• Bulletin of the Korean Chemical Society
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• v.35 no.5
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• pp.1379-1384
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• 2014

${\alpha}-Fe_2O_3$ spherical particles having an average diameter of ca. 420 nm and ${\alpha}-Fe_2O_3$ fine particles (< 10 ${\mu}m$ particle size) were prepared to examine as catalysts for CO oxidation. Kinetic studies on the catalytic reactions were performed in a flow reactor using an on-line gas chromatography system operated at 1 atm. The apparent activation energies and the partial orders with respect to CO and $O_2$ were determined from the rates of CO disappearance in the reaction stage showing a constant catalytic activity. In the temperature range of $150-275^{\circ}C$, the apparent activation energies were calculated to be 13.7 kcal/mol on the ${\alpha}-Fe_2O_3$ spherical submicron clusters and 15.0 kcal/mol on the ${\alpha}-Fe_2O_3$ fine powder. The Pco and $Po_2$ dependencies of rate were investigated at various partial pressures of CO and $O_2$ at $250^{\circ}C$. Zero-order kinetics were observed for $O_2$ on both the catalysts, but the reaction order for CO was observed as first-order on the ${\alpha}-Fe_2O_3$ fine powder and 0.75-order on the ${\alpha}-Fe_2O_3$ spherical submicron clusters. The catalytic processes including the inhibition process by $CO_2$ on the ${\alpha}-Fe_2O_3$ spherical submicron powder are discussed according to the kinetic results. The catalysts were characterized using XRD (X-ray powder diffraction), FE-SEM (field emission-scanning electron microscopy), HR-TEM (high resolution-transmission electron microscopy), and $N_2$ sorption measurements.

• Journal of the Korean Chemical Society
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• v.38 no.6
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• pp.411-417
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• 1994

For the analysis of fine ceramics, which is one of the new materials difficult to be dissolved, the methods of sample pretreatments such as alkali fusion and high pressure acid digestion were studied using inductively coupled plasma-atomic emission spectrometer(ICP-AES). For the Al2O3 powder sample, the results from high pressure acid digestion method showed better reproducibility than those obtained by alkali fusion technique. In the case of the analysis of SiC powder using the former method, impurities of the powder in the range of ppm were determined without matrix interference by removing Si as Si-F volatilization. Japan Certified Reference Materials (JCRM022 and JCRM023) were analyzed by this method for ultra fine powder and the results showed high accuracy and good reproducibility.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.55-59
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• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.65-68
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• 2013

A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process. A selective solder bumping mechanism without the mask is based on the material design of SBM. Maskless screen printing process can implement easily a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology. Its another advantage is ternary or quaternary lead-free SoP can be formed easily. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 ${\mu}m$ is, successfully, formed.

• Journal of the Korea Concrete Institute
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• v.12 no.4
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• pp.103-111
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• 2000

The influence of the improvement of grain shape of the coarse aggregate to the unit powder content of concrete and the fine aggregate ratio for the increase of the flowability and segregation resistance of high performance concrete was examined. According to the experimental results, flowability and compacting of concrete presents best states in the S/a which has the smallest 패야 ratio. The coarse aggregate after improvement of grain shape, that has changed from the 0.68 of spherical rate of disk shape to 0.73, led fine aggregate ratio to be down 6% (i.e from 47% to 41%). The improvement of grain shape of the coarse aggregate also led the lowest unit powder content to be down 60kg/㎥ (ie from 530kg/㎥ to 470kg/㎥). And approximate 10% of unit water content has been reduced as unit powder content was down. However, the compressive strength after the improvement of grain shape of the coarse aggregate decreased to 5% due to decrease of adhesiveness of the aggregate and cement paste.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.34-41
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• 2004

A new method to fabricate the fine magnetic abrasives by using mechanical alloying is proposed. The mechanical alloying process is a solid powder process where the powder particles are subjected to high energetic impact by the balls in a vial. As the powder particles in the vial are continuously impacted by the balls, cold welding between particles and fracturing of the particles take place repeatedly during the ball milling process using a planetary mill. After the manufacturing process, fine magnetic abrasives which the guest abrasive particles c lung to the base metal matrix without bonding material can be obtained. The shape of the newly fabricated fine magnetic abrasives was investigated using SEM and its polishing performance was verified by experiment. It is very helpful to finishing the injection mold steel in final polishing stage. The areal ms surface roughness of the workpiece after several polishing processes has decreased to a few nanometer scales.

• Nuclear Engineering and Technology
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• v.52 no.8
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• pp.1714-1723
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• 2020

This study aims at characterizing the rheological properties of uranium oxide powders for nuclear fuel pellets manufacturing. The flowability of these powders must be compatible with a reproducible filling of press molds. The particle size distribution is known to have an impact on the rheological properties and fine particles (<100 ㎛) are suspected to have a detrimental effect. In this study, the impact of the particle size distribution on the rheological properties of UO₂ powders was quantified, focusing on the influence of fine particles. Two complementary approaches were used. The first approach involved characterizing the powder in a static state: density, compressibility and shear test measurements were used to understand the behavior of the powder when it is transitioned from a static to a dynamic state (i.e., incipient flow conditions). The second approach involved characterizing the behavior of the powder in a dynamic state. Two zones, corresponding to two characteristic behaviors, were demonstrated for both types of measurements. The obtained results showed the amount of fines should be kept below 10 % wt to ensure a robust mold filling operation (i.e., constant mass and production rate).

• Journal of Powder Materials
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• v.13 no.1 s.54
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• pp.46-51
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• 2006

Through the volume change of Sn in a low-temperature phase transformation, the Sn nanopowder with high, purity, was fabricated by an economic and eco-friendly process. The fine cracks were spontaneously generated. in, Sn ingot, which was reduced to powders in the repetition of phase transformation. The Sn nanopowder with 50 run in size was obtained by the 24th repetitions of phase transformation by low-temperature and ultrasonic treatments. Also, the $SnO_2$ powder was fabricated by the oxidation of the produced Sn powder to the ingot and milled by the ultrasonic milling method. The $SnO_2$ nanopowder of 20 nm in size was fabricated after the milling for 180 h.

• 한국신재생에너지학회:학술대회논문집
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• 2005.06a
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• pp.310-313
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• 2005

The conical fluidizing system of a binary mixture of Geldart C powders and Geldart A particles was defined as the conical powder-particle fluidized bed. We used a cold conical powder-particle fluidized bed model having a 0.104m-I.D. and 0.6m-high with an apex angle of $10^{\circ}$ for fluidization of a binary powder-particle mixture of 50 $vol\%$ fine carbon black powders (HI-900L, Korea Carbon Black Co.) and coarse alumina particles $(90{\mu}m)$ under different superficial gas velocities (0-0.1 m/s). The differential bed pressure drop increases with increasing gas velocity, and it goes from zero to a maximum value with increasing or decreasing gas velocity. In the conical fluidized beds of fine powders, demarcation velocities of the partial fluidization, full fluidization, partial defluidization was not observed.

• Electrical & Electronic Materials
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• v.9 no.1
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• pp.38-43
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• 1996

A coprecipitation method was used for preparing Ca and Pt doped $SnO_2$ fine powder. Components of the powder were investigated by XPS and SIMS. Crystallite size and specific surface area were investigated by TEM, XRD, and BET analysis. $SnO_2$(Ca)/Pt based thick film devices were prepared by a screen printing technique for methane gas detection. Then sensing characteristics of the devices were investigated. As Ca and Pt added, the crystal growth of $SnO_2$ was suppressed during calcining and sintering, and the sensitivity of $SnO_2$(Ca)/Pt thick film to methane gas was enhanced. For the Pt doped $SnO_2$ fine particle, the thick film device shows sensitivity of about 83% to 2000 ppm methane gas at an operating temperature of >$400^{\circ}C$.