• ETRI Journal
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• v.33 no.6
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• pp.864-870
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• 2011

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.

• Bulletin of the Korean Chemical Society
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• v.10 no.6
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• pp.485-488
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• 1989

A carbon paste coated-wire ion-selective electrode for chloride (carbon chloride-CWE) was constructed using epoxy resin, ion-exchanger and carbon powder as a polymer membrane. Its utility, the composition of a polymer membrane, the response characteristics, and the selectivity were examined and applied to the environmental water analysis. The carbon chloride-CWE was prepared using a silver wire, which was covered with silver chloride and then coated with epoxy resin into which chloride ion-exchanger and carbon powder were previously incorporated in advance. The response of the carbon chloride-CWE was Nernstian for $1.0{\times}10^{-2}-2{\times}10^{-5}$ M chloride and the useful pH range from $10^{-2} M Cl- to 10^{-4} M Cl^-$ was 3.0-9.0. Furthermore, the selectivity of chloride over iodide, bromide, and cyanide was much improved compared with those for a solid state epoxy body chloride electrode and a liquid membrane chloride electrode. The carbon chloride-CWE was applied to determine Cl^-$ in tap and ground water. The obtained results were in good agreement with those by the established methods such as spectrophotometric or other chloride-selective electrode methods.

• The Journal of Korean Academy of Prosthodontics
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• v.28 no.1
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• pp.203-216
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• 1990

The purpose of this study was to evaluate the cervical margin fitness in the collarless metal ceramic crowns formed by different techniques. Specimens were divided as follows : the metal ceramic crowns with metal butt margin as group I, the collarless metal ceramic crowns formed with resin binder technique as group II, and the collarless metal ceramic crowns formed with shoulder powder mixed with phosphate-bonded investment liquids on a refractory die as group III. Each group was made of five specimens, and their marginal fitness on each epoxy die was evaluated under scanning electron microscope of x200 magnification at three measuring points : mesial, central, distal. The following results were obtained. 1. The metal ceramic crowns with metal butt margin exhibited significantly better marginal fitness than the collarless metal ceramic crowns. The marginal fitness in descending order was group I, III, II. 2. The collarless metal ceramic crown formed with resin binder technique had the worst marginal fitness & showed cervical color variation and dermacation between the corrected porcelain & the dentin porcelain. 3. The collarless metal ceramic crowns formed with shoulder powder mixed with phosphate-bonded investment liquids on a refractory die exhibited significantly better marginal fitness & sharper marginal configuration than the other collarless group.

• ETRI Journal
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• v.34 no.5
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• pp.706-712
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• 2012

In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed to form low-volume solder bumps on a through silicon via (TSV) chip for the 3D IC integration through the conventional reflow process. To obtain the optimized volume of solder bumps using the SBM, the effect of the volumetric mixing ratio of resin and solder powder is studied in this paper. A no-flow underfill material named "fluxing underfill" is proposed for a simplified stacking process for the 3D IC integration. It can remove the oxide layer on solder bumps like flux and play a role of an underfill after the stacking process. The bumping process and the stacking process using the SBM and the fluxing underfill, respectively, for the TSV chips are carefully designed so that two-tier stacked TSV chips are sucessfully stacked.

• ETRI Journal
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• v.37 no.3
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• pp.523-532
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• 2015

Recently, we have witnessed the gradual miniaturization of electronic devices. In miniaturized devices, flip-chip bonding has become a necessity over other bonding methods. For the electrical connections in miniaturized devices, fine-pitch solder bumping has been widely studied. In this study, high-volume solder-on-pad (HV-SoP) technology was developed using a novel maskless printing method. For the new SoP process, we used a special material called a solder bump maker (SBM). Using an SBM, which consists of resin and solder powder, uniform bumps can easily be made without a mask. To optimize the height of solder bumps, various conditions such as the mask design, oxygen concentration, and processing method are controlled. In this study, a double printing method, which is a modification of a general single printing method, is suggested. The average, maximum, and minimum obtained heights of solder bumps are $28.3{\mu}m$, $31.7{\mu}m$, and $26.3{\mu}m$, respectively. It is expected that the HV-SoP process will reduce the costs for solder bumping and will be used for electrical interconnections in fine-pitch flip-chip bonding.

• Journal of the Korean Magnetics Society
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• v.5 no.5
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• pp.687-689
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• 1995

Our team works on mixture of hard magnetic materials. As hard magnetic material we used mixture of powders: melt-spun ribbon Nd-Fe-B, ferrite and Alnico. Their different mixtures are basic material for dielectromagnets under our investigation. Main disadvantage of dielectromagnets with Nd-Fe-B alloy powder as a component is a low corrosion resistance. Protection against corrosion is covering dielectromagnets with metallic or organic coating film. The coating film protects dielectromagnets from free particles on the surface and low resistance for mechanical stresses too. The surface of dielectromagnets prepared from mixture of powders if formed by metallic particles - powder of Nd-Fe-B and Alnico, particles of oxide - powder of ferrite and particles of resin - bonding materials. Team work on technology of laying the metallic coating on dielectromagnets prepared from mixture of mentioned powders. Papers show the results of initial investigation on metallic coating technology. It shows influence of type and used technology of the metallic coating film on magnetic properties of dielectromagnets.

• Proceedings of the Korean Printing Society Conference
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• 2007.11a
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• pp.59-64
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• 2007

We have manufactured low-curable silver pastes for gravure printing out of roll to roll printing process. When printing, the pastes be used different silver powder shape because of the printing characteristics. The pastes were prepared with silver powder by silver powder shape, polyester resin, solvent and homogenized on a standard three-roller mill. And the pastes exhibited a shear-thinning flow at viscosity profile. Moreover the adhesive strength and resistivity of silver film had good characteristics. With the manufactured paste in this study, RFID antenna circuit had flexible is manufactured and it had $10^{-4}{\sim}10^{-5}{\Omega}{\cdot}cm$.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.9
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• pp.781-786
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• 2015

Recently, studies of 3D printing methods have been working in various applications. For example, the powder base method laminates the prints by using a binding or laser sintering method. However, the draw back of this method is that the post process is time consuming and does not allow for parts to be rapidly manufactured. The binding method requires the post process while the time required for the post process is longer than the manufacturing time. This paper proposes a UV curing binding method with an integrated piezo printing head system. The optimization of an arbitrary waveform generation for the control of a UV curable resin droplet was researched, in addition to developed optimized UV curing processes in multi nozzle ink jet heads.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.04a
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• pp.147-150
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• 2004

Graphite reinforced conductive polymer composites were fabricated by the compression molding technique. Graphite powder (conductive filler) was mixed with an epoxy resin to impart electrical property in composites. The ratio of graphite powder was varied to investigate electrical property of cured conductive composites. In this study, graphite filled conductive polymer composites with high filler loadings$(>60wt.\%)$ were manufactured to accomplish high electrical conductivity(> 100S/cm). Graphite powder increase electrical conductivity of composites by direct physical contact between particles. While high filler loadings are needed to attain good electrical property, the composites becomes brittle. So the ratio of filler to epoxy was varied to optimize of cured composites. The optimum molding pressure according to filler was proposed experimentally.

• Journal of Powder Materials
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• v.14 no.6
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• pp.410-414
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• 2007

Carbon contamination from the binder resin is an inherent problem with the metal powder injection molding process. Residual carbon in the W-Cu compacts has a strong impact on the thermal and electric properties. In this study, uncertainty was quantified to evaluate determination of carbon in a W-15%Cu MIM body by the combustition method. For a valid generalization about this evaluation, uncertainty scheme applied even to the repeatability as well as the uncertainty sources of each analyse step and quality appraisal sources. As a result, the concentration of carbon in the W-Cu part were measured as 0.062% with expanded uncertainty of 0.003% at 95% level. This evaluation example may be useful to uncertainty evaluation for other MIM products.