• Title/Summary/Keyword: pre-cu

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Pre-adaptation to Cu during Plant Tissue Culture Enhances Cu Tolerance and Accumulation in Begonia (Begonia evansiana Andr.)

  • Ahn, Yeh-Jin;Park, Jong-Moon
    • Journal of Ecology and Environment
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    • v.30 no.3
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    • pp.271-276
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    • 2007
  • A simple and efficient protocol was developed for culturing Cu-tolerant and Cu-accumulating plants via pre-adaptation to Cu during plant tissue culture. We induced multiple shoots from begonia (Begonia evansiana Andr.) leaf explants on MS medium supplemented with naphtaieneacetic acid and benzyladenine. After 3 months, small plantlets were transferred to MS medium supplemented with $100{\mu}M\;CuCl_2$ for pre-adaptation to Cu and cultured for 5 months. Then, these plantlets were individually planted in pots containing artificial soil. An additional 500 mg of Cu dissolved in 1/4 strength MS solution was applied to each pot during irrigation over the course of 2 months. We planted pre-adapted and control begonias in soil from the II-Kwang Mine, an abandoned Cu mine in Pusan, Korea, to examine their ability to tolerate and accumulate Cu for phytore-mediation. Pre-adapted begonias accumulated $1,200{\mu}g$ Cu/g dry root tissue over the course of 45 days. On the other hand, non-Cu-adapted controls accumulated only $85{\mu}g$ Cu/g dry root tissue. To enhance Cu extraction, chelating agents, ethylenediamine tetraacetic acid (EDTA)-dipotassiun and pyridine-2,6-dicarboxylic acid (PDA), were applied. While the chelating agents did not enhance accumulation of Cu in the roots of control begonias, EDTA application increased the level of Cu in the roots of pre-adapted begonias twofold (to $2,500{\mu}g$ Cu/g dry root tissue). Because pre-adapted begonias accumulated a large amount of Cu, mainly in their roots, they could be used for phytostabilization of Cu-contaminated soils. In addition, as a flowering plant, begonias can be used to create aesthetically pleasing remediation sites.

Effect of Pre-annealing on the Formation of Cu2ZnSn(S,Se)4 Thin Films from a Se-containing Cu/SnSe2/ZnSe2 Precursor

  • Ko, Young Min;Kim, Sung Tae;Ko, Jae Hyuck;Ahn, Byung Tae;Chalapathy, R.B.V.
    • Current Photovoltaic Research
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    • v.10 no.2
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    • pp.39-48
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    • 2022
  • A Se-containing Cu/SnSe2/ZnSe precursor was employed to introduce S to the precursor to form Cu2ZnSn(S,Se)4 (CZTSSe) film. The morphology of CZTSSe films strongly varied with two different pre-annealing environments: S and N2. The CZTSSe film with S pre-annealing showed a dense morphology with a smooth surface, while that with N2 pre-annealing showed a porous film with a plate-shaped grains on the surface. CuS and Cu2Sn(S,Se)3 phases formed during the S pre-annealing stage, while SnSe and Cu2SnSe3 phases formed during the N2 pre-annealing stage. The SnSe phase formed during N2 pre-annealing generated SnS2 phase that had plate shape and severely aggravated the morphology of CZTSSe film. The power conversion efficiency of the CZTSSe solar cell with S pre-annealing was low (1.9%) due to existence of Zn(S.Se) layer between CZTSSe and Mo substrate. The results indicated that S pre-annealing of the precursor was a promising method to achieve a good morphology for large area application.

Effect of Heat Treatment of the Diffusion Barrier for Bus Electrode of Plasma Display by Electroless Ni-B Deposition (무전해 Ni-B 도금을 이용한 플라즈마 디스플레이 버스 전극용 확산방지막의 열처리 영향)

  • Choi Jae Woong;Hwang Gil Ho;Hong Seok Jun;Kang Sung Goon
    • Korean Journal of Materials Research
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    • v.14 no.8
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    • pp.552-557
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    • 2004
  • Thin Ni-B films, 1 ${\mu}m$ thick, were electrolessly deposited on Cu bus electrode fabricated by electro deposition. The purpose of these films is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier against copper contamination of dielectric layer in AC-plasma display panel. The layers were heat treated at $580^{\circ}C$(baking temperature of dielectric layer) with and without pre-annealing at $300^{\circ}C$($Ni_{3}B$ formation temperature) for 30 minutes. In the layer with pre-annealing, amount of Cu diffusion was lower about 5 times than that in the layer without pre-annealing. The difference of Cu concentration could be attributed to Cu diffusion before $Ni_{3}B$ formation at grain boundaries. However, the diffusion behavior of the layer with pre-annealing was similar to that of the layer without pre-annealing after $Ni_{3}B$ formation. With increasing annealing time, Cu concentration of both layers increased due to grain growth.

Hydrogenation of Phenylacetylene to Styrene on Pre-CxHy- and C-Covered Cu(111) Single Crystal Catalysts

  • Sohn, Young-Ku;Wei, Wei;White, John M.
    • Bulletin of the Korean Chemical Society
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    • v.32 no.5
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    • pp.1559-1563
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    • 2011
  • Thermal hydrogenation of phenylacetylene (PA, $C_8H_6$) to styrene ($C_8H_8$) on pre-$C_xH_y$- and C-covered Cu(111) single crystal substrates has been studied using temperature-programmed desorption (TPD) mass spectrometry. Chemisorbed PA with an acetylene group has been proved to be associated with hydrogen of pre-adsorbed $C_xH_y$ to form styrene (104 amu) on Cu surface. For the parent (PA) mass (102 amu) TPD profile, the TPD peaks at 360 K and 410 K are assigned to chemisorbed vertically aligned PA and flat-lying cross-bridged PA, respectively (J. Phys. Chem. C 2007, 111, 5101). The relative $I_{360K}/I_{410K}$ TPD ratio dramatically increases with increasing pre-adsorbed $C_xH_y$ before dosing PA, while the ratio does not increase for pre-C-covered surface. For PA on pre-$C_xH_y$-covered Cu(111) surface, styrene desorption is enhanced relative to the parent PA desorption, while styrene formation is dramatically quenched on pre-C-covered (lack of adsorbed hydrogen nearby) surface. It appears that only cross-bridged PA associates with adsorbed hydrogen to form styrene that promptly desorbs at 410 K, while vertically aligned PA is less likely to participate in forming styrene.

Cu Diffusion Behavior of Ni-B Diffusion Barrier Fabricated by Electroless Deposition (무전해 도금법으로 제조된 Ni-B 확산 방지막의 Cu 확산 거동)

  • Choi, Jae-Woong;Hwang, Gil-Ho;Han, Won-Kyu;Lee, Wan-Hee;Kang, Sung-Goon
    • Korean Journal of Materials Research
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    • v.15 no.9
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    • pp.577-584
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    • 2005
  • Thin Ni-B layer, $1{\mu}m$ thick, was electrolessly deposited on Cu electrode fabricated by electro-deposition. The purpose of the layer is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier. The layers were annealed at $580^{\circ}C$ with and without pre-annealing at $300^{\circ}C$ for . 30minutes. In the layer with pre-annealing, the amount of Cu diffusion was lower about 5 times than the layer without pre-annealing. The difference in Cu concentration may be attributed to $Ni_3B$ formation prior to Cu diffusion. However, the difference in Cu concentration decreased during the annealing time of 5 h due to the grain growth of Ni.

A sturdy on the sintering characteristics for Cu-Cr contact material (Cu-Cr 계 접점재료의 소결특성에 관한 연구)

  • Yeon, Young-Myoung;Oh, Il-Sung;Park, Hong-Tae;Lee, Sang-Yeup;Seo, Jung-Min
    • Proceedings of the KIEE Conference
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    • 2000.07c
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    • pp.1643-1645
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    • 2000
  • The effects of pre-sintering and infiltration conditions on the electrical and physical properties of Cu-Cr contact material have been studied. Specimens were prepared by infiltration technique, aiming at the final composition of Cu50w%Cr, with varying pre-sintering and infiltration conditions. It showed that increased pre-sintering temperature had a little influence on the final microstructure of Cu-Cr contact material, but improved the surface morphology of Cr-skeleton resulting in better wettability in the followed infiltration process. It also showed that Cr grain growth and gram shape change became prominent with increasing infiltration temperature and time.

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Determination of Optimum Cu and Mn Contents in Cu-bearing Hot Rolled Steel Sheets (Cu첨가형 열연강판의 최적 Cu 및 Mn 첨가량 규명)

  • Yoon, Il-Sung;Yun, In-Taek;Cho, Yeol-Rae;Kim, In-Bae
    • Korean Journal of Materials Research
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    • v.8 no.3
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    • pp.274-279
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    • 1998
  • Optimum Cu and Mn contents in 0.05wt%C-Cu bearing hot rolled steel sheets were investigated by vickers hardness measurement, tensile test and transmission electron microscopy. It was determined that the optimum Cu and Mn contents were 1.2wt% and 0.75-0.85wt% respectively. It was confirmed by TEM observation that the coarse recipitates were fcc $\varepsilon$-Cu in 0.05%C-1.2%Cu-0.75%Mn-O.O4%Nb steel sheets. The Cu-bearing steel sheets having 780MPa of tensile strength could be fabricated by 10% pre-strain and aging treatment at $550^{\circ}C$ for 30min.

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Pre-Exercise Protective Effects Against Renal Ischemic Reperfusion Injury in Hsp 70.1 Knockout Mice (Hsp70.1유전자결핍된 마우스에서 허혈 재관류 신장손상에 대한 전처치 운동의 보호효과)

  • Lee, Jin;Kim, Won-Kyu
    • Journal of Life Science
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    • v.20 no.4
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    • pp.555-560
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    • 2010
  • The objective of this study was to investigate levels of serum creatinine, CuSOD and MnSOD protein expression in the kidney after renal ischemic reperfusion with pre-exercise using heat shock protein 70.1 in knock-out mice (KO). The C57/BL6 strain (Wild type: WT) and KO were divided into 4 groups as follows: Sham control group (Sham), pre-exercise group (Ex), pre-exercise +ischemia group (Ex+IR), and ischemia group (IR). CuSOD and MnSOD expression were significantly decreased (p<0.01, p<0.05) and blood creatinine concentration was significantly increased (p<0.01) in the IR group of KO. In contrast, CuSOD and MnSOD expression in the Ex+IR group of KO were higher than the IR group, while creatinine concentration was significantly lower. These results suggest that Hsp70 is directly correlated to renal ischemic reperfusion injury. Pre-exercise in renal ischemia might prevent or inhibit positive oxidative stress inhibitory effects by increasing anti-oxidative enzymes (CuSOD, MnSOD) within the kidney and improve to prevent renal function. Thus, pre-exercise may have a protective role against renal injury after renal ischemia.

Fabrication of $Bi_{2}Sr_{2}CaCu_{2}O_{8}$ Superconducting Films by the LiReac-PreCu Method (급속반응공정에 의한 동 테이프 $Bi_{2}Sr_{2}CaCu_{2}O_{8}$)

  • 성현태;한상철;한영희;이준성;최희락
    • Progress in Superconductivity and Cryogenics
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    • v.1 no.1
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    • pp.7-14
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    • 1999
  • Wekk oriented $Bi_{2} Sr_{2} CaCu_{2} O_{8}$ suppercondcting thick films were fabricared on copper tape by LiReac-PreCu (liquid reaction between a Cu-free precousor and Cu tape) method. Cu-free precursor power which is composed of $Bi_{2}Sr_{2}Ca_{5}$ was printed on a copper tape by screen printing and was heat-treated. The speciment were partially in a molten state at the heat treatment temperature (85$0^{\circ}C$~87$0^{\circ}C$). The heat heat treatments for the reaction were performed in air or low oxygen pressure in several stages. XRD analyses of the resulting Bi2Sr2CaCu2O8 superconducting tapes show that the $Bi_{2} Sr_{2} CaCu_{2} O_{8}$ phase is dominant and a small amount of $Bi_{2} Sr_{2} Cu_{2} O_{6}$ phase is detected. Both phases are aligned in the c-axis direction.

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A Study on Tannin Treatment of silk fabrics(II) - The effect of mordants - (견의 탄닌처리에 관한 연구(II) - 매염제의 영향을 중심으로 -)

  • 설정화;최석철
    • Textile Coloration and Finishing
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    • v.6 no.2
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    • pp.1-9
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    • 1994
  • In order to study the effect of mordanting on silk fabrics treated with tannin, those fabrics were treated with Al, Cu, Cr, Fe, Sn by pre and post mordanting. It was studied about color change, weighting effect, dgree of photodegradation by pre and post mordanting. The results are as fallows ; 1. On the addition of mordants into mimosa and tannic acid solution, &{\lambda}_{max}& of the former was slightly blue-shifted, on the other hand, &{\lambda}_{max}& of the latter was obviously Red-shifted. 2. In case of Cu, Cr, Pre mordanting, weighting effect were appeared. Weighting effect of silk fabrics treated with Tannic acid increased higher than mimosa by mordanting. 3. In color change, Silk fabrics treated with Mimosa and Tannic acid generally changed to red direction and fabrics treated with tannic acid changed to yellow direction by pre and post mordanting. 4. In the photodegradation, the degree of photodegradation on mordanted fabrics increased. Its degree was slack in Cu, Cr, Post mordanting. On the other hand, Al, Fe, Sn were greate. Silk fabrics treated with Mimosa and Tannic acid got inhibiting effect on photodegradation.

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