• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.211-211
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• 2012

The electrical loss of the photo-generated carriers is dominated by the recombination at the metal- semiconductor interface. In order to enhance the performance of the solar cells, many studies have been performed on the surface treatment with passivation layer like SiN, SiO2, Al2O3, and a-Si:H. In this work, Al2O3 thin films were investigated to reduce recombination at surface. The Al2O3 thin films have two advantages, such as good passivation properties and back surface field (BSF) effect at rear surface. It is usually deposited by atomic layer deposition (ALD) technique. However, ALD process is a very expensive process and it has rather low deposition rate. In this study, the ICP-assisted reactive magnetron sputtering method was used to deposit Al2O3 thin films. For optimization of the properties of the Al2O3 thin film, various fabrication conditions were controlled, such as ICP RF power, substrate bias voltage and deposition temperature, and argon to oxygen ratio. Chemical states and atomic concentration ratio were analyzed by x-ray photoelectron spectroscopy (XPS). In order to investigate the electrical properties, Al/(Al2O3 or SiO2,/Al2O3)/Si (MIS) devices were fabricated and characterized using the C-V measurement technique (HP 4284A). The detailed characteristics of the Al2O3 passivation thin films manufactured by ICP-assisted reactive magnetron sputtering technique will be shown and discussed.

• 한국표면공학회지
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• 제37권3호
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• pp.169-174
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• 2004

MgO thin films were reactively deposited using an internal inductively coupled plasma assisted sputtering method varying reactive gas ratio to get stoichiometric film composition, and bipolar dc substrate bias to suppress micro arcs. The minimum frequency required for arc suppression was about 10KHz depending on ICP power. Their crystallinity was analyzed using X-ray diffraction and surface morphology using AFM. The surface was very smooth with rms roughness less than 0.42nm. The preferred orientation of the films were changing from (200) to bulk-like characteristics as Ar: $O_2$ratio was controlled to 10 : 2. Optical emission spectroscopy revealed that there were two distinct discharge modes: a blue one and a green one, where enhanced emission from Ar and Mg were observed. This cannot simply be understood by metallic or oxide mode of reactive sputtering due to ICP coupled to magnetron discharge.

• 전기학회논문지P
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• 제52권3호
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• pp.107-112
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• 2003

Amorphous carbon nitride thin films have been deposited on silicon (100) by reactive magnetron sputtering method. The basic depositon parameters varied were the r.f. power(up to 250 W), the deposition pressure in the reactor(up to 100 mtorr) and Ar:$N_2$ gas ratio. FT-IR and X-ray photoelectron spectra showed the presence of different carbon-nitrogen bonds in the films. The surface topography of the films was studied by scanning electron microscopy(SEM) and atomic force microscopy(AFM).

• 전자공학회논문지D
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• 제35D권5호
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• pp.33-39
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• 1998

The BST (Ba$_{1-x}$ Sr$_{x}$TiO$_{3}$)(50/50) thin film has been grown by RF magnetron reactive sputtering and its characteristics such as crystallization, surface roughness, and electrical properties have been investigated with varying the film thickness. The crystallization and surface roughness of BST thin film are investigated by using XRD and AFM, respectively The BST thin film anealed at 800.deg. C for 2 min has pure perovskite structure and good surface roughness of 16.1.angs.. We estimate that the thickness and dielectric constant of interface layer between BST film and electrode are 3nm and 18.9, respectively, by measuring the capacitance with various film thickness. As the film thickness increases form 80nm to 240nm, the dielectric constant at 10kHz increases from 199 to 265 and the leakage current density at 200kV/cm decreases from 0.682.mu.A/cm$^{2}$ to 0.181 .mu.A/cm$^{2}$. In the case of 240nm-thick BST thin film, the charge storage density and leakage current density at 5V are 50.5fC/.mu.m$^{2}$ and 0.182.mu.A/cm$^{2}$, respectively. The values indicate that the BST thin film is a very useful dielectric material for the DRAM capacitor.or.

• 한국진공학회지
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• 제11권3호
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• pp.141-150
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• 2002

낮은 산소 부분압과 긴 타깃-기판 거리에서 DC 반응이온 마그네트론 스퍼터링(reactive magnetron sputtering ; RMS) 방법으로 $TiO_2$ 박막을 증착하였으며, 증착되는 박막에 end-Hall 이온 소스를 이용하여 아르곤 이온빔 보조 증착을 해 주었다. $TiO_2$ 박막의 광학적 특성은 분광광도계에서 측정된 투과율과 반사율 스펙트럼을 이용하여 분석하였고, 구조적 특성은 AFM과 XRD를 이용하여 분석하였다. 이온빔 보조 RMS 방법으로 증착된 $TiO_2$ 박막은 일반적인 RMS로 증착된 박막보다 조밀도가 높고, 흡수가 낮으며, 표면거칠기가 작았다. 본 연구에서는 이온빔 보조 RMS 방법이 유전체 광학박막 코팅에 적용될 수 있음을 보여준다.

• 한국전기전자재료학회논문지
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• 제18권11호
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• pp.977-982
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• 2005

Al/AlN/n-type 6H-SiC (0001) MIS structures were prepared by AlN layers on vicinal 6H-SiC(0001) substrates with reactive RF magnetron sputtering method. The AlN films were annealed at $900^{\circ}C$, $N_2$ atmosphere lot 1 minutes showed the best result. With XRD analysis, AlN(0002) peak was clearly found. The typical dielectric constant value of the AlN film in the MIS capacitors was obtained as 8.4 from photo C-V. Also, the gate leakage current density of the MlS capacitor was $10^{-10}\;A/cm^2$ order within the electric field of 1.8 MV/cm. Finally, the amount of interface trap densities, $D_{it}$, was evaluated as $5.3\times10^{10}\;eV^{-1}cm^{-2}$ at (Ec-0.85) eV.

• 한국세라믹학회지
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• 제36권11호
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• pp.1211-1216
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• 1999

TiO2 thin films were prepared by reactive magnetron sputtering on glass substrate and subjected into investigation about their hydrophilic properties. Varing Ar/O2 ration and post annealing at 50$0^{\circ}C$ for 12h anatase and rutile phases of TiO2 films were obtained. Hydrophilic properties were evaluated by determination of contact angle of water droplet on TiO2 surface. On as-annealed TiO2 films water droplet spreaded widely with ~0$^{\circ}$contact angle. Sonication(60 Hz, 28kHz 40kHz) and following dark room treatments turned these hydrophilic TiO2 films into hydrophobic state. All of hydrophobic films were converted recersibly into their original state after UV illumination. Hydrophobic states of anatase films were saturated after sonication and remain same during dark room treatment. But it was found that the conversion into hydrophobic state of rutile films progressed. further after sonication. Therefore it was concluded that Ti3+/Ti+4 ratio is the key to determine hydrophilicity of TiO2 surface so that different surface structure of polymorphs could lead to unique characteristics.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.195.1-195.1
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• 2013

Cu는 금속 박막재료로서 높은 전기전도성을 지니고 있을 뿐만 아니라 Ag, Al, Pt 등 보다 비용이 저렴하여, 높은 전기전도성을 필요로 하는 박막 재료로써 폭넓게 사용되고 있다. 그러나, 낮은 기계적 특성을 지니고 있어서 interconnect와 같은 작은 단면적의 배선재료로 사용될 경우, 높은 전류밀도에 따른 electromigration 현상에 의하여 hillock 또는 void의 형성 등 박막재료의 변형이 생기게 되어서 전자소자의 수명이 단축된다는 단점이 있다. TiN은 금속재료 못지않은 높은 전기 전도성을 지니고 있을 뿐만 아니라, 금속재료에 비하여 높은 기계적 특성과 녹는점을 지니고 있어 다양한 분야로 사용되고 있다. 본 연구에서는 Cu와 TiN composite 박막을 soda-lime glass위에 증착하여 낮은 비저항 뿐만 아니라 Cu와 비교하여 기계적 특성이 향상된 박막을 제작하고자 하였다. Cu와 TiN composite 박막 증착을 위하여 DC reactive magnetron co-sputtering 장비를 사용하였으며, Cu와 Ti 타겟 power, Ar:N2 유량비(Flow rate)을 변화시켜 Cu와 Ti의 조성비 및 TiN의 결정성을 조절하였고, 이를 통하여 박막의 TiN 조성에 따른 낮은 비저항 값과 순수한 Cu 박막과 비교하여 높은 기계적 특성을 지닌 Cu-TiN 박막을 증착하였다. Cu-TiN composite 박막의 구조 및 조성은 SEM (Scanning Electron Microscope), EDS (Energy Dispersive Spectrometer), XPS (X-ray Photoelectron Spectroscopy)장비를 사용하여 분석하였으며, 전기전도도는 4-point probe를 사용하여 측정하였고, Knoop hardness 측정방법을 사용하여 박막의 기계적 특성을 측정하였다.

• 한국결정성장학회지
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• 제6권4호
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• pp.493-500
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• 1996

Al이 2 wt% 포함되어 있는 Zn 금속타겟을 사용하여 반응성 직류 magnetron sputtering법으로 AZO(Aluminum doped zinc oxide) 투명전도막을 제조한 후 열처리함에 따라 변하는 박막의 전기적 광학적 특성을 조사하였다. 전이영역에서 증착된 막들은 비저항이 50 % 정도 감소하여 $1{\times}10^{-3}~3.5{\times}10^{-4}\;{\Omega}cm$로 전기적 특성이 향상되었으며, 높은 산소분압에서 산화물로 증착된 막의 비저항이 증착직후에는 $10^{3}\;{\Omega}cm$였으나 열처리 후에는 $2{\times}10^{-3}\;{\Omega}cm$로 감소하였다. 또 전이영역에서 증착된 막은 증착직후 59.4 %이던 평균투과율이 $400^{\circ}C$, 30분 열처리 후에는 77.4 %까지 향상되었다.

• 한국세라믹학회지
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• 제48권1호
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• pp.69-73
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• 2011

A $ZrO_2$ thin film as a corrosion protective layer was deposited on Zircaloy-4 (Z-4) clad material using $N_2O$ as a reactive gas by RF reactive magnetron sputtering at room temperature. The Z-4 substrate was located in plasma or out of plasma during the $ZrO_2$ deposition process to investigate mechanical and corrosive properties for the plasma immersion. Tetragonal and monoclinic phases were existed in $ZrO_2$ thin film immersed in plasma. We observed that a grain size of the $ZrO_2$ thin film immersed in plasma state is larger than that of the $ZrO_2$ thin film out of plasma state. In addition, the corrosive property of the $ZrO_2$ thin films in the plasma was characterized using the weight gains of Z-4 after the corrosion test. Compared with the $ZrO_2$ thin film immersed out of plasma, the weight gains of $ZrO_2$ thin film immersed in plasma were larger. These results indicate that the $ZrO_2$ film with the tetragonal phase in the $ZrO_2$ can protect the Z-4 from corrosive phenomena.