• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 춘계학술대회 논문집
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• pp.241-244
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• 2004

Microlens patterned micro-mold fabrication method for Light Guiding Plate(LGP), kernel part of LCD-BLU(Back Light Unit), was presented. Instead of erosion dot pattern for LCP optical design, microlens pattern, fabricated by LIGA-reflow process, was applied. Optical pattern design method was also developed not only for negative pattern LGP, but also positive pattern LGP. In order to achieve flow balance during the micro-injection molding process and dimensional accuracy, two LGP pattern was made in one micro-mold.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.644-647
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• 2003

Resulting from reproducibility and possibility of mass production. many researches to fabricate micro lens array using lithography have been developed. However, it still remains the level of fabricating compensation lens. Therefore, to realize the fabrication of lens having high numerical aperture can be the key technology of ultra slim optical system. Reflow phenomenon have been researched to make lens having high refractive power. And through those researches, the possibility to fabrication of high refractive power lens has been investigated. In this paper, we analyze the effect of many parameters in reflow process to get an aspheric shape with high repeatability. And we make possible to estimate shape error, through we give direct information about decrease in volume of photoresist.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.254-256
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• 2007

In this paper, the effects of the reflow number in the mechanical reliability of flip chip solder joint was investigated by flip chip shear test and thermal shock test. For evaluation mechanical reliability of flip chip, We experiment that specimens were operated 3-times, 6-times, 9-times, 12-times under reflow Process. After shear test and thermal shock test, We measured max shear strength and coming first crack number of thermal cycle. And We observe fracture surface and cross section by using SEM(Scanning Electron Microscope) and optical scope. In the results, the more specimens were operated reflow process, the more decreased maximum shear strength and number of thermal cycle.

• 설비공학논문집
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• 제14권1호
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• pp.1-9
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• 2002

The thermal response of electronic components during infrared reflow soldering is studied by a two-dimensional numerical model. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated. Parametric study is also performed to determine the thermal response of electronic components to various conditions such as conveyor velocities, exhaust velocities and emissivities. The results of this study can be used in selecting the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly stresses.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1994년도 추계 학술발표 강연 및 논문 개요집
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• pp.186-187
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• 1994

• 한국재료학회:학술대회논문집
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• 한국재료학회 1996년도 재료학회 추계학술발표회
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• pp.83-83
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• 1996

• 대한미세수술학회:학술대회논문집
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• 대한미세수술학회 1994년도 제14차 학술대회
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• pp.102.2-103
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• 1994

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2000년도 춘계학술발표회 초록집
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• pp.23-23
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• 2000

• 한국전기전자재료학회논문지
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• 제28권5호
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• pp.306-313
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• 2015

In this study, the change of optical characteristics was studied according to the micro optical pattern provided by photo lithography followed by thermal reflow process. The shape and luminance variation with micro pattern was evaluated by SEM and spectrometers. Also, we analyzed the luminance characteristics using the 3D-optical simulation (Optis works) program. As a result, we found that the radius of curvature(R) in micro pattern is decreased up to 77%($150^{\circ}C$) compared to the radius of curvature at the condition $100^{\circ}C$, which is caused by efficient reflow of organic material without chemical changes. The highest enhancement of brightness with optimum micro pattern was obtained at the condition of $120^{\circ}C$ reflow process. The brightness gain with optical micro patterns is more than 15% at the condition of R=16.95 um, ${\Theta}=77.14^{\circ}$ compared to original optical source. The results of light simulation with various radius of curvature and side angle of pattern shows the similar result of experiment evaluation of light behavior on optical micro patterns. It is regarded that the more effect on light enhancement was contributed by side angle which is effective factor on light reflection, rather than the curvature of micro-patterns.

• 한국자동차공학회논문집
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• 제21권3호
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• pp.134-141
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• 2013

Reflow soldering process is essential in electronic package. Reflow process for a long time results from the decrease of reliability because IMC is formed excessively. Solder alloys of Sn-37Pb and Sn-Ag with different kinds of Cu contents (0, 0.5 and 1 wt.%) as compared with Ni and Cu plate joints are investigated according to varying reflow time. The interfaces of solder joints are observed to analyze IMC (intermetallic compound) growth rate by scanning electron microscope (SEM). Shear test is also performed by using SP (Share-Punch) tester. The test results are compared with the solder joints of two different plates (Ni and Cu plate). $Cu_6Sn_5$ IMCs are formed on Cu plate interfaces after reflows in all samples. Ni3Sn4 and $(Cu,Ni)_6Sn_5$ IMCs are also formed on Ni plate interfaces. The IMC layer forms are affected by reflow time and contents of solder alloy. These results show that mechanical strength of solder joints strongly depends on thickness and shape of IMC.