• 제목/요약/키워드: pre-cu

검색결과 246건 처리시간 0.024초

Pre-adaptation to Cu during Plant Tissue Culture Enhances Cu Tolerance and Accumulation in Begonia (Begonia evansiana Andr.)

  • Ahn, Yeh-Jin;Park, Jong-Moon
    • Journal of Ecology and Environment
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    • 제30권3호
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    • pp.271-276
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    • 2007
  • A simple and efficient protocol was developed for culturing Cu-tolerant and Cu-accumulating plants via pre-adaptation to Cu during plant tissue culture. We induced multiple shoots from begonia (Begonia evansiana Andr.) leaf explants on MS medium supplemented with naphtaieneacetic acid and benzyladenine. After 3 months, small plantlets were transferred to MS medium supplemented with $100{\mu}M\;CuCl_2$ for pre-adaptation to Cu and cultured for 5 months. Then, these plantlets were individually planted in pots containing artificial soil. An additional 500 mg of Cu dissolved in 1/4 strength MS solution was applied to each pot during irrigation over the course of 2 months. We planted pre-adapted and control begonias in soil from the II-Kwang Mine, an abandoned Cu mine in Pusan, Korea, to examine their ability to tolerate and accumulate Cu for phytore-mediation. Pre-adapted begonias accumulated $1,200{\mu}g$ Cu/g dry root tissue over the course of 45 days. On the other hand, non-Cu-adapted controls accumulated only $85{\mu}g$ Cu/g dry root tissue. To enhance Cu extraction, chelating agents, ethylenediamine tetraacetic acid (EDTA)-dipotassiun and pyridine-2,6-dicarboxylic acid (PDA), were applied. While the chelating agents did not enhance accumulation of Cu in the roots of control begonias, EDTA application increased the level of Cu in the roots of pre-adapted begonias twofold (to $2,500{\mu}g$ Cu/g dry root tissue). Because pre-adapted begonias accumulated a large amount of Cu, mainly in their roots, they could be used for phytostabilization of Cu-contaminated soils. In addition, as a flowering plant, begonias can be used to create aesthetically pleasing remediation sites.

Effect of Pre-annealing on the Formation of Cu2ZnSn(S,Se)4 Thin Films from a Se-containing Cu/SnSe2/ZnSe2 Precursor

  • Ko, Young Min;Kim, Sung Tae;Ko, Jae Hyuck;Ahn, Byung Tae;Chalapathy, R.B.V.
    • Current Photovoltaic Research
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    • 제10권2호
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    • pp.39-48
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    • 2022
  • A Se-containing Cu/SnSe2/ZnSe precursor was employed to introduce S to the precursor to form Cu2ZnSn(S,Se)4 (CZTSSe) film. The morphology of CZTSSe films strongly varied with two different pre-annealing environments: S and N2. The CZTSSe film with S pre-annealing showed a dense morphology with a smooth surface, while that with N2 pre-annealing showed a porous film with a plate-shaped grains on the surface. CuS and Cu2Sn(S,Se)3 phases formed during the S pre-annealing stage, while SnSe and Cu2SnSe3 phases formed during the N2 pre-annealing stage. The SnSe phase formed during N2 pre-annealing generated SnS2 phase that had plate shape and severely aggravated the morphology of CZTSSe film. The power conversion efficiency of the CZTSSe solar cell with S pre-annealing was low (1.9%) due to existence of Zn(S.Se) layer between CZTSSe and Mo substrate. The results indicated that S pre-annealing of the precursor was a promising method to achieve a good morphology for large area application.

무전해 Ni-B 도금을 이용한 플라즈마 디스플레이 버스 전극용 확산방지막의 열처리 영향 (Effect of Heat Treatment of the Diffusion Barrier for Bus Electrode of Plasma Display by Electroless Ni-B Deposition)

  • 최재웅;황길호;홍석준;강성군
    • 한국재료학회지
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    • 제14권8호
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    • pp.552-557
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    • 2004
  • Thin Ni-B films, 1 ${\mu}m$ thick, were electrolessly deposited on Cu bus electrode fabricated by electro deposition. The purpose of these films is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier against copper contamination of dielectric layer in AC-plasma display panel. The layers were heat treated at $580^{\circ}C$(baking temperature of dielectric layer) with and without pre-annealing at $300^{\circ}C$($Ni_{3}B$ formation temperature) for 30 minutes. In the layer with pre-annealing, amount of Cu diffusion was lower about 5 times than that in the layer without pre-annealing. The difference of Cu concentration could be attributed to Cu diffusion before $Ni_{3}B$ formation at grain boundaries. However, the diffusion behavior of the layer with pre-annealing was similar to that of the layer without pre-annealing after $Ni_{3}B$ formation. With increasing annealing time, Cu concentration of both layers increased due to grain growth.

Hydrogenation of Phenylacetylene to Styrene on Pre-CxHy- and C-Covered Cu(111) Single Crystal Catalysts

  • Sohn, Young-Ku;Wei, Wei;White, John M.
    • Bulletin of the Korean Chemical Society
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    • 제32권5호
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    • pp.1559-1563
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    • 2011
  • Thermal hydrogenation of phenylacetylene (PA, $C_8H_6$) to styrene ($C_8H_8$) on pre-$C_xH_y$- and C-covered Cu(111) single crystal substrates has been studied using temperature-programmed desorption (TPD) mass spectrometry. Chemisorbed PA with an acetylene group has been proved to be associated with hydrogen of pre-adsorbed $C_xH_y$ to form styrene (104 amu) on Cu surface. For the parent (PA) mass (102 amu) TPD profile, the TPD peaks at 360 K and 410 K are assigned to chemisorbed vertically aligned PA and flat-lying cross-bridged PA, respectively (J. Phys. Chem. C 2007, 111, 5101). The relative $I_{360K}/I_{410K}$ TPD ratio dramatically increases with increasing pre-adsorbed $C_xH_y$ before dosing PA, while the ratio does not increase for pre-C-covered surface. For PA on pre-$C_xH_y$-covered Cu(111) surface, styrene desorption is enhanced relative to the parent PA desorption, while styrene formation is dramatically quenched on pre-C-covered (lack of adsorbed hydrogen nearby) surface. It appears that only cross-bridged PA associates with adsorbed hydrogen to form styrene that promptly desorbs at 410 K, while vertically aligned PA is less likely to participate in forming styrene.

무전해 도금법으로 제조된 Ni-B 확산 방지막의 Cu 확산 거동 (Cu Diffusion Behavior of Ni-B Diffusion Barrier Fabricated by Electroless Deposition)

  • 최재웅;황길호;한원규;이완희;강성군
    • 한국재료학회지
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    • 제15권9호
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    • pp.577-584
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    • 2005
  • Thin Ni-B layer, $1{\mu}m$ thick, was electrolessly deposited on Cu electrode fabricated by electro-deposition. The purpose of the layer is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier. The layers were annealed at $580^{\circ}C$ with and without pre-annealing at $300^{\circ}C$ for . 30minutes. In the layer with pre-annealing, the amount of Cu diffusion was lower about 5 times than the layer without pre-annealing. The difference in Cu concentration may be attributed to $Ni_3B$ formation prior to Cu diffusion. However, the difference in Cu concentration decreased during the annealing time of 5 h due to the grain growth of Ni.

Cu-Cr 계 접점재료의 소결특성에 관한 연구 (A sturdy on the sintering characteristics for Cu-Cr contact material)

  • 연영명;오일성;박홍태;이상엽;서정민
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2000년도 하계학술대회 논문집 C
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    • pp.1643-1645
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    • 2000
  • The effects of pre-sintering and infiltration conditions on the electrical and physical properties of Cu-Cr contact material have been studied. Specimens were prepared by infiltration technique, aiming at the final composition of Cu50w%Cr, with varying pre-sintering and infiltration conditions. It showed that increased pre-sintering temperature had a little influence on the final microstructure of Cu-Cr contact material, but improved the surface morphology of Cr-skeleton resulting in better wettability in the followed infiltration process. It also showed that Cr grain growth and gram shape change became prominent with increasing infiltration temperature and time.

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Cu첨가형 열연강판의 최적 Cu 및 Mn 첨가량 규명 (Determination of Optimum Cu and Mn Contents in Cu-bearing Hot Rolled Steel Sheets)

  • 윤일성;윤인택;조열래;김인배
    • 한국재료학회지
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    • 제8권3호
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    • pp.274-279
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    • 1998
  • 0.05wt%C-Cu첨가열연강판에서 590MPa급을 가지며 10% pre-strain을 가한 후 780MPa급 이상을 가지는 Cu첨가형 열연강판의 최적 Cu 및 Mn첨가량 규명을 위해 경도 및 인장시험과 투과 전자현미경으로 조사하였다. Cu 첨가형 열연강판에서 고용강화와 시효경화를 고려한 적정 Cu 첨가량은 1.2wt% 전후였으며, Mn첨가량은 0.75-0.85wt%범위였다. 0.05%C-1.2%Cu-0.75%Mn-0.04%Nb첨가 강판에서 과시효조건에서 관찰되는 조대한 석출물은 면심입방정 구조인 $\varepsilon$-Cu인 것으로 확인되었으며, 열연상태에서는 590MPa급을 가지며, 10% pre-strain을 부여한 후 $550^{\circ}C$에서 30분 열처리할 경우 780MPa급의 인장강도를 가지는 Cu첨가형 열연강판의 제조가 가능하였다.

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Hsp70.1유전자결핍된 마우스에서 허혈 재관류 신장손상에 대한 전처치 운동의 보호효과 (Pre-Exercise Protective Effects Against Renal Ischemic Reperfusion Injury in Hsp 70.1 Knockout Mice)

  • 이진;김원규
    • 생명과학회지
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    • 제20권4호
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    • pp.555-560
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    • 2010
  • 이 연구는 Hsp70.1 유전자가 결핍된 생쥐를 이용하여 운동전처치에 따른 신장허혈재관류손상에서 혈청 크레아틴, 신장에서 CuSOD와 MnSOD의 발현변화를 관찰하는데 그 목적을 두고 있다. 실험동물은 c57/BL6 계 수컷(wild type: WT)과 Hsp70.1 knockout (KO) 생쥐를 정상대조군(n=8), 운동군(n=8), 허혈운동군(n=8) 및 허혈군(n=8)의 4군으로 분류하여 이용하였다. 실험종료 후 마취를 한 후 혈청 creatinine을 분석하기 위해서 신장에서 혈액을 추출하였고, 신장을 적출하여 western blot 으로 eCuSOD와 MnSOD 발현변화를 비교하였다. KO 허혈군에서의 CuSOD, MnSOD는 다른 군에 비해 유의하게 낮게(p<0.001, p<0.05) 발현하였으며, creatinine은 높은(p<0.001)농도로 나타났다. 반면 WT에서는 유의한 변화가 나타나지 않았다. 흥미롭게도 KO허혈운동군에서의 CuSOD, MnSOD는 허혈군보다 뚜렷하게 증가하였으며, creatinine은 허혈군에 비해 현저히 감소(p<0.01)하였다. 이상의 결과를 종합하면 Hsp70은 신장허혈재관류손상에 직접적인 관련이 있음을 추정할 수 있다. 따라서 운동전 처치는 허혈성신장기능저하에 예방할 수 있다고 생각된다.

급속반응공정에 의한 동 테이프 $Bi_{2}Sr_{2}CaCu_{2}O_{8}$ (Fabrication of $Bi_{2}Sr_{2}CaCu_{2}O_{8}$ Superconducting Films by the LiReac-PreCu Method)

  • 성현태;한상철;한영희;이준성;최희락
    • 한국초전도ㆍ저온공학회논문지
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    • 제1권1호
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    • pp.7-14
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    • 1999
  • Wekk oriented $Bi_{2} Sr_{2} CaCu_{2} O_{8}$ suppercondcting thick films were fabricared on copper tape by LiReac-PreCu (liquid reaction between a Cu-free precousor and Cu tape) method. Cu-free precursor power which is composed of $Bi_{2}Sr_{2}Ca_{5}$ was printed on a copper tape by screen printing and was heat-treated. The speciment were partially in a molten state at the heat treatment temperature (85$0^{\circ}C$~87$0^{\circ}C$). The heat heat treatments for the reaction were performed in air or low oxygen pressure in several stages. XRD analyses of the resulting Bi2Sr2CaCu2O8 superconducting tapes show that the $Bi_{2} Sr_{2} CaCu_{2} O_{8}$ phase is dominant and a small amount of $Bi_{2} Sr_{2} Cu_{2} O_{6}$ phase is detected. Both phases are aligned in the c-axis direction.

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견의 탄닌처리에 관한 연구(II) - 매염제의 영향을 중심으로 - (A Study on Tannin Treatment of silk fabrics(II) - The effect of mordants -)

  • 설정화;최석철
    • 한국염색가공학회지
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    • 제6권2호
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    • pp.1-9
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    • 1994
  • In order to study the effect of mordanting on silk fabrics treated with tannin, those fabrics were treated with Al, Cu, Cr, Fe, Sn by pre and post mordanting. It was studied about color change, weighting effect, dgree of photodegradation by pre and post mordanting. The results are as fallows ; 1. On the addition of mordants into mimosa and tannic acid solution, &{\lambda}_{max}& of the former was slightly blue-shifted, on the other hand, &{\lambda}_{max}& of the latter was obviously Red-shifted. 2. In case of Cu, Cr, Pre mordanting, weighting effect were appeared. Weighting effect of silk fabrics treated with Tannic acid increased higher than mimosa by mordanting. 3. In color change, Silk fabrics treated with Mimosa and Tannic acid generally changed to red direction and fabrics treated with tannic acid changed to yellow direction by pre and post mordanting. 4. In the photodegradation, the degree of photodegradation on mordanted fabrics increased. Its degree was slack in Cu, Cr, Post mordanting. On the other hand, Al, Fe, Sn were greate. Silk fabrics treated with Mimosa and Tannic acid got inhibiting effect on photodegradation.

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