• 대한기계학회논문집B
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• 제26권8호
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• pp.1115-1122
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• 2002

The present experiment investigates the effects of pore density f of aluminum foam heat sinks, the jet-to-jet spacing X and the nozzle plate-to-target surface spacing H of 3$\times$3 square impinging arrays on the averaged Nusselt number. The performance of the aluminum foam heat sinks and the rectangular plate heat sink is evaluated in terms of the enhancement factor. /equation omitted/. The multiple impinging jet with X/d=4.0 displays higher Nusselt numbers than single impinging jet for 12.0$\leq$H/d$\leq$20.0. With the variation of the jet-to-jet spacing, the aluminum foam heat sink of 10 PPI show higher Nusselt numbers than the 20 and 40 PPI aluminum foam heat sinks. Further, the 10 PPI aluminum foam heat sink demonstrates 26% higher enhancement factor than the rectangular plate heat sink in the range of 7000$\leq$Re$\leq$11000.

• 한국정보통신학회논문지
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• 제9권2호
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• pp.415-421
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• 2005

어레이 소자의 방사 또는 수신 특성은 소자 상호결합 효과 때문에 고립된 소자의 특성과 달라지게 되며, 따라서 어레이 성능은 고립된 소자를 가정하여 설계할 경우의 성능과 다르게 된다. 접지판 위에 위치한 삼각형 격자 구조를 가진 직사각형 다이폴 어레이에 미치는 상호 결합의 영향을 소자패턴을 고려하여 논의하였다. 소자 이득 함수를 이용하여 소자가 균일하게 분포되거나 소자간격이 체감된 어레이에서 부엽(sidelobe)에 미치는 소자 상호결합 효과의 영향을 점검하였다. 상호결합 효과가 존재할 때, 소자간격이 체감된 어레이에서의 부엽의 성능이 소자간격이 균일하게 분포된 어레이와 비교하여 향상되는 것을 보여주었다. 컴퓨터 시뮬레이션을 제시하였다.

• 한국자동차공학회논문집
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• 제5권6호
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• pp.128-140
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• 1997

A new super compact condenser(SCC), which has been developed recently is especially suitable for an alternative refrigerant HFC-134a due to its high performance and compactness. The SCC is composed of two pipe headers, baffles, narrow multi-rectangular channels, and louvered fin arrays. Alternating inlet and outlet by the inserted baffles in pipe headers guide refrigerant to and from the narrow multi-rectangular channels. Since the flow rate and its lengh are changed depending on the number and location of baffles, the corresponding pressure drop and heat transfer rate are changed. The present study aims to theoretically and experimentally investigate the effects of baffle location and its number on the pressure drop and thermal performance of the SCC with 40 multi-rectangular channels. The results show that the present method provides an acceptable prediction of pressure drop and heat transfer rate for a 4 pass SCC. However, the model significantly under predicts the performance of a 3 pass SCC, which may be attributed to the phase separation of refrigerant flowing through header pipes. Pressure drop is more signifi- cantly influenced than heat transfer rate by the baffle location.

• Journal of Advanced Marine Engineering and Technology
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• 제36권1호
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• pp.57-63
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• 2012

열전달 향상을 위하여 이차유동을 발생시켜 열전달을 증가시키는 방법에는 여러 가지가 있다. 본 연구에서는 수평채널에 딤플과 돌출을 설치하여 각각의 깊이와 높이를 변화시켰을 때의 압력강하 및 열전달 특성을 수치해석을 통하여 연구하였다. 딤플과 돌출은 수평채널의 윗면과 아래면 에 설치되었으며, 깊이 및 높이를 0.125, 0.25, 0.25, 0.3, 0.375로 하였다. 딤플의 경우, 후면부에서 높은 Nusselt 수가 나타났고 깊이가 커질수록 평균 Nusselt 수가 감소하였다. 돌출의 경우, 전면부에서 높은 Nusselt 수가 나타났고 높이가 커질수록 Nusselt 수가 증가하였다. 딤플과 돌출 모두 유속이 증가함에 따라 열전달이 향상되는 경향을 보였지만 성능계수는 감소하였다. 성능계수는 유속이 낮은 영역에서 가장 크게 나타났다.

• 대한기계학회논문집A
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• 제26권11호
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• pp.2450-2456
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• 2002

Microlenses and microlens arrays are fabricated using a novel fabrication technology based on the exposure of a resist (usually PMMA) to deep X-rays and subsequent thermal treatment. The fabrication technology is very simple and produces microlenses and microlens arrays with good surface roughness (less than 1 nm). The molecular weight and glass transition temperature of PMMA is reduced when it is irradiated with deep X-rays. The microlenses is produced through the effects of volume change, surface tension, and reflow during thermal treatment of irradiated PMMA. The geometry of the microlens is determined by parameters such as the X-ray dose applied to the PMMA, the diameter of the microlens, along with the heating temperature, heating time, and cooling rate in the thermal treatment. Microlenses are produced with diameters ranging from 30 to 1500 ${\mu}{\textrm}{m}$. The modified LIGA process is used not only to construct hemispherical microlenses but also structures that are rectangular-shaped, star-shaped, etc.

• 소성∙가공
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• 제15권1호
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• pp.9-14
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• 2006

In the present research, the simultaneous punching of ultra small size hole of $2\~10\;{\mu}m$ in diameter on flat rolled thin metal foils was conducted with elastic polymer punch. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of 1.5fm in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The process set-up is similar to that of the flexible rubber pad farming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions. The effects of the wafer die hole dimension and heat treatment of the workpiece on ultra small size hole formation of the thin foil were discussed. The process condition such as proper die shape, pressure, pressure rate and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole away in a one step operation.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 금형가공,미세가공,플라스틱가공 공동 심포지엄
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• pp.193-197
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• 2005

This paper presents a method by which multiple holes of ultra small size can be punched simultaneously. Silicon wafers were used to fabricate punching die. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of $1.5{\mu}m$ in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The diameter of holes ranges from $2-10{\mu}m$. The process set-up is similar to that of the flexible rubber pad forming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions, surface qualities, and potential defect. The effects of the die hole dimension on ultra small size hole formation of the thin foil were discussed. The optimum process condition such as proper die shape and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole array in a one step operation.

• 전기학회논문지
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• 제56권1호
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• pp.161-166
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• 2007

In this paper, two 4$\times$4 rectangular patch array antennas operating at 20 GHz are implemented for the satellite communication. The sixteen patch antennas and microstrip feeding line are printed on a single-layered substrate. The design goal is to achieve high directivity and gain by optimizing design parameters through permutations in element spacing. The spacing between the array elements is chosen to be 0.736$\lambda$. Numerical simulation results indicate that the HPBW(Half-Power Beam Width) of the 4$\times$4 patch array antenna is 18.78 degrees in the E-plane and 18.48 degrees in the H-plane with a gain of 17.18 dBi. Numerical simulations of a 4$\times$4 recessed patch array antenna yield a HPBW of 18.71 degrees in the E-plane and 17.82 degrees in the H-plane with a gain of 19.43 dBi.

• 한국수학사학회지
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• 제23권1호
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• pp.25-40
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• 2010

사람의 인지능력의 성장 원리를 도출하고, 구장산술의 8장 방정의 1차 연립방정식 이론의 전개 방식을 살펴본다. 도출해낸 인지능력의 성장 원리에 입각하여 구장산술의 서술 방식의 교육학적 의미를 분석한다.

• 설비공학논문집
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• 제8권2호
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• pp.230-239
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• 1996

A multi-faceted experimental investigation has been carried out to study the cooling performance for stacked modules in arrays of heat generating rectangular modules deployed along PCB's in the enclosed cabinet. The main parameters which have an important effect on cooling characteristics are flow velocity, channel spacing, installation of fan unit, attachment of heat sink, and acoustic noise. The results of individual effect are very helpful for the electronic packaging designer. In order to improve the cooling performance, it is certain that the enlargement of channel space is obviously effective, while this id disadvantageous in high density electronic packaging. Each of the paameters is quantitatively examined as cooling performance and the correlation of Reynolds number to Nusselt number is compared with previous study.