• Title/Summary/Keyword: polymide

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Control of Pretilt Angle by UV exposure during Imidization of Polyimide for Homeotropic Alignment (수직 배향용 폴리미이드의 소성시에 UV 조사를 이용한 프리틸트각 제어)

  • 황정연;서대식;한은주;갬재형
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.11
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    • pp.950-953
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    • 2000
  • Aligning capabilities of nematic liquid crystal(NLC) using an in-situ photo-alignment method with obliquely polarized UV exposure on a polyimide (PI) surface for homeotropic alignment were studied. The high angle for NLC can be measured by obliquely UV exposure of 30°on the PI surface for 10∼20 min. The pretilt angle of NLC generated using the in-situ photo-alignment was higher than that of a conventional photo-alignment method. Finally, we suggest that the control of pretilt angle in NLC with obliquely polarized UV exposure during imidization of the polymer for homeotropic alignment is promising method to generate high pretilt angle.

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XPS를 이용한 Cu/Polyimide와 Cu/TiN 계에 대한 연구

  • 이연승
    • Proceedings of the Korean Vacuum Society Conference
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    • 2000.02a
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    • pp.169-169
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    • 2000
  • 최근 반도체 소자의 초고집적화 현상에 따라 기존의 Al-base 합금에 대한 한계에 달하면서 그에 대한 대체 물질로 Cu가 관심을 모으게 되었고 그럼으로써 Cu metallization을 위한 많은 연구가 진행되어 왔다. Cu는 Al-base 합금계보다 비저항이 낮고, 녹는점이 높으며, 또한 electromigration 특성이 뛰어난 것으로 알려져 있다. 공학적인 면에서 이미 이들 계에 대한 adhesion 및 전기적 특성에 대한 많은 연구가 있어왔지만, 이들 특성 변화에 대한 물리적 의미를 제공할 만한 기초 자료들이 부족한 상태이다. 본 연구에서는 부도체인 polyimide 박막과 diffusion barrier인 TiN 박막위에서의 Cu 박막성장에 따르는 interface chemical reaction의 변화를 XPS를 이용하여 관찰함으로서 이들 계에 있어서의 adhesion과의 관계를 조사하였다. 그리고 XPS를 이용한 modified surface accumulation method를 적용시켜 TiN diffusion barrier를 통한 Cu의 grain boundary diffusion 상수들을 측정하였다. Cu/TiN system의 경우에는 interface chemical reaction이 일어나지 않았지만 Cu/polymide system에 있어서는 boundary diffusivity는 특히 40$0^{\circ}C$에서 $650^{\circ}C$ 영역에서, Db=60$\times$10-11exp[-0.29/(kBT)]cm2/sec 이었다.

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Photoprimary Processes and Nanometer-Nanosecond Morphological Dynamics of Polymer Films Studied by Pump and Probe Measurement

  • Mito, Takashi;Masubuchi, Tomokazu;Tada, Takuji;Fukumura, Hiroshi;Masuhara, Hiroshi
    • Journal of Photoscience
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    • v.6 no.3
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    • pp.109-115
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    • 1999
  • Intense excimer laser irradiation of polymer films results in expansion and the following contraction , recovering ithe initial flat surface. The morphological dynamics is meausred directly by nanosecond time-resolved interferometry for polystyrene(PS), polyurethane, and polyimide films. The expansion proceeds with a speed of a few nm/ns , while the contraction depends upon the polymer ; very low contraction for PS, rapid 2 component shrinking for polyurethane, and rapid monotonous decay for polymide. These characteristic behavior are considered from viewpoints of interpenetrating structures of polymers, glass-rubber phase transitioni, thermal diffusion, and photothermal mechanism.

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Laser Ablation : Fundamentals and applications in Micropatterning and Thin Film Formation

  • J. Heitz;D. Bauerle;E. Arenholz;N. Arnold;J.T. Dickinson
    • Journal of Photoscience
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    • v.6 no.3
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    • pp.103-108
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    • 1999
  • We present recent results on ablation mechanism, single-pulse laser micropatterning , pulsed-laser deposition(PLD) and particulates formation accompanying laser ablation, with special emplasis on polymers, in particular polymide, (PI), and polytetrafluoroethylene, (PTFE). Ablation of polymers is described on the basis of photothermal bond breaking within the bulk material. Here, we assume a first order chemical reaction, which can be described by an Arrhenius law. Ablation starts when the density of broken bonds at the surface reaches a certain critical value. Single-pulse laser ablation of polyimide shows a clear-length dependence of the threshold fluence. This experimental result strongly supports a thermal ablation model. We discuss the various possibilities and drawbacks of PLD and describe the morphology, physical properties and applications of PTFE films.

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Flame Retardant Synergistic Performance between Cyclic Diphosphonate Ester and Melamine in Polyamide 6 (Polymide 6에서 Cyclic Diphosphonate Ester와 Melamine의 난연 효과)

  • Wang, Xueli;Jiang, Jianming;Yang, Shenglin;Jin, Junhong;Li, Guang
    • Polymer(Korea)
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    • v.32 no.2
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    • pp.125-130
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    • 2008
  • A commercial cyclic diphosphonate ester (TPMP) and melamine (MA) was combined and added to polyamide 6 (PA6) to prepare the fire retardant PA6. An increase of the oxygen index to 28.6 as well as an improvement of the UL-94 classification to V-0 rating was observed. Cone measurements explained the rate of heat release (RHR) decreased and TGA showed the early decomposition and high solid residue due to co-addition of TPMP and MA, suggesting the occurrence of synergistic effect of TPMP and MA on fire resistance of PA6. The morphology of the char developed during combust ion showed the appearance of thick, intumescent cells on the surface of retardant PA6, which protects the underlying material from the action of the heat flux or flame and limits the diffusion of combustible volatile products towards the flame and oxygen.

Development of Debris-free Process using Erasable Ink for Polymer Ablation (폴리머의 어블레이션 시 소거성 잉크를 이용한 잔유물 제거공정 개발)

  • Shin, D.S.;Lee, J.H.;Suh, J.;Kim, T.H.
    • Laser Solutions
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    • v.8 no.2
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    • pp.21-32
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    • 2005
  • The excimer laser ablation of a polymer occurs by the excitation of chemical bonds to energy levels that are above the dissociation energy. In this process, however, fragmented debris is finally ejected explosively by the scission of bonds and accumulates on the material surface. In the present work, a process for eliminating surface debris contamination generated by the laser ablation of a polymer is developed. The proposed approach for removing surface debris utilizes an erasable ink pasted on a polymide. The ink pasted polyimide is ablated by KrF excimer laser. The surface debris ejected from the polyimide is then combined with the ink layer on the polymer. Finally, both the surface debris and the ink layer are removed using adhesive tape or alcohol solvent. The results suggest that the erasable ink method is a simple, low cost, and extremely effective debris eliminating process.

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Study on the Comparison between DC and AC for Breakdown Characteristics of Dielectric Insulating Materials for Design of HTS Transformer in Cryogenic Environment (고온 초전도 변압기 설계를 위한 극저온환경에서 DC/AC의 절연지별 절연파괴 특성연구)

  • Park, Tae-Gun;Lee, Sang-Hwa;Shin, Woo-Ju;Seong, Jae-Kyu;Oh, Seok-Ho;Hwang, Jae-Sang;Lee, Bang-Wook
    • Proceedings of the KIEE Conference
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    • 2011.07a
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    • pp.1564-1565
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    • 2011
  • 고온 초전도(HTS) 변압기는 절연수명의 손실 없이 과부하 용량의 증가와 효율의 향상이 가능하여 기존의 변압기와는 달리 구조물의 소형화로 공간 배치가 용이하고 환경 친화적 이어서 전력시스템 운용 전반에 걸쳐 많은 이점을 제공한다. 하지만, 이러한 이점에도 불구하고 AC전압이 인가되었을 때, 교류손실에 의한 심각한 효율의 감소는 불가피하다. 따라서, HTS 변압기뿐만 아니라 고온초전도전력기기들에 대한 DC전압의 적용은 초전도상에서 전기적 저항이 거의 0이라는 큰 이점을 가지고 있기 때문에 초전도 전력기기 시스템에서 최선의 선택으로 여기어지고 있다. 그러므로 DC고온초전도 전력기기들을 개발하기 위해서는 극저온상에서의 DC 절연 특성과 같은 기초연구들이 선행 되어야 한다. 그러나, 지금까지 이 분야에 대한 연구가 많이 부족한 실정이다. 본 논문에서는 현재 초전도 전력기기의 대표적인 절연 매질인 Kraft, Kapton(Polymide)와 Nomax(Type 410)을 가지고 권선대 권선의 형상을 모의하여 DC와 AC의 절연파괴 특성의 차이점을 분석하였다. 실험의 결과로부터, 극저온상에서 각각의 절연매질에 따른 DC와 AC의 절연파괴 특성을 확인할 수 있었다.

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Preparation of Thermostable Polyimide/Polysiloxane Double Layered Films with Pressure-sensitive Adhesion Property (점착특성을 갖는 내열 폴리이미드/폴리실록산 이중층 필름 제조 연구)

  • Kwon, Eunjin;Jung, Hyun Min
    • Polymer(Korea)
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    • v.38 no.4
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    • pp.544-549
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    • 2014
  • Double layered film consisting of polyimide/polysiloxane and interface with nano domain structure was fabricated through stepwise layer formation and subsequent aging steps. During aging of film, nano phase separation occurred between the top layer polysiloxane and the upper layer of polyimide, which was observed by transmission electron microscope (TEM). A stable and uniform polysiloxane layer was obtained, showing the reproducible pressure-sensitive adhesion (PSA) property with the peel strength of 8-13 g/inch at even $300^{\circ}C$. In addition, the resulting polymide/polysiloxane film was thermo-stable up to $435^{\circ}C$, providing the promising properties suitable for application in microelectronics processing.

Electro-optic Properties and Thermal Stabilities of Polyimide-DRI Side Chain Polymer for Photonic Devices (폴리이미드-DR1 옆사슬계 전기광학 고분자의 전기광학 특성 및 열적 안정성)

  • Lee, Myeong-Hyeon;Lee, Hyeong-Jong;O, Min-Cheol;An, Ju-Heon;Han, Seon-Gyu
    • Korean Journal of Materials Research
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    • v.9 no.4
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    • pp.355-361
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    • 1999
  • We have synthesized the soluble polymide based side chain system with covalently attached NLO chromophore Disperse Red 1. The developed polymer is optically transparent in the range of optical communication wave-lengths. Its glass transition temperature$(T_g)$ and thermal decomposition temperature$(T_d)$ are $225^{\circ}C, 310^{\circ}C$ respectively. The poled film with the poling field of $100 V/\mu\textrm{m}$ shows that the dielectric constant is 3.37 at the 10-kHz frequency, the refractive indices of TM and TE modes are both 1.631 at $\lambda = 1300 nm$, and the Electro-optic coefficients are 4.6~9.2 pm/V at $\lambda = 1300 nm$. There are no decays of the EO coefficient in the poled polymer at $180^{\circ}C$ in one hour, and $90^{\circ}C$ in 500 hours.

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The Electric Breakdown Chatacteristics of Polyimide Thin Films by Self Healing Method (자기절연회복법에 의한 폴리아미드 박막의 절연파괴특성)

  • Kim, Hyeong-Gweon;Lee Eun-Hak;Park, Jong-Kwan
    • Journal of the Korean Institute of Telematics and Electronics T
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    • v.36T no.2
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    • pp.1-7
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    • 1999
  • The polymide thin films were fabricated by vapor deposition polymerized method of dry processes and studied the electric breakdown characteristics by self healing method. Polyamic-acid(PAA) thin films prepared by vapor deposition-polymerization (VDP) from PMDA(Pyromellitic dianhydride) and DDE(4,4'-diaminodiphenyl ether) were changed to PI thin films by thermal curing. In the same sample, electric breakdown fields increase with increasing test number, and then saturated over test number of the 25th. When the curing temperatures were 200$^{\circ}C$, 250$^{\circ}C$, 300$^{\circ}C$ and 350$^{\circ}C$, the electric breakdown strengths of PI were 1.21MV/cm, 3.94MV/cm, 4.61MV/cm and 4.55MV/cm at the test number of 40th.

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