• Journal of the Korean Ceramic Society
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• v.31 no.10
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• pp.1115-1122
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• 1994

ZT/PZT/ZT multi-layered thin films were deposited on silicon substrate by co-sputtering method for FEMFET device application. Effects of Pb/(Zr+Ti) ratio, films thickness, annealing conditions and substrate temperature on the ferroelectric behavior of the multi-layered films were studied. The best memory device characteristics with leakage current of 2$\times$10-8 A/$\textrm{cm}^2$ and breakdown field of about 1 MV/cm could be obtained with ZT(250 $\AA$) / PZT(1000 $\AA$)/ZT(750 $\AA$) multi-layered thin film deposited at 35$0^{\circ}C$ and post-annealed at $700^{\circ}C$ for 120 sec by RTA(Rapid Thermal Annealing).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.2
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• pp.123-129
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• 2001

The optimal high temperature processing conditions for the formation of Ohmic contact of Ti/Al/Pt/Au multiple layers were established for the fabrication of n$^{+}$-GaN/AlGaN/GaN HFET device. Contact resistivity as low as 3.4x10$^{-6}$ ohm-$\textrm{cm}^2$ was achieved by the annealing of the sample at 100$0^{\circ}C$ for 10 sec. using the RTA (Rapid Thermal Annealing) system. The fabricated HFET (Heterostructure Field Effect Transistor) with a structure of n'-GaN/undoped AlGaN/undoped GaN exhibited a low knee voltage of 3.5 V and a maximum source-drain current density of 180 mA/mm at Vg=0V.V.

• Korean Journal of Materials Research
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• v.13 no.6
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• pp.398-403
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• 2003

Shallow $p^{＋}$ n junction was formed using a ULE(ultra low energy) implanter. Deactivation phenomena were investigated for the shallow source/drain junction based on measurements of post-annealing time and temperature following the rapid thermal annealing(RTA) treatments. We found that deactivation kinetics has two regimes such that the amount of deactivation increases exponentially with annealing temperature up to $850^{\circ}C$ and that it decreases linearly with the annealing temperature beyond that temperature. We believe that the first regime is kinetically limited while the second one is thermodynamically limited. We also observed "transient enhanced deactivation", an anomalous increase in sheet resistance during the early stage of annealing at temperatures higher than X$/^{\circ}C$. Activation energy for transient enhanced deactivation was measured to be 1.75-1.87 eV range, while that for normal deactivation was found to be between 3.49-3.69 eV.

• Journal of the Korean Ceramic Society
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• v.30 no.6
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• pp.510-516
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• 1993

$PbTiO_3$ thin films have been formed by rapid thermal annealing(RTA) of $TiO_2$/Pb/$TiO_2$ multilayer films deposited on Si wafers by RF sputtering. Based on the optimal depositon conditions of TiO2 and Pb, $TiO_2$/Pb/$TiO_2$ three layers were deposited for 900$\AA$ each. These films were subjected to RTA process at the temperatures ranging from $400^{\circ}C$ to $900^{\circ}C$ for 30 seconds in air, and were analyzed by X-ray diffraction and transmission electron microscopy to investigate the phases and the microstructures. As a result, perovskite $PbTiO_3$ phases was obtained above $500^{\circ}C$ with the trace of unreacted $TiO_2$. RBS analysis revealed the anisotropic behavior of diffusion that the diffusivity of Pb to the bottom $TiO_2$ layer was faster than that of Pb to the top $TiO_2$ layer. The amorphous Pb-silicate was formed between film and Si substrate due to the diffusion of Pb, but Pb-silicate existed locally at the interface and the amount of that phase was very small. Therefore the effect of bottom $TiO_2$ layer as a diffusion barrier was confirmed. $PbTiO_3$ films formed by current technique showed a relative dielectric constant of 60, and the maximum breakdown field reached 170kV/cm.

• Journal of the Korean Vacuum Society
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• v.11 no.1
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• pp.1-7
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• 2002

We deposited $Ba_{0.5}Sr_{0.5}TiO_3$(BST) thin-films on Pt/Ti/$SiO_2$/Si substrates using RF magnetron sputtering method. A Substrate temperature was fixed at room temperature, while working gas flow ratio and RF Power were changed from 90:10 to 60:40 and 50 W, 75 W respectively. Also after BST thin films were deposited, we performed annealing in oxygen atmosphere using Rapid Thermal Annealing. For capacitor application we deposited Pt using E-beam evaporator of UHV system. In a structural property study through XRD measurement we found that crystallization depends on annealing rather than working gas ratio or and RF Power. Electrical properties showed relatively superior characteristic on the annealed sample with 50 W of RF Power.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.414-414
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• 2013

InGaAlAs/InP은 $1.3{\sim}1.55{\mu}m$ 레이저 다이오드 응용을 위한 InGaAsP/InP를 대체하기 위한 물질로 많은 관심을 받아왔다. 디지털 합금 InGaAlAs 다중양자우물(multiple quantum wells: MQWs) 시료는 MBE (molecular beam epitaxy) 장비를 이용하여 n-InP 기판 위에 성장하였다. 양자우물과 장벽은 각각 (InGaAs)0.8(InAlAs)0.2와 (InGaAs)0.4(InAlAs)0.6 SPSs (short-period superlattices)로 $510^{\circ}C$에서 성장하였다. 발광특성을 향상시키기 위하여 질소분위기에서 $700^{\circ}C$ $750^{\circ}C$ 또는 $800^{\circ}C$에서 30초간 열처리(rapid thermal annealing: RTA)하였다. RTA 온도에 따른 디지털 합금 InGaAlAs MQWs의 발광특성을 분석하기 위해 PL (photoluminescence)과 TRPL(time-resolved PL)을 이용하였다. RTA 온도에 따른 InGaAlAs MQWs 시료의 발광 메카니즘 및 운반자 동력학을 연구하기 위하여 발광파장 및 온도에 따른 TRPL을 측정하였다. 저온(10 K)에서 PL 피크는 RTA 온도를 $700^{\circ}C$에서 $750^{\circ}C$로 증가하였을 때 1,242 nm에서 1,245 nm로 장파장 영역으로 이동하였다가 $800^{\circ}C$에서 열처리하였을 때 단파장 영역으로 이동하여 1,239 nm에서 나타났다. 또한 PL 세기는 RTA 온도를 증가함에 따라 증가함을 보이다가 RTA 온도를 $800^{\circ}C$로 증가하였을 때 PL 세기는 감소하였다. 발광소자 개발을 위한 InAlGaAs MQWs 시료의 최적의 열처리 조건을 이러한 PL과 TRPL 결과로부터 결정할 수 있다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.228.2-228.2
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• 2013

본 논문은 InN와 GaN를 교대로 증착하는 교번성장법(Alternate Growth Method)을 이용해 형성한 높은 인듐(Indium) 조성을 갖는 InGaN (HI-InGaN) 구조의 열처리(Rapid Thermal Annealing, RTA) 온도 및 시간에 대한 구조와 광학적 특성을 Double Crystal X-ray Diffraction (DCXRD), Transmission Electron Microscopy와 Photoluminescence (PL) 장비를 사용하여 분석한 결과를 보고한다. DCXRD 스펙트럼에서 HI-InGaN 박막은 GaN(0002)로부터 $2.98^{\circ}$ 분리된 위치에서 회절 신호를 관찰 할 수 있다. 그리고 GaN와 HI-InGaN 신호 사이의 넓은 범위에서 미약하지만 신호가 관찰 되는데, 이는 InN와 GaN 계면에서 발생하는 상호확산 확률의 차이에 기인한 In 조성이 다른 InGaN 신호로 해석할 수 있다. 열처리 온도를 $775^{\circ}C$로 고정하고 시간을 10, 20, 30초로 각각 변화시켜 RTA를 진행한 DCXRD 스펙트럼에서 GaN(0002)로부터 $0.7{\sim}1.1^{\circ}$ 떨어진 위치에서 InGaN 피크를 확인 할 수 있다. RTA 시간이 증가 할수록 HI-InGaN 신호의 위치가 GaN 피크 방향으로 이동하며, 세기가 증가하는 것을 확인 할 수 있다. HI-InGaN의 PL 스펙트럼에서 상온 발광파장은 1369 nm 이며, 반치폭(Line-width)은 51.02 nm을 보였다. RTA 수행 후 발광파장에 따른 광세기가 각각 달라졌으며, 특히 900 nm 부근의 신호가 상대적으로 크게 증가하는 것을 확인할 수 있었다. RTA에 따른 HI-InGaN의 구조 및 광학적 특성 변화를 InN와 GaN 계면에서 In, Ga 원자의 상호확산 효과현상으로 논의할 예정이다.

• Korean Journal of Metals and Materials
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• v.47 no.1
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• pp.44-49
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• 2009

Indium tin oxide(ITO) thin films were deposited on the glass substrates by radio-frequency (RF) magnetron sputtering method. The influence of rapid thermal annealing (RTA) treatment on the optical and electrical properties of the films were investigated for the purpose of fabricating plasma display signboard. Structural properties, surface roughness, sheet resistance and transmittance of the ITO film were analysed by using x-ray diffraction method, atomic force microscopy (AFM), four point prove, and ultraviolet-visible spectrometer, respectively. It was found that the RTA treatment increased the transmittance and decreased the resistivity of the ITO film, respectively. Furthermore, we successfully demonstrated the direct-current plasma signboard by using ITO electrode and phosphors.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.1
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• pp.7-15
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• 2004

The ferroelectric SBT thin films as a material of capacitors for non-volatile FRAMs have some problems that its remanent polarization value is relatively low and the crystallization temperature is quite high abovc 80$0^{\circ}C$. Therefore, in this paper, SBTN solution with S $r_{0.9}$B $i_{2.1}$T $a_{1.8}$N $b_{0.2}$$O_{9}$ composition was synthesized by sol-gel method. Sr(O $C_2$ $H_{5}$)$_2$, Bi(TMHD)$_3$, Ta(O $C_2$ $H_{5}$)$_{5}$and Nb(O $C_2$ $H_{5}$)$_{5}$ were used as precursors, which were dissolved in 2-methoxyethanol. SBTN thin films with 200 nm thickness were deposited on Pt/Ti $O_2$/ $SiO_2$/Si substrates by spin-coating. UV-irradiation in a power of 200 W for 10 min and rapid thermal annealing in a 5-Torr-oxygen ambient at 76$0^{\circ}C$ for 60 sec were used to promote crystallization. The films were well crystallized and fine-grained after annealing at $650^{\circ}C$ in oxygen ambient. The electrical characteristics of 2Pr=11.94 $\mu$C/$\textrm{cm}^2$, Ps＋/Pr＋=0.54 at the applied voltage of 5 V were obtained for a 200-nm-thick SBTN films. This results show that 2Pr values of the UV irradiated and rapid thermal annealed SBTN thin films at the applied voltage of 5 V were about 57% higher than those of no additional processed SBTN thin films. thin films.lms.s.s.

• Journal of the Korean Ceramic Society
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• v.37 no.8
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• pp.731-738
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• 2000

KLN(K3Li2Nb5O15) has attracted a great deal of attention for their potential usefulness in piezoelectric, electro-optic, nonlinear optic, and pyroelectirc devices. Especially, the KLN single crystal has been studied in the field of optics and electronics. However it is hard to produce good quality single crystals due to the crack propagation during crystal growing. One of the solutions of this problem is prepartion of thin film. But the intensive study has not been conducted so far. In this study, after the KLN thin film were prepared by R.F. magnetron Sputtering method on SiO2/Si substrate, the post-annealing methods of RTA(rapid thermal annealin) and IPA(insitu post annealing) were employed. The deposition condition of KLN thin film was RF power(100 W), Working pressure(100 mtorr). The commonness of both RAT and IPA was that the higher were deposition and post annealing temperature, the higher was the intensity of XRD but the less surface roughness. The difference of post-annealing methods affected XRD phase and surface condition very much. And in IPA process, the influence of O2 had much effect on the formation of KLN phase.