• Journal of the Korean Society for Precision Engineering
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• v.11 no.6
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• pp.42-49
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• 1994

One of the parameters that influence the productivity of every industry, involved in metal cutting, is the chip from ; continuous or broken chip. Chip form varies according to machining conditions, material used, tool geometry and chip breaker geometry. Therefore, in this study we carried out the experiment on the chip control in machining STS304 using an attached obstruction type chip breaker. Namely, with the change of a chip breaker distance, chip breaker angle, cutting characteristics in machining STS304 which is well-known as a machining difficult material and produces a saw-toothed chip. The results of the experiment are as follows : 1. The chip breaker distance and angle under which the preferred chip is produced, show 1.5mm and 60 .deg. , while chip breaker angle in machining an ordinary steel was well-known 45 .deg. . 2. During the cutting process, the change of feed than the change of velocity was applied as cutting conditions, effects more clearly on the chip breaking. 3. Considering a whole surface roughness, it is not advisable to apply chip breaker mentioned above for precision cutting.

• ETRI Journal
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• v.27 no.5
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• pp.563-568
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• 2005

A motion-control chip contains major functions that are necessary to control the position of each motor, such as generating velocity command profiles, reading motor positions, producing control signals, driving several types of servo amplifiers, and interfacing host processors. Existing motion-control chips can only generate velocity profiles of fixed characteristics, typically linear and s-shape smooth symmetric curves. But velocity profiles of these two characteristics are not optimal for all tasks in industrial robots and automation systems. Velocity profiles of other characteristics are preferred for some tasks. This paper proposes a motion-control chip to generate velocity profiles of desired acceleration and deceleration characteristics. The proposed motion-control chip is implemented with a field-programmable gate array by using the Very High-Speed Integrated Circuit Hardware Description Language and Handel-C. Experiments using velocity profiles of four different characteristics will be performed.

• Journal of the Korean Society for Heat Treatment
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• v.25 no.1
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• pp.14-21
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• 2012

The effects of cutting condition and tempering temperature for the shape of cutting chip were investigated. For this purpose, a lead-free brass containing 1wt.% of Bi extruded at $750^{\circ}C$ in straight turning was used in this study. The cutting chip preferred was mainly found to be loose form of arc chips with curling discontinuity, and these were formed by shear fracture. However, some of fragmental element chip were found to be mixed when tempering temperature was as high as $500^{\circ}C$. The form and size of chip was more affected by feed rate than by tempering temperature and cutting rate. In addition, the cutting surface was observed to be formed more rough in the case of high feed rate and low cutting rate compared to low feed rate and high cutting rate.

• Proceedings of the IEEK Conference
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• 2002.07c
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• pp.1952-1955
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• 2002

Multiple access interference (MAI) and multi path interference(MPI) degrades the system performance in the DS-CDMA(direct-sequence code-division multiple- access)systems .0 this paper, a generalized construction method fer 2$\^$n/(n=1,2,3) phase preferred pairs(PP) with zero-correlation duration (ZCD) of (0.5N+1) chips is proposed. 2$\^$n/(n=1,2,3) phase ZCD code sets with ZCD and enlarged family sizes are generated by carrying out a chip-shift operation of the preferred pairs . The properties of the proposed codes are effective for the cancellation of MAI and MPI in DS-CDMA Systems.

• Korean Journal of Optics and Photonics
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• v.19 no.5
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• pp.381-385
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• 2008

We have analyzed the effect of the substrate removal and packaging schemes on light output characteristics in InGaN/Sapphire LEDs. The removal of the sapphire substrate helps to dissipate the heat generated in the junction, but the advantage comes only with the detrimental effect of degrading the photon extraction efficiency. If the substrate-removed chip is attached to a metallic mount with good thermal conductivity, the maximum driving current is increased drastically, producing significantly increased light output and therefore compensating the photon extraction efficiency degradation. On a dielectric mount with a relatively poor thermal conductivity, however, it produces smaller light output, over most input current range, than the regular type of chips with the sapphire substrate remaining. Thus, for low power applications, the regular chips may be preferred over the substrate-removed chips, regardless of the chip mounts employed.

• Journal of the East Asian Society of Dietary Life
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• v.14 no.1
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• pp.74-82
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• 2004

The study was aimed to estimate the degree of recognition of, satisfaction with and needs for cooking practice education. 300 female students of middle schools and high schools in Seoul, Kyung-gi, Inchon area were targeted fer the research, which has been conducted from January 1st to December 20th in 2003. The crosstab, the t-test, and the ANOVA analysis were processed as methods using SPSS. The study showed that most of students had experienced cooking exercises, and the degree of satisfaction of the high school group was higher than that of the middle school group. Both groups answered they wanted more time for the cooking practice classes and the middle school group had the greater necessity. The necessity far practice lessons of cooking traditional foods reaches n high level in both groups, All the students answered they liked both western and traditional foods, but preferred the traditional food to the western one. They also believed the traditional food was more healthy than the western one. In terms of the needs for cooking practice education, the middle school group wanted to learn how to cook cake, pie, steak potato chip, and hamburger, while the high school group wanted cake, pie, steak sandwich, and potato chip. As for the traditional food, the middle school group wanted to learn how to cook Naegmyun(cold noodles), fried rice, rice hash, dumpling soup, and knife-cut noodles. The high school group, however, picked knife-cut noodles, fried rice, iced noodles, rice hash, and rice-cake soup.

• Asian Pacific Journal of Cancer Prevention
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• v.15 no.24
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• pp.10809-10812
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• 2015

Background: Human papillomavirus (HPV) DNA testing is an effective method to screen for precancerous changes in the cervix. Samples from self-collection rather than Pap smear can potentially be used to test for HPV as they are more acceptable and preferred for use in certain settings. The objective of this study was to compare HPV DNA testing from self-collected vaginal swabs and physician-collected cervical swabs. Materials and Methods: A total of 101 self-collected vaginal and physician-collected cervical swabs of known cytology from Thai women were tested by electrochemical DNA chip assay. The specimens were divided into 4 groups: 29 with normal cytology, 14 with atypical squamous cells of undetermined significance (ASCUS), 48 with low-grade squamous intraepithelial lesion (LSIL), and 10 with high-grade squamous intraepithelial lesion (HSIL). Results: Positive detection rates of HPV from self-collected swabs were similar to those from physician-collected swabs. Among specimens with abnormal cytology, HPV was found in 50% of self-collected swabs and 47.2% of physician-collected swabs. In specimens with normal cytology, 17.2% of self-collected swabs and 24.1% of physician-collected swabs were positive for HPV. Concordance was relatively high between results from self-collected and physician-collected samples. The most common HPV genotype detected was HPV 51. Conclusions: HPV DNA testing using self-collected swabs is a feasible alternative to encourage and increase screening for cervical cancer in a population who might otherwise avoid this important preventive examination due to embarrassment, discomfort, and anxiety.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.22 no.11
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• pp.44-47
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• 2008

New Eight-phase Preferred Pairs (EPPs) that have Zero-Correlation Duration (ZCD) of (0.5N+1) chips are constructed for the periods of $N=4{\times}2n$ (n=1,2,3...). By using the chip-shift operation of the EPP, new eight-phase ZCD sequences are constructed in this paper. We certified its ZCD property by various correlation simulations. This new eight-phase spreading sequence can be used for Interference cancelled wireless personal area network(WPAN) based on approximately synchronized code-division-multiple-access(AS-CDMA) system.

• Annual Conference of KIPS
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• 2002.04b
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• pp.1647-1650
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• 2002

In this paper, a class of multi-level spreading codes, i.e., ternary ZCD(zero-correlation duration) spreading codes are introduced. Novel ternary ZCD code sets are generated by carrying out a chip-shift operation of the ternary preferred pairs (TPP) with a ZCD of(0.75N+1)chips. Ternary ZCD codes have superior family size than the binary ZCD codes and they are effective for approximately synchronized (AS) CDMA

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.