• 한국전기전자재료학회논문지
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• 제22권7호
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• pp.572-575
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• 2009

In this study, we proposed WLED(White-Light Emitting Diode) driver IC for mobile applications. This IC drove WLED for mobile applications with low input voltage and high efficiency by using boost converter. The device was designed by using boost converter applied current-mode control algorithm and provided PWM(Pulse Width Modulation) & analog dimming. Designed IC consisted of bias block, drive block, control block, protection block. We confirmed this device worked well through a application PCB (Printed Circuit Board) test.

• International Journal of Internet, Broadcasting and Communication
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• 제7권2호
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• pp.161-167
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• 2015

The performance of high power LEDs highly depends on the junction temperature. Operating at high junction temperature causes elevation of the overall thermal resistance which causes degradation of light intensity and lifetime. Thus, appropriate thermal management is critical for LED packaging. The main goal of this research is to improve thermal resistance by optimizing and comparing nano-pore silicon-based thermal substrate to insulated metal substrate and direct bonded copper thermal substrate. The thermal resistance of the packages are evaluated using computation fluid dynamic approach for 1 W single chip LED module.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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• pp.150-152
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• 2004

The number of layers in rigid PCB(printed circuit board) is restricted, so the number of components can be embedded in module is restricted also. But using flexible multilayer PCB, the layers over than 7 can be evaluated. In this study, to verify the possibility of application of flexible multilayer PCB to RF modules, multilayered embedded capacitor is fabricated and analyzed. The characteristics of embedded capacitor is analyzed and compared to that of MLCC and LTCC capacitor. Embedded capacitor has better electrical features than MLCC and compatible one to LTCC capacitor.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.10-10
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• 2008

Flip chip technology is keeping pace with the increasing connection density of the ICs and is capable of transferring semiconductor performance to the printed circuit board. One of the most general flip chip technology is CPB technology presented by Intel. The CPTB technology has similar benefits with CPB but has simpler process and better reliability characteristics. In this paper, process sequence and structure of CPTB are presented.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.349-349
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• 2005

수동소자를 PCB(Printed Circuit Board) 안으로 집적하기 위한 방법의 일환으로 polymer-metal, polymer-ceramic composite에 연구가 국내외 연구 국내외 연구기관에서 광범위하게 진행되고 있다. 본 연구에서는 polymer-metal-ceramic composite 에서 PZT-coated Ni의 volume fraction에 따른 유전율 변화에 대하여 조사하였다. 원료로는 PZT(52/48) solution. 니켈금속분말, PMMA(polymethyl methacrylate)를 사용하였다. 전기적 특성은 임피던스분석기를 이용하여 측정하였으며 mixing rule과 percolation theory를 이용하여 결과를 해석하였다.

• 한국전기전자재료학회논문지
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• 제18권6호
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• pp.571-575
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• 2005

In order to improve the efficiency of dye-sensitized solar cell (DSSC), $TiO_2$ electrode screen-printed on transparent conducting oxide (TCO) substrate was sintered in variation with different temperature$(350\;to\;550^{\circ}C)$. $TiO_2$ electrode on fluorine doped tin oxide (FTO) glass was assembled with Pt counter electrode on FTO glass. I-V properties of DSSCs were measured under solar simulator. Also, effect of sintering temperature on surface morphology of $TiO_2$ films was investigated to understand correlation between its surface morphology and sintering temperature. Such surface morphology was observed by atomic force microscopy (AFM). Below sintering temperature of $500^{\circ}C$, efficiency of DSSCs was relatively lower due to lower open circuit voltage. Oppositely, above sintering temperature of $500^{\circ}C$, efficiency of DSSCs was relatively higher due to higher open circuit voltage. In both cases, lower fill factor (FF) was observed. However, at sintering temperature of $500^{\circ}C$, both efficiency and fill factor of DSSCs were mutually complementary, enhancing highest fill factor and efficiency. Such results can be explained in comparison of surface morphology with schematic diagram of energy states on the $TiO_2$ electrode surface. Consequently, it was considered that optimum sintering temperature of a-terpinol included $TiO_2$ paste is at $500^{\circ}C$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.202-202
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• 2008

The world gross market of many kinds of electronics, such as TV and mobile phone has been increasing rapidly these days. It is mainly caused by the amazing developments of IT technology during past decade and the changes of individual life style for the better. Thanks to the increases of electronics manufactured in quantity, much more electronic components such as MLCC (multi layer ceramic capacitor) and PCB (printed circuit board), which are our main products, have been needed as a consequence. Though it was reported that total market of electronic components exceeds several hundreds of billion dollars, there are many manufactures struggling for survival in the competition of electronics components. Then the recognition of quality as a key technology has spread and the efforts for high-yield production lines have been kept in many companies. In this paper, our efforts to eliminate the contamination of particles and the diffusion of some volatile organic compounds which is very harmful to workers at production line have been introduced.

• 한국전자파학회논문지
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• 제16권4호
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• pp.402-409
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• 2005

아날로그 및 디지털 시스템에서 인쇄회로기판에 있는 전송선들의 상호 결합은 장비의 성능을 저하시킬 수 있다. 이 논문에서는 전송선들 사이에 추가로 전송선을 삽입하고 비아 홀을 통해 접지면에 직접 연결시킨 비아펜스의 영향을 해석하기 위한 방법을 제안하였다. 이 방법은 전송선 부분을 위한 회로 개념과 비아 홀 부분을 위한 임피던스 모델링으로 이루어졌고 각 부분을 ABCD 파라미터로 나타내어 직렬 연결하였다. 마지막으로 이 방법에 의한 시뮬레이션 결과를 측정 결과와 비교하여 방법의 타당성을 입증하였다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제13권4호
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• pp.355-360
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• 2013

A wireless intraocular (IOP) pressure sensor based on micro electro mechanical system (MEMS) technology is proposed. The proposed IOP sensor uses variable inductance according to the external pressure. The proposed sensor is composed of two flexible membranes: a ferrite bottom part, an inductor, and a capacitor. The inductance of the sensor varies according to the external pressure. The resonance frequency of the sensor is also varied, and this frequency is detected using an external coil. The external coil is designed with an FR-4 printed circuit board. The feasibility of the proposed sensor structure using variable inductance to detect the external pressure is successfully demonstrated.

• 한국군사과학기술학회지
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• 제23권4호
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• pp.319-327
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• 2020

In this study a methodology to evaluate fatigue life of the electronic parts for the fighter radar unit under random vibration loading is presented. To do this, one parameter for the 3-σ RMS quation of Steinberg fatigue model is modified to come up with a printed circuit board(PCB) with multiple electronic parts, while fundamental frequency and dynamic deflection of the PCB are calculated from a MATLAB based finite element computer code. For the RIFA structure selected in this study, the 3-σ RMS fatigue limit displacement is reduced to 0.741 times as much as the Steinberg model. This investigation allows to assess the life of multiple electronic parts mounted on the PCB with reinforced metal cover/body showing non-sinusoidal deflection patterns.