• 한국태양에너지학회:학술대회논문집
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• 2011.04a
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• pp.25-30
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• 2011

In this paper, we analyzed the electrical characteristics with Micro-cracks in Photovoltaic module. Micro cracks are increasing the breakage risk over the whole value chine from the wafer to the finished module, because the wafer or cell is exposed to mechanical stress. And The solar cells have to with stand the stress under out door operation in the finished module. Here the mechanical stress is induced by temperature changes and mechanical loads from wind and snow. So, we experimentally analyze the direct impact of micro-cracks on the module power and the consequences after artificial aging. The first step, we made micro-cracks in PV module by mechanical load test according to IEC 61215. Next, PV modules applied the thermal cycling test, because micro-cracks accelerated aging by thermal cycling test, according to IEC61215. Before every test, we checked output and EL image of PV module. As the result of first step, we detected little power loss(0.9%). But after thermal cycling test increased power loss about 3.2%.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.12
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• pp.1856-1863
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• 2004

In the last 50 years, lead-contained solder materials have been the most popular interconnect materials used in the electronics industry. Recently, lead-free solders are about to replace lead-contained solders for preventing environmental pollutions. However, the reliability of lead-free solders is not yet satisfactory. Several researchers reported that lead-contained solders have a good fatigue property. The others published that the lead-free solders have a longer thermal fatigue life. In this paper, the reason for the contradictory results published on the estimation of fatigue life of lead-free solder is investigated. In the present study, fatigue behavior of 63Sn37Pb, and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluating the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder ball joint in BGA packages. It was found that lead-free solder joints have a good fatigue property in the small temperature range condition. That condition induce small strain amplitude. However in the large temperature range condition, lead-contained solder joints have a longer fatigue life.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1740-1743
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• 2007

In this study, two types of fatigue tests were conducted. First, cyclic bending tests were performed using the micro-bending tester. A four-point bending test method was adopted, because it induces uniform stress fields within a loading span. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. The pseudo-power cycling method makes up for the weak points in a power cycling and a chamber cycling method. Two compositions of solder are tested in all test condition, one is lead-free solder (95.5Sn4.0Ag0.5Cu) and the other is eutectic lead-contained solder (63Sn37Pb). In the cyclic bending test, the solder that exhibits a good reliability can be reversed depending on the load conditions. The lead-contained solders have a longer fatigue life in the region where the applied load is high. On the contrary, the lead-free solder sustained more cyclic loads in the small load region. A similar trend was detected at the thermal cycling test. A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. A constitutive model which includes both creep and plasticity was employed. Thermal fatigue was occurred due to the creep. And plastic deformation is main damage for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.

• Journal of Industrial and Engineering Chemistry
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• v.67
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• pp.266-275
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• 2018

Herein, a novel operating life (OL) test method was evaluated with 200 mAh pouch-type lithium-ion batteries. By combining the calendar life (CL) test with intermediate pulse power cycling, more realistic life prediction was possible, which encompassed real operation of batteries accompanying with thermal acceleration. Larger capacity decrease and resistance increase of pouch cell were observed in the OL test, which was well explained using the SEI film growth model. After dissemble of pouch cell, capacity loss and resistance increase mostly occurred within anode, reflecting that SEI film growth on anode surface was highly attributable to cell degradation.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1318-1319
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• 2011

In this paper, we analyzed of growth and electrical characteristics of micro-cracks with thermal effect in PV module. The micro-cracks are increasing the breakage risk over the whole value chine from the wafer to the finished module, because the wafer or cell is exposed to mechanical stress. we experimentally analyze the direct impact of micro-cracks on the module power and the consequences after artificial aging. The first step, we made micro-cracks in PV module by mechanical load test according to IEC 61215. Next, PV modules applied the thermal cycling test, because microcracks accelerated aging by thermal cycling test. according to IEC61215. Before every test, we checked output and EL image of PV module.

• Journal of Power Electronics
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• v.17 no.3
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• pp.811-820
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• 2017

The reliability issue of IGBT is a concern for researchers given the critical role the device plays in the safety of operations of the converter system. The reliability of power devices can be estimated from the intermittent life test, which aims to simulate typical applications in power electronics in an accelerated manner to obtain lifetime data. However, the test is time-consuming, as testing conditions are not well considered and only rough provisions have been made in the current standards. Acceleration of the test by changing critical test conditions is controversial due to the activation of unexpected failure mechanisms. Therefore, full investigations were conducted on critical test conditions of intermittent life test. A design optimization process for IGBT intermittent life testing program was developed to save on test times without imposing additional failure mechanisms. The applicability of the process has been supported by a number of tests and failure analysis of the test results. The process proposed in this paper can guide the test process for other power semiconductors.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.49-49
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• 2004

• Journal of Welding and Joining
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• v.33 no.3
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• pp.25-31
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• 2015

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from electronic devices and system. Specifically, reliability issue of lead-free solder joint have an increasing demand for the car electronics caused by ELV banning. The authors prepared engine control unit and cabin electronics soldered with Sn-3.0Ag-0.5Cu (SAC305). To compare with the degradation characteristics of solder joint strength, thermal cycling test (TC), power-thermal cycling test (PTC) and series tests were conducted. Series tests were conducted for TC and PTC combined stress test using the same sample in sequence and continuously. TC test was performed at $-40{\sim}125^{\circ}C$ and soak time 10 min for 1000 cycles. PTC test was applied by pulse power and full function conditions during 100 cycles. Combined stress test was tested in accordance with automotive company standard. Solder joint degradation was observed by optical microscopy and environment scanning electron microscopy (ESEM). In addition, to compare with deterioration of bond strength of quad flat package (QFP) and chip components, we have measured lead pull and shear strength. Based on the series test results, consequently, we have validated of series test method for lifetime and reliability of Pb-free solder joint in automotive electronics.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.112-112
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• 2010

The purpose of development is to localize a connector for connection of cable and GIS for underground transmission system. The cable connector for GIS provides electrical insulation of GIS housing part and makes connection of ultra high voltage electrical apparatus and power cable by controlling electrical stress between electrodes of power cable termination. Generally Korean switchgear makers are using a connector for GIS made by foreign companies. We manufactured sample by best structure design of great capacity conductor connecting part and then modified the design by analysis of shape and section. We completed the suitable sample for current cycling test condition of conductor connecting part sample and ensured surge characteristics of line by short-time current test.

• Proceedings of the KIEE Conference
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• 1999.07b
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• pp.871-873
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• 1999

According to the reports about the failure mode analysis of modules and systems, It is said that there are many early failure of system. To remove latent defects which causes early failures like that, It is necessary that screening test is performed. ESS is often used fur screening electronic equipments, and is proposed by the most powerful tool for removing latent defects of electronic equipments. [1][2] In this report, the procedure of the environmental stress screening which uses the temperature cycling stress is proposed. It is considered about environmental conditions of distributed control system(DCS) to be tested, design specifications of the system, recommended conditions of relative IEC-STD and applied conditions of similar company. ESS test was applied at the DCS to be installed in power plant. As the results of analyzing discovered problems. It was found that almost latent defects of electronic control systems was discovered early.