• Journal of the Society of Disaster Information
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• v.13 no.3
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• pp.358-365
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• 2017

As the damage caused by disasters increases rapidly around the world, it is necessary to develop the technology for equipment to reduce human injury. Therefore in the support of fire safety and 119 rescue and rescue technology research and development project, in the "Development of a power assist device for a fireman to rescue humans(2015 ~ 2018)" for life saving restoration, we are developing equipment that satisfies the lifting performance considering the disaster environment and the disaster response scenario(Amount of load over 100 kg, height of over 1 m, height over middle 60 cm, speed over 0.2 m/s). In this study, we propose a lifting performance and environmental test method to evaluate the usefulness of the power-assisted device and analyze and verify detailed specifications of the device through dynamics analysis of the lifting performance test. This study suggests that the proposed test method can be applied practically to evaluate whether a stable performance of a power-assisted device is achieved.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.3
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• pp.1296-1301
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• 2012

This paper deals with development of the driving-will control system in power-assisted electric wheelchair. Nowadays, population of elderly people has been increased rapidly, and also an electric wheelchair has been considered as the device for the elderly. Especially, power-assisted electric wheelchair can overcome problems that a conventional electric wheelchair holds, such as lack of movement of wheelchair user. In this paper, we propose the sensors system to measure the driving-will force and perform the control action for a power-assisted electric wheelchair. And motion performance of the proposed system is verified through the experiment.

• ETRI Journal
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• v.41 no.3
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• pp.396-407
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• 2019

Laser-assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single-tier LAB process for 3D through-silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single-tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu-Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.18 no.1
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• pp.211-232
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• 2024

In this paper, we consider the resource allocation and offloading decisions of device-to-device (D2D) cooperative UAV-assisted mobile edge computing (MEC) system, where the device with task request is served by unmanned aerial vehicle (UAV) equipped with MEC server and D2D device with idle resources. On the one hand, to ensure the fairness of time-delay sensitive devices, when UAV computing resources are relatively sufficient, an optimization model is established to minimize the maximum delay of device computing tasks. The original non-convex objective problem is decomposed into two subproblems, and the suboptimal solution of the optimization problem is obtained by alternate iteration of two subproblems. On the other hand, when the device only needs to complete the task within a tolerable delay, we consider the offloading priorities of task to minimize UAV computing resources. Then we build the model of joint offloading decision and power allocation optimization. Through theoretical analysis based on KKT conditions, we elicit the relationship between the amount of computing task data and the optimal resource allocation. The simulation results show that the D2D cooperation scheme proposed in this paper is effective in reducing the completion delay of computing tasks and saving UAV computing resources.

• Journal of Electrochemical Science and Technology
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• v.1 no.1
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• pp.39-44
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• 2010

1.5 V and 3.0 V-class film-type primary batteries were designed for radio frequency identification (RFID) tag. Efficient fabrication processes such as screen-printings of conducting layer ($25{\mu}m$), active material layer ($40{\mu}m$ for anode and $80{\mu}m$ for cathode), and electrolyte/separator/electrolyte layer ($100{\mu}m$), were adopted to give better performances of the 1.5 V-class film-type Leclanch$\acute{e}$ primary battery for battery-assisted passive (BAP) RFID tag. Lithium (Li) metal is used as an anode material in a 3.0 V-class film-type $MnO_2||$Li primary battery to increase the operating voltage and discharge capacity for application to active sensor tags of a radio frequency identification system. The fabricated 3.0 V-class film-type Li primary battery passes several safety tests and achieves a discharge capacity of more than 9 mAh $cm^{-2}$.

• Journal of the Society of Disaster Information
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• v.12 no.3
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• pp.273-278
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• 2016

In this study, we set the need, purpose, and the direction of developments in life-saving devices and analyzed the disaster sites where power-assisted devices are to be applied. For this purpose, we classified the disaster in accordance with the Basic Law for on Disaster and Safety Management and analyzed the common disaster sites where power-assisted devices are available. As a result, 13 disaster sites were classified into three categories. Firstly, 8 sites of social disaster accidents, fire(suppression), fire(rescue), collapse, traffic accidents, explosion, CBR(chemical, biological, and radiological), environment pollution, and other safety accidents, were defined. Secondly, 4 disaster accidents, earthquake, flood, typhoon and other natural disasters, were classified. Finally, other disaster sites were taken into account.

• Journal of Power Electronics
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• v.7 no.3
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• pp.181-190
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• 2007

This paper presents a novel circuit topology of a DC bus line series switch and parallel snubbing capacitor-assisted soft-switching PWM full-bridge inverter type DC-DC power converter with a high frequency planar transformer link, which is newly developed for high performance arc welding machines in industry. The proposed DC-DC power converter circuit is based upon a voltage source-fed H type full-bridge soft-switching PWM inverter with a high frequency transformer. This DC-DC power converter has a single power semiconductor switching device in series with an input DC low side rail and loss less snubbing capacitor in parallel with the inverter bridge legs. All the active power switches in the full-bridge arms and DC bus line can achieve ZCS turn-on and ZVS turn-off transition commutation. Consequently, the total switching power losses occurred at turn-off switching transition of these power semiconductor devices; IGBTs can be reduced even in higher switching frequency bands ranging from 20 kHz to 100 kHz. The switching frequency of this DC-DC power converter using IGBT power modules can be realized at 60 kHz. It is proved experimentally by power loss analysis that the more the switching frequency increases, the more the proposed DC-DC power converter can achieve a higher control response performance and size miniaturization. The practical and inherent effectiveness of the new DC-DC converter topology proposed here is actually confirmed for low voltage and large current DC-DC power supplies (32V, 300A) for TIG arc welding applications in industry.

• Journal of Power Electronics
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• v.5 no.3
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• pp.233-239
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• 2005

In this paper, a new conceptual circuit configuration of a 3-phase voltage source, soft switching AC-DC-AC converter using an IGBT module, which has one ARCPL circuit and one ARDCL circuit, is presented. In actuality, the ARCPL circuit is applied in the 3-phase voltage source rectifier side, and the ARDCL circuit is in the inverter side. And more, each power semiconductor device has a novel clamp snubber circuit, which can save the power semiconductor device from voltage and current across each power device. The proposed soft switching circuits have only two active power semiconductor devices. These ARCPL and ARDCL circuits consist of fewer parts than the conventional soft switching circuit. Furthermore, the proposed 3-phase voltage source soft switching AC-DC-AC power conversion system needs no additional sensor for complete soft switching as compared with the conventional 3-phase voltage source AC-DC-AC power conversion system. In addition to this, these soft switching circuits operate only once in one sampling term. Therefore, the power conversion efficiency of the proposed AC-DC-AC converter system will get higher than a conventional soft switching converter system because of the reduced ARCPL and ARDCL circuit losses. The operation timing and terms for ARDCL and ARCPL circuits are calculated and controlled by the smoothing DC capacitor voltage and the output AC current. Using this control, the loss of the soft switching circuits are reduced owing to reduced resonant inductor current in ARCPL and ARDCL circuits as compared with the conventional controlled soft switching power conversion system. The operating performances of proposed soft switching AC-DC-AC converter treated here are evaluated on the basis of experimental results in a 50kVA setup in this paper. As a result of experiment on the 50kVA system, it was confirmed that the proposed circuit could reduce conduction noise below 10 MHz and improve the conversion efficiency from 88. 5% to 90.5%, when compared with the hard switching circuit.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.99-99
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• 1999

투명전도막인 Ito(Indium Tin Oxide)는 flat panel display 와 solar cell 같은 optoelectronic 이나 microelectronic device에서 널리 이용되어 지고 있다. 현재 상용화되고 있는 거의 대부분의 ITO 박막은 sputtering법에 의해 제조되고 있으나 공정상의 이유로 15$0^{\circ}C$이상의 기판온도가 요구되어진다. 그런, 실제 display device 제조공정에서는 비정질 실리콘 박막이나 유기막 위에 ITO박막을 제작할 필요성이 증대되어 지고 있고, 또한 다른 전자소자에 있어서도 상온 ITO 박막 형성 공정에 대한 필요성이 증대되고 있다. 이러한 이유로 본 실험에서는 IBAE(Ion Beam Assisted Evsporation)을 이용하여 저온 ITO박막을 유기막 위에 증착하는 공정에 대한 연구를 수행하였다. 이렇게 증착된 ITO 박막의 결정성은 비정질이었다. 또한, 모든 display device 제작에는 식각공정이 필수인데 기존에 사용되고 있는 wet etching 법은 등방성 식각특성 때문에 미세 pattern 형성에 부적합？, 따라서 비등방성 식각에 용이한 plasma etching법을 사용하여 저온 증착된 ITO 박막의 식각특성을 알아보았다. 실험에 사용된 식각장비는 자장 강화된 유도결합형 플라즈마 식각장비(MEICP)를 사용하였으며, 13.56MHz의 RF power를 사용하였다. 식각조건으로 source power는 600W~1000W, 기판 bias boltage는 -100V~-250V를 가하였으며, Ar, CH4, O2, H2, BCl3의 식각 gases, 5mTorr~30mTorr의 working pressure 변화 그리고 기판 온도에 따른 식각특성을 관찰하였다. ITO 가 증착된 기판으로는 유기물 중 투명전도성 박막에 기판으로서 사용가능성이 클 것으로 기대되어지는 PET(polyethylene-terephtalate), PC(polycarbonate), 아크릴을 사용하여 기판 변화가 식각특성에 미치는 영향에 대해서 각각 관찰하였다. 식각속도의 측정은 stylus profiler를 이용하여 측정하였으며 식각후에 표면상태는 scanning electron spectroscopy(SEM)을 이용하여 관찰하였다.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.9 no.12
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• pp.4835-4855
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• 2015

TV white space (TVWS) is showing promise to become the first widespread practical application of cognitive technology. In fact, regulators worldwide are beginning to allow access to the TV band for secondary users, on the provision that they access the geolocation database. Device-to-device (D2D) can improve the spectrum efficiency, but large-scale D2D communications that underlie TVWS may generate undesirable interference to TV receivers and cause severe mutual interference. In this paper, we use an established geolocation database to investigate the power allocation problem, in order to maximize the total sum throughput of D2D links in TVWS while guaranteeing the quality-of-service (QoS) requirement for both D2D links and TV receivers. Firstly, we formulate an optimization problem based on the system model, which is nonconvex and intractable. Secondly, we use an effective approach to convert the original problem into a series of convex problems and we solve these problems using interior point methods that have polynomial computational complexity. Additionally, we propose an iterative algorithm based on the barrier method to locate the optimal solution. Simulation results show that the proposed algorithm has strong performance with high approximation accuracy for both small and large dimensional problems, and it is superior to both the active set algorithm and genetic algorithm.