• Convergence Security Journal
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• v.5 no.1
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• pp.11-18
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• 2005

With the develoment of IT(Information Technologies) in Internet, Digital crime are increasing explosive every year. Recently, digital crime is taken advantage of technical and expert skill. It is necessary to investigate a digital crime that Digital forensic process standardization, Specialist training & education, R&D, Government support. So in this paper we proposed device of the grow of digital forensic that make analysis of the present state domestic digital forensic technique.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1476-1477
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• 2006

Solid insulation exposed to voltage is degraded and by electrical tree process. And the degradation of the insulation is accelerated by voltage application. For this experimental, specimen of electrical tree model is made by XLPE(cross-linked polyethylene). And the size of the specimen is 7*5*7 $mm^3$. Distance of needle and plane is 2mm. Voltage applied for acceleration test are 12kV. And distribution characteristic of degraded stage is studied too. As a PD detecting and data process, discharge data acquire from PD detecting system(Biddle instrument). Their results of PD distribution show good present and are good discriminating skill.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.1
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• pp.93-100
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• 2000

Die-casting burr due to casting process is removed by post-process for assembly and quality control of product. Though robot has been widely used for deburring job before, CNC exclusive machine is currently developed f3r high power, high speed machining and quick tool change. Deburring tool path with complex 3D curve type is defined to make out deburring NC program. But there is no efficient method to define it currently used methods with teaching probe on machine. In this study the efficient method to make out deburring NC program is developed. 5-axis digitizing machine is used to receive data of deburring path. And the post processor for NC program generation is developed in consideration of the machining conditions. The developed system is not dependent on the skill of operator and has the advantage to maintain the flexibility of job to modify NC program due to the wear of tool and aging of the die casting.

• Journal of The Korean Association For Science Education
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• v.34 no.8
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• pp.795-806
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• 2014

The purpose of this study is to develop an intervention program for improvement of elementary science-poor students' Basic Science Process Skill (BSPS) and to validate the intervention program's effectiveness using eye-tracker. The participants of this study were 35 elementary science-poor students. This study's method was the analysis of real-time eye movements during basic science process skill problem solving. SMI's 120 Hz iView XTM RED was used to collect EMD (eye movement data). Experiment 3.4 and BeGaze 3.4 programs were used to design experiment and to analyze EMD. The results of this study are as follows. First, we developed an intervention program including BSPS instructional strategy, behavior of teachers & student according instructional strategy stage, teachinglearning plan and learning note. Second, science poor students' BSPS ability has improved statistically significantly through the application of intervention program and BSPS problem-solving time decreased statistically significantly. Third, AFT (average fixation time) of BSPS Question and keyword area decreased statistically significantly. Fourth, APD (average pupil diameter) of BSPS problem-solving process expanded statistically significantly. Fifth, AST (average saccade time) of BSPS problem-solving process increased statistically significantly. Sixth, AFET (average fixation entry time) of BSPS problem-clue area was accelerated statistically significantly, AFT of BSPS problem-clue area reduced statistically significantly.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.683-688
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• 2001

Cryogenic LNG(Liquefied Natural Gas) which is stored in the cylindrical storage tanks of $100,000m^{3}$ has very complex flow phenomena and the changes of thermal properties with exterior conditions and operation mdoes. These complex thermofluid behaviors are affected by the storage, exterior conditions of LNG, design specifications and heat transfer characteristics of tanks, Also, those have influence on the stable storage and supply of LNG in the storage tanks. Thus this study performed the analysis on the 2-D heat transfer of the tank with exterior conditions, on the Cool Down Process in order to cool down the LNG Storage Tank at the initial normal state, and on the Filling Process considered for incoming and rising of LNG. The analysis on the Mixing LNG Storage was studied too. At last, the visualized program on the complex thermofluidodynamic analysis was developed on the basis of the above analyses. The development of this program becomes to be used to the basic design of the commercial tanks as well as to assure technical skill of the analysis on the thermal stability of the stored LNG in the LNG Storage Tank.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.44 no.4
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• pp.353-361
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• 2008

Recently a modern style sailing boat suitable for Korean sea was designed through full three dimensional design skill by the authors. In this paper, based on this three dimensional hull and deck design, a production process of 31ft class cruiser sailing boat was developed. First of all, it was possible to make the digital mock-up for design boat. Through this mock-up and RP(rapid prototyping) modeling, an appropriate general arrangement of design boat was able to be determined at final. And also the female deck mould was able to be made by a 5-axis NC cutting machine. By doing this method, more higher efficiency and precision for sailing boat production could be achieved than before. Through this research the total process of design and construction for the designed boat was established.

• Knowledge Management Research
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• v.9 no.2
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• pp.169-191
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• 2008

Information technology instruments arc being rampantly used for knowledge management in companies. IT is used as an interplay tool to enhance the flow of knowledge and information between people. KMS, especially, supports the knowledge management process including sharing, creating, and using of knowledge within a company, and maximizes the value of knowledge resources within an organization. The purpose of this paper is to understand how IT is changing the knowledge management activity. through various examples based on exploratory research from MANDO, the Korean automotive parts manufacturer, and POSCO, the global leading steelmaker. The result shows that IT boosts communication skills, thus creates a mutual relationship outcome. In the same context, the process of knowledge conversion by Nonaka's SECI model simplifies to an Externalization-Internalization process. This process accelerates the birth of explicit knowledge and Socialization, supplements the Limitations of the creation of knowledge in the E-I cycle. The E of knowledge simultaneously promotes the I, and eventually brings an advanced learning skill. IT aids the E of knowledge and furthermore, I and E activity, through the knowledge sharing, brings vitality into an organization. The interplay stage for knowledge activity is to be reorganized to a cyber ba. Furthermore, IT will galvanize the formation of core knowledge through systemized acquisition, management of core knowledge and standardization of work.

• Journal of Applied Reliability
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• v.10 no.1
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• pp.39-56
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• 2010

Statistical process control (SPC) is a powerful technique for monitoring, managing, analysing and improving the process performance. However, its has limitations such as lack of engineering, statistical skill and training, and lesser importance of activity. To solve the problems, this study proposes an intelligent SPC system using specified agents which are derived through analysis and evaluation of the SPC activities. The activities investigated by the relevant researches are categorized as collection, process analysis, diagnosis, detection, cause analysis and rule generation. Also, the evaluation criteria are established as feasibility of automation, frequency, level and time. The requirements of the agent functions are derived by the evaluation, and the types of customized agents are as data collection, store, analysis, diagnosis, monitoring, alarm and reporting. A prototype SPC system represents that the functions of the proposed agents are successfully validated.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.980-986
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive, the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, Ist, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the effect of the wheel path density and relative velocity on the characteristic of ground wafer in in-feed grinding with cup-wheel. It seems that the variation of the parameters in radial direction of wafer results in the non-uniform surface quality over the wafer. So, in this paper, the geometric analysis on grinding process is carried out, and then, the effect of the parameters on wafer surface quality is evaluated

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.98-101
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.