• Journal of the Korea Fashion and Costume Design Association
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• v.16 no.1
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• pp.53-64
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• 2014

The main objective of this research was to understand the characteristics of printed geometric patterns through the statistical & qualitative analysis of fashion appeared in contemporary female collections 2011 S/S to 2013 A/W. Data collection of 294 was done through review of 'pr$\hat{e}$t-$\grave{a}$-porter Collections' of three major fashion cities; Paris, Milan and NY. Statistical analysis of frequency was conducted. Also qualitative interpretation of natural print design' characteristics were completed. The main findings were as followed; 1,636 of the total 15,852 designs were printed patterns in 12 Collections and the occurrence rate of printed geometric patterns in three collections were 8.6% in Milan, 9.2% in Paris and 12.9% in N.Y. Most geometric patterns were the types of compact or medium density in a front patterns with a variety of sizes and mainly applied to the one piece dress or two piece clothing item combination styles. Formative Characteristics of printed geometric patterns were classified into four types. First, a variety of thicknesses and shapes, such as a line or a rectangle shape to take advantage of the types of the typical geometric pattern. Second types were using the motifs which inspired by geometric shapes such as point, circle star and other special geometric shapes and arranging them regularly with various sizes and density. The third was repeated particular motifs which based on complex and sophisticated mathematical formulas. Fourth were the specific diagram types of bold and free shapes or dividing the flat and arranging them without rules, or the combination type of various geometric motifs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.271-271
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• 2010

$BaTiO_3$(BT) has high permittivity so that has been applied to dielectric and insulator materials in 3D system-level package integration. In order to achieve excellent performance of device, the BT layer should be highly dense. In this study, BT thick films were prepared by the inkjet printing method. And these films were cured at $280^{\circ}C$ after infiltration of polymer resin. As a result, we have successfully fabricated not only the inkjet-printed hybrid BT film but also metal-insulator-metal(MIM) capacitor without sintering process. Changes in the dielectric constant of BT hybrid film with particle size and packing density were investigated. The dielectric constant was increased with increasing packing density and particle size. Further, the BT hybrid film using two different size particles had even higher packing density and dielectric constant.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.332-332
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• 2010

We have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films withouWe have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films without a high temperature sintering process. In order to remove the coffee ring effect in the ink drop, we have introduced a co-solvent system in order to create Marangoni flow in the ink drop, which leads to the dense packing of ceramic powders on the substrate during inkjet process. The packing density of the Inkjet-printed $Al_2O_3$ films is around 60% (max. 70%) which is very high compared to the value obtained from the same material films by other conventional methods such as film casting, dip coating process, etc. The voids inside the films (which are around 40% of the entire film volume) are filled with the polymer resin (Cyanate ester) by the infiltration process. This resin infiltration is also implemented by the inkjet printing process right after the Ah03 film ink-jetting process. The microstructures of the printed $Al_2O_3$ films are investigated by Scanning Electron Microscope (SEM) to understand the degree of packing density in the printed films. The inkjet-printed $Al_2O_3$ films have been characterized to investigate its thickness and roughness. Quality factor of the printed $Al_2O_3$ film is also measured to be over 300 at 1MHz.

• Proceedings of the KIPE Conference
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• 2001.10a
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• pp.1-6
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• 2001

In this article, the fundamental concept, characteristics and application potentials of coreless printed-circuit-board (PCB) transformers are described. Coreless PCB transformers do not have the limitations associated with magnetic cores, such as the frequency limitation, magnetic saturation and core losses. In addition, they eliminate the manual winding process and its associated problems, including labor cost, reliability problems and difficulties in ensuring transformer quality in the manufacturing process. The parameters of the printed windings can be precisely controlled in modern PCB technology. Because of the drastic reduction in the vertical dimension, coreless PCB transformers can achieve high power density and are suitable for applications in which stringent height requirements for the circuits have to be met. A transformer's power density of $24W/cm^2$ has been reported in a power conversion application. When used in an isolation amplifier application, coreless PCB transformers tested so far enable the amplifier to achieve a remarkable linear frequency range of 1MHz, which is almost eight times higher than the frequency range of 120kHz in existing Integrated-Circuit products. PCB materials offer extremely high isolation voltage, typically from 15kV to 40kV, which is higher than many other isolation means such as optocouplers. It is envisaged that coreless PCB transformers can replace traditional core-based transformers in some industrial applications. Their application potentials deserve more attention and exploration.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.48 no.1
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• pp.134-141
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• 2016

Dampening in printing is not only used with plain water but also used with various substances like dampening additive, in order to improve the wetting property by lowering the surface tension and to control material for modifing the ink transfer characteristic with proper emulsification. We have studied the printing quality according to these, looking into interrelationship among the dampening solution's pH, electrical conductivity and IPA content, prescribing the proper usage and minimum usage of fountain solution and dampening additive. In this study, it shows good result when mixing at the 7 wt% dampening with additive solution, which is result from the color density of printed sheets in accordance with the change of dampening solution condition. And the printed density value calculated 1 hour after printing, it shows relatively safe value at the etch liquid 4 wt% and IPA addition 2 wt%. The dry down at this test showed similar results regardless of various dampening conditions on coated paper, but in case of uncoated paper, the dry down showed a quite gap of different due to the fast penetration to the paper.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.1
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• pp.66-73
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• 2021

In this paper, we analyzed and considered the precision of parts produced by 3D printing methods. For the latch systems applied to the Wingline folding doors, the 3D shape of the door hinge part was printed using FDM and DLP methods. Then, the 3D printed shape was scanned to measure the dimensions and dimensional changes of the actual model. In the comparison and analysis of the 3D printed door hinge parts, because the output filling density is 100% owing to the characteristics of DLP 3D printing, the filling density in FDM 3D printing was also set to 100%.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.342-347
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• 2007

$Bi_6Mg_2Nb_4O_{21}(BMN)$ thin films were deposited at various substrates by sputtering system for embedded capacitor applications. BMN thin films deposited at room temperature are manufactured as MIM(Metal/Insulator/Metal) structures. Dielectric properties and leakage current density were investigated as a function of various substrates and thickness of BMN thin films. Leakage current density of BMN thin films deposited on CCL(Copper Clad Laminates) showed relatively high value ($1{\times}10^{-3}A/cm^2$) at an applied field of 300 kV/cm on substrates, possibly due to relatively high value of roughness(rms $50{\AA}$) of CCL substrates. 100 nm-thick BMN thin films deposited on Cu/Ti/Si substrates showed the capacitance density of $300 nF/cm^2$, a dielectric constant of 32, a dielectric loss of 2 % at 100 kHz and the leakage current density of $1{\times}10^{-6}A/cm^2$ at an applied field of 300 kV/cm. BMN capacitors are expected to be promising candidates as embedded capacitors for printed circuit board(PCB).

• Fashion & Textile Research Journal
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• v.24 no.6
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• pp.812-824
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• 2022

This study proposes to develop a 3D printed re-entrant(RE) strip by shape memory thermoplastic polyurethane that can be deformed and recovered by thermal stimulation. The most suitable 3D printing infill density condition and temperature condition during shape recovery for mechanical behavior were confirmed. As the poisson's ratio indicated, the higher the recovery temperature, the closer the poisson's ratio to zero and the better the auxetic properties. After recovery testing for five minutes, it appeared that the shape recovery ratio was the highest at 70℃. The temperature range when the shape recovery ratio appeared to be more than 90% was a recovery temperature of more than 50℃ and 60℃ when deformed under a constant load of 100 gf and 300 gf, respectively. This indicated that further deformation occurred after maximum recovery when recovered at a temperature of 80℃, which is above the glass transition temperature range. As for REstrip by infill density, a shape recovery properties of 100% was superior than 50%. Additionally, as the re-entrant structure exhibited a shape recovery ratio of more than 90%, and exhibited auxetic properties. It was confirmed that the infill density condition of 100% and the temperature condition of 70℃ are suitable for REstrips for applying the actuator.

• Journal of Periodontal and Implant Science
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• v.52 no.4
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• pp.338-350
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• 2022

Purpose: Various studies have investigated 3-dimensional (3D)-printed implants using Ti6Al-4V powder; however, multi-root 3D-printed implants have not been fully investigated. The purpose of this study was to explore the stability of multirooted 3D-printed implants with lattice and solid structures. The secondary outcomes were comparisons between the 2 types of 3D-printed implants in micro-computed tomographic and histological analyses. Methods: Lattice- and solid-type 3D-printed implants for the left and right mandibular third premolars in beagle dogs were fabricated. Four implants in each group were placed immediately following tooth extraction. Implant stability measurement and periapical X-rays were performed every 2 weeks for 12 weeks. Peri-implant bone volume/tissue volume (BV/TV) and bone mineral density (BMD) were measured by micro-computed tomography. Bone-to-implant contact (BIC) and bone area fraction occupancy (BAFO) were measured in histomorphometric analyses. Results: All 4 lattice-type 3D-printed implants survived. Three solid-type 3D-printed implants were removed before the planned sacrifice date due to implant mobility. A slight, gradual increase in implant stability values from implant surgery to 4 weeks after surgery was observed in the lattice-type 3D-printed implants. The marginal bone change of the surviving solid-type 3D-printed implant was approximately 5 mm, whereas the value was approximately 2 mm in the lattice-type 3D-printed implants. BV/TV and BMD in the lattice type 3D-printed implants were similar to those in the surviving solid-type implant. However, BIC and BAFO were lower in the surviving solid-type 3D-printed implant than in the lattice-type 3D-printed implants. Conclusions: Within the limits of this preclinical study, 3D-printed implants of double-rooted teeth showed high primary stability. However, 3D-printed implants with interlocking structures such as lattices might provide high secondary stability and successful osseointegration.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.4
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• pp.297-302
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• 2009

We have successfully fabricated the alumina thick films using inkjet printing processes without a high temperature sintering process. Alumina suspension as dielectric ink was formulated by combining nano-sized alumina powders with an anionic polymer dispersant in formamide/water as co-solvent. The thickness of the printed alumina thick film was measured at around 5 um by field emission scanning electron microscope. The calculated packing density of 68.5 % from the printed alumina thick film was much higher than the same films fabricated by conventional casting or dip coating processes. Q factor of the dielectrics thick film infiltrated with cyanate ester resin was evaluated by impedance analyzer.