• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Journal of the Korean institute of surface engineering
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• v.49 no.1
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• pp.87-91
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• 2016

The development of high performance transparent electrode with flexibility have been required for flexible electronics. Here, we demonstrate the silver nanowire and reduced graphene oxide hybrid transparent electrode for replacing brittle indium-tin-oxide electrode by spray coating technique and plasma reduction. The spray coating system is applied to deposit silver nanowire and over coated graphene oxide films and it has a great potential to scale-up. The resistance of silver nanowire transparent electrode is reduced by 10% and the surface roughness is decreased after graphene oxide coating. The over-coated graphene oxide is successfully reduced by $H_2$ plasma treatment and it is effective in increasing the environmental stability of electrode. The lifetime of silver nanowire and reduced graphene oxide hybrid electrode at $85^{\circ}C$ of Celsius degree of temperature and 85% of relative humidity has much increased.

• Journal of Korea Society of Digital Industry and Information Management
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• v.7 no.1
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• pp.1-9
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• 2011

In this paper, Wireless sensor network technology applied to various greenhouse agro-industry items such as horticulture and local specialty etc., we was constructed automatic control system for optimum growth environment by measuring growth status and environmental change. existing monitoring systems of greenhouse gather information about growth environment depends on the temperature. but in this system, Can be efficient collection and control of information to construct wireless sensor network by growth measurement sensor and environment monitoring sensor inside of the greenhouse. The system is consists of sensor manager for information processing, an environment database that stores information collected from sensors, the GUI of show the greenhouse status, it gather soil and environment information to soil and environment(including weather) sensors, growth measurement sensor. In addition to support that soil information service shows the temperature, moisture, EC, ph of soil to user through the interaction of obtained data and Complex Growth Environment information service for quality and productivity can prevention and response by growth disease or disaster of greenhouse agro-industry items how temperature, humidity, illumination acquiring informationin greenhouse(strawberry, ginseng). To verify the executability of the system, constructing the complex growth environment measurement system using wireless sensor network in greenhouse and we confirmed that it is can provide our optimized growth environment information.

• Proceedings of the KIEE Conference
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• 2005.10b
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• pp.418-420
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• 2005

This paper proposed ultrasonic distance measurement module development for correct distance detection with collision escaping or obstacle of mobile robot is traveling self-regulation. Representative ultrasonic module applied in existing was Polaroid company's 6500 series and Devantech company's SRF04/SRF08 series. This ultrasonic sensors are corrupted by systematic errors due mainly to the dependency of sound speed upon surrounding conditions and random errors of uncertain origin. Therefore Ultrasonic distance detecting means of error compensation method and high definition, narrow beam angle, board area distance detecting means to apply to ultrasonic mobile robot control urgently need. In this paper use internal type temperature compensation method to improve problem of ultrasonic distance measurement method instead of that volume that have shortcoming of used correct temperature compensation methods applied big addition device. Compensate error by environment change of temperature. Humidity density etc. and is applicable to mobile robot offering various interface and real-time processing developed possible distance measurement module.

• Convergence Security Journal
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• v.8 no.4
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• pp.73-80
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• 2008

In this paper, we developed a WMS (Warehouse Management System) Simulator. There is no Simulator that supports optimized design for Warehouse, consider goods which storage in warehouse and using RFID and USN based on cable wireless network. Also, there is no tool for monitoring which decides delivery time with information about temperature, humidity and illumination, after goods are stocked into warehouse. In this paper, WMS Simulator Implements function of drawing a blueprint. The Simulator that can analyze moving information of Palette with RFID tags and the change about temperature, humidity and illumination is developed in this paper. Inventory accuracy, space equipment practical use, and decreasing of picking time, faulty storage and product loss by product processing ability elevation are expected by designing the way of operating of warehouse for most suitable use of system in physical distribution through these treatise.

• Atmosphere
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• v.27 no.2
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• pp.235-249
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• 2017

This paper describes methodology verifying near-surface predictability of numerical weather prediction models against the surface synoptic weather station network (SYNOP) observation. As verification variables, temperature, wind, humidity-related variables, total cloud cover, and surface pressure are included in this tool. Quality controlled SYNOP observation through the pre-processing for data assimilation is used. To consider the difference of topographic height between observation and model grid points, vertical inter/extrapolation is applied for temperature, humidity, and surface pressure verification. This verification algorithm is applied for verifying medium-range forecasts by a global forecasting model developed by Korea Institute of Atmospheric Prediction Systems to measure the near-surface predictability of the model and to evaluate the capability of the developed verification tool. It is found that the verification of near-surface prediction against SYNOP observation shows consistency with verification of upper atmosphere against global radiosonde observation, suggesting reliability of those data and demonstrating importance of verification against in-situ measurement as well. Although verifying modeled total cloud cover with observation might have limitation due to the different definition between the model and observation, it is also capable to diagnose the relative bias of model predictability such as a regional reliability and diurnal evolution of the bias.

• Korean Journal of Materials Research
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• v.11 no.6
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• pp.465-471
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• 2001

The effect of sintering condition on the mechanical properties and leachability of polydispersed ceramic core body made by gel-casting process in aqueous medium have been investigated. The polydispersed ceramic slip that has low viscosity($\leq$1000cP, at 1000cP (at $50sec^{-1}$ ) and high solid loading(50vo1%) was obtained. The green bodies were fabricated through casting and gelation at room temperature followed by drying at $25^{\circ}C$for 48hrs under relative humidity of 80%. Crack-free green body was successfully fabricated through the above process. The strength at room temperature, apparent bulk density, and shrinkage of the ceramic core body increased propotionally with increasing sintering temperature(1100~150$0^{\circ}C$). However, porosity of the ceramic core body showed relatively low vague. Leaching rate of sintered core body increased with increasing porosity of the sintered body, and was significantly dependent upon the concentration of alkali caustic solution at the same leaching temperature.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.3
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• pp.623-628
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• 2009

The emergence of compact and low-power wireless communication sensors and actuators in the technology supporting the ongoing miniaturization of processing and storage allows for entirely the new kinds of embedded systems. These systems are distributed and deployed in environments where they may have been designed into a particular control method, and are often very dynamic. Collection of devices can communicate to achieve a higher level of coordinated behavior. Wireless sensor nodes deposited in various places provide light, temperature, and activity measurements. Wireless sensor nodes attached to circuits or appliances sense the current or control the usage. Together they form a dynamic and multi-hop routing network connecting each node to more powerful networks and processing resources. Wireless sensor networks are a specific-application and therefore they have to involve both software and hardware. They also use protocols that relate to both applications and the wireless network. Wireless sensor networks are consumer devices supporting multimedia applications such as personal digital assistants, network computers, and mobile communication devices. Wireless sensor networks are becoming an important part of industrial and military applications. The characteristics of modem embedded systems are the capable of communicating adapting the different operating environments. In this paper, We designed and implemented sensor network system which shows through host PC sensing temperature and humidity data transmitted for wireless sensor nodes composed wireless temperature and humidity sensor and designs sensor nodes using embedded system with the intention of studying USN.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.8
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• pp.1478-1485
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• 2007

In this paper, a meteorological system including a wind speed & direction module and the DSP(Digital Signal Processor) sensor interface circuit board are proposed. This DSP system accepts and process the informations from a wind speed & direction module, the atmospheric pressure sensor, the ambient air temperature sensor and transfers it to the PC monitoring system. Especially, a wind speed & direction module and a DSP hardware are directly designed and applied. A wind speed & direction module have a construction that it have four film type RID(Resistive Temperature Detectors) resistive sensor adhered around the circular metal body heated constantly by heating coil for obtaining vector informations about wind. By this structure, the module is enabled precise measurement having a robustness about vibration, humidity, corrosion. A sensor signal processing circuit is using TMS320F2812 TI(Texas Instrument) Corporation high speed DSP. An economical meteorological system could be constructed through the data from wind speed & direction module and by the fast processing of DSP interface circuit board.