, the contents of reliability growth activity were derived, the results of design change/review were accordingly compared, the differences between the two methods were analyzed, and measures were proposed to strengthen reliable growth activities. It was concluded that reliable growth activities through analysis from the beginning of development and reliable growth activities through testing should be carried out at the completion of initial prototype production.

• Korean Journal of Radiology
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• v.23 no.3
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• pp.298-307
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• 2022

Objective: This study aimed to evaluate the effect of implementing the consensus statement from the Asian Society of Cardiovascular Imaging-Practical Tutorial 2020 (ASCI-PT 2020) on the reliability of cardiac MR with late gadolinium enhancement (CMR-LGE) myocardial viability scoring between observers in the context of ischemic cardiomyopathy. Materials and Methods: A total of 17 cardiovascular imaging experts from five different countries evaluated CMR obtained in 26 patients (male:female, 23:3; median age [interquartile range], 55.5 years [50-61.8]) with ischemic cardiomyopathy. For LGE scoring, based on the 17 segments, the extent of LGE in each segment was graded using a five-point scoring system ranging from 0 to 4 before and after exposure according to the consensus statement. All scoring was performed via web-based review. Scores for slices, vascular territories, and total scores were obtained as the sum of the relevant segmental scores. Interobserver reliability for segment scores was assessed using Fleiss' kappa, while the intraclass correlation coefficient (ICC) was used for slice score, vascular territory score, and total score. Inter-observer agreement was assessed using the limits of agreement from the mean (LoA). Results: Interobserver reliability (Fleiss' kappa) in each segment ranged 0.242-0.662 before the consensus and increased to 0.301-0.774 after the consensus. The interobserver reliability (ICC) for each slice, each vascular territory, and total score increased after the consensus (slice, 0.728-0.805 and 0.849-0.884; vascular territory, 0.756-0.902 and 0.852-0.941; total score, 0.847 and 0.913, before and after implementing the consensus statement, respectively. Interobserver agreement in scoring also improved with the implementation of the consensus for all slices, vascular territories, and total score. The LoA for the total score narrowed from ± 10.36 points to ± 7.12 points. Conclusion: The interobserver reliability and agreement for CMR-LGE scoring for ischemic cardiomyopathy improved when following guidance from the ASCI-PT 2020 consensus statement.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.376-376
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• 2012

Semiconductor nanowires (NWs) are future building block for nano-scale devices. Especially, Ge NWs are fascinated material due to the high electrical conductivity with high carrier mobility. It is strong candidate material for post-CMOS technology. However, thermal stability of Ge NWs are poor than conventional semiconductor material such as Si. Especially, when it reduced size as small as nano-scale it will be melted around CMOS process temperature due to the melting point depression. Recently, Graphene have been intensively interested since it has high carrier mobility with single atomic thickness. In addition, it is chemically very stable due to the $sp^2$ hybridization. Graphene films shows good protecting layer for oxidation resistance and corrosion resistance of metal surface using its chemical properties. Recently, we successfully demonstrated CVD growth of monolayer graphene using Ge catalyst. Using our growth method, we synthesized Ge/graphene core/shell (Ge@G) NW and conducted it for highly thermal stability required devices. We confirm the existence of graphene shell and morphology of NWs using SEM, TEM and Raman spectra. SEM and TEM images clearly show very thin graphene shell. We annealed NWs in vacuum at high temperature. Our results indicated that surface melting phenomena of Ge NWs due to the high surface energy from curvature of NWs start around $550^{\circ}C$ which is $270^{\circ}C$ lower than bulk melting point. When we increases annealing temperature, tip of Ge NWs start to make sphere shape in order to reduce its surface energy. On the contrary, Ge@G NWs prevent surface melting of Ge NWs and no Ge spheres generated. Furthermore, we fabricated filed emission devices using pure Ge NWs and Ge@G NWs. Compare with pure Ge NWs, graphene protected Ge NWs show enhancement of reliability. This growth approach serves a thermal stability enhancement of semiconductor NWs.

• Korean Chemical Engineering Research
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• v.52 no.1
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• pp.26-39
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• 2014

Cu interconnection in electronic devices is fabricated via damascene process including Cu electrodeposition. In this review, Cu electrodeposition and superfilling for fabricating Cu interconnection are introduced. Superfilling results from the influences of organic additives in the electrolyte for Cu electrodeposition, and this is enabled by the local enhancement of Cu electrodeposition at the bottom of filling feature formed on the wafer through manipulating the surface coverage of organic additives. The dimension of metal interconnection has been constantly reduced to increase the integrity of electronic devices, and the width of interconnection reaches the range of few tens of nanometer. This size reduction raises the issues, which are the deterioration of electrical property and the reliability of Cu interconnection, and the difficulty of Cu superfilling. The various researches on the development of organic additives for the modification of Cu microstructure, the application of pulse and pulse-reverse electrodeposition, Cu-based alloy superfilling for improvement of reliability, and the enhancement of superfilling phenomenon to overcome the current problems are addressed in this review.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.