• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.203-207
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• 2003

Ion implantation has been shown to significantly alter the surface properties of polymers. Polycarbonate(PC) and Polyimide(PI) were irradiated with 50keV $N^+$, $Xe^+$ ions to the fluences of $1{\times}10^{16}{\sim}3{\times}10^{17}\;cm^2$. The ion beam-induced modification of the electrical conductivity and the related structural features have been studied for polymers. The beam-induced chemical and structural modifications have been investigated by using X-ray Phooelectron Spectroscopy(XPS) and Fourier Transform-Infrared Spectroscopy(FT-IR), while the modification of the electrical properties was followed by performing a complete set of sheet resistance measurements. Samples irradiated at higher fluence showed a good conductivity, with a saturation value of $10^7{\Omega}/sq$. The XPS data demonstrate that the modification of the electrical properties is due to the progressive formation with increasing ion fluence of a dense amorphous carbon network, while PF-IR data reveal that material degradations through bond breaking are the main effects.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.289-290
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• 2005

We have investigated the electro-optical (EO) performances of the flexible liquid crystal display (LCD) on twisted nematic (TN) mode according to variation of cell gap in comparison with glass LCD. There were four kinds of cells which were having cell gaps of 3$\mu$m, 4$\mu$m and 5$\mu$m, especially the lowest 2$\mu$m on flexible and glass substrates separately. The EO performances of the flexible cells on the rubbed potyimide (PI) were almost the same those of glass cells. The response time of flexible cells was shorter than that of glass cells but the alignment of liquid crystal (LC) of flexible cells was weaker than that of glass cells. The residual DC of flexible cells was on the increase like that of glass cells in compliance with lowering cell gap.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.11a
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• pp.199-202
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• 1996

This paper describes the thermally stimulated current (TSC) measurements of arachidic acid and polyamic acid alkylamine salt(PAAS) LB film, which is a precursor of polyimide(PI). The measurements were performed from room temperature to about 25$0^{\circ}C$ and the temperature was increased at a rate of 0.02 K/s linearly. It shows that peaks of TSC are observed at about 8$0^{\circ}C$ in the arachidic acid and about 8$0^{\circ}C$, 16$0^{\circ}C$ in the PAAS LB films. Results of these measurements indicate that one peak at 8$0^{\circ}C$ is resulted from alkyl group; the other peak at 16$0^{\circ}C$ is due to alkyl and C-O group of PAAS. Additional large peak at about 16$0^{\circ}C$ is due to dipole moments in the PAAS films. The DSC and TGA of PAAS, arachidic acid and octadesylamine are measured. Thermal imidization was performed at 30$0^{\circ}C$ far 1 hour by our pre study

• Korean Journal of Materials Research
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• v.20 no.10
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• pp.555-558
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• 2010

This study examined the effect of current density on the surface morphology and physical properties of copper plated on a polyimide (PI) film. The morphology, crystal structure, and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity was controlled using current density. Large particles were observed on the surface of the copper layer electroplated onto a current density of 25 mA/$cm^2$. However, a uniform surface and lower resistivity were obtained with a current density of 10 mA/$cm^2$. One of the important properties of FCCL is the flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density rather than a high current density. Moreover, a reasonable current density is 20 mA/$cm^2$ considering the productivity and mechanical properties of copper foil.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.51-51
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• 2012

There is a growing interest in innovative chemical synthesis in microreactors owing to high efficiency, selectivity, and yield. In microfluidic systems, the low-volume spatial and temporal control of reactants and products offers a novel method for chemical manipulation and product generation. Glass, silicon, poly(dimethylsiloxane) (PDMS), and plastics have been used for the fabrication of miniaturized devices. However, these materials are not the best due to either of low chemical durability or expensive fabrication costs. In our group, we have recently addressed the demand for economical resistant materials that can be used for easy fabrication of microfluidic systems with reliable durability. We have suggested the use of various specialty polymers such as silicon-based inorganic polymers and fluoropolymer, flexible polyimide (PI) films that have not been used for microfluidic devices, although they have been used for other areas. And inexpensive lithography techniques were used to fabricate Lab-on-a-Chip type of microreactors with differently devised microchannel design. These microreactors were demonstrated for various synthetic reactions: liquid, liquid-gas organic chemical reactions in heterogeneous catalytic processes, syntheses of polymer and non-trivial inorganic materials. The microreactors were inert, and withstand even harsh conditions, including hydrothermal reaction. In addition, various built-in microstructures inside the microchannels, for example Pd decorated peptide nanowires, definitely enhance the uniqueness and performance of microreactors. These user-friendly Lab-on-a-Chip devices are useful alternatives for chemist and chemical engineer to conventional chemical tools such as glass.

• Journal of the Korean Ceramic Society
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• v.54 no.6
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• pp.518-524
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• 2017

A flexible thermoelectric device using body heat has drawn attention as a power source for wearable devices. In this study, thermoelectric thick films were fabricated by cold pressing method using p-type antimony telluride and n-type bismuth telluride powders in accordance with specific loads. Thermoelectric thick films were denser and improved the electrical and thermoelectric properties while increasing the load of the cold pressing. The thickness of the specimen can be controlled by the amount of material; specimens were approximately 700 um in thickness. Flexible thermoelectric devices were manufactured by using the thermoelectric thick films on PI (Polyimide) substrate. The process is cheap, efficient, easy and scalable. Evaluation of power generation performance and flexibility on the fabricated flexible thermoelectric device was carried out. The flexible thermoelectric device has great flexibility and good performance and can be applied to wearable electronics as a power source.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.3
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• pp.135-140
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• 2016

In this study, we developed the solution-processed PMMA-$HfO_x$ hybrid ReRAM devices to overcome the respective drawbacks of organic and inorganic materials. The performances of PMMA-$HfO_x$ hybrid ReRAM were compared to those of PMMA- and $HfO_x$-based ReRAMs. Bipolar resistive switching behavior was observed from these ReRAMs. The PMMA-$HfO_x$ hybrid ReRAMs showed a larger operation voltage margin and memory window than PMMA-based and $HfO_x$-based ReRAMs. The reliability and electrical instability of ReRAMs were remarkably improved by blending the $HfO_x$ into PMMA. An Ohmic conduction path was commonly generated in the LRS (low resistance state). In HRS (high resistance state), the PMMA-based ReRAM showed SCLC (space charge limited conduction). the PMMA-$HfO_x$ hybrid ReRAM and $HfO_x$-based ReRAM revealed the Pool-Frenkel conduction. As a result of flexibility test, serious defects were generated in $HfO_x$ film deposited on PI (polyimide) substrate. On the other hand, the PMMA and PMMA-$HfO_x$ films showed an excellent flexibility without defect generation.

• Proceedings of the KIEE Conference
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• 2007.11a
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• pp.104-105
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• 2007

In this study, characteristics of silver ink-jet printing were investigated under various substrate treatments such as substrate heating, hydrophobic coating, and ultraviolet(UV)/ozone soaking. Fluorocarbon(FC) film was spin-coated on the polyimide (PI) film substrate to obtain a hydrophobic surface. Although hydrophobicity of the FC film could reduce the diameter of the printed droplets, the singlet images printed on the FC film surface showed irregularities in the pattern size and the position of the printed droplet along with droplet merging phenomenon. The proposed UV/ozone soaking of the FC film improved the uniformity of the pattern size and the droplet position after printing and substrate heating was very effective way in preventing droplet merging. By heating of the substrate after UV/ozone soaking of the coated FC film, silver conductive lines of 78-116 ${\mu}m$ line were successfully printed at low substrate temperatures of $40^{\circ}C$.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1550-1551
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• 2007

노즐 직경 $30\;{\mu}$인 MEMS 압전 잉크젯 헤드를 이용하여 Ag 나노 잉크를 PDMS 처리된 PI(Polyimide) 기판 위에 토출하였다. 구동주파수 5 KHz에서 액적부피 1.5 pl, 속도가 약 4.5 m/s인 액적이 토출 되었다. 인쇄된 액적의 크기는 직경 약 $12\;{\mu}m$이었다. 메니스커스의 거동에 맞춘 구동파형의 입력에 의해 새틀라이트 없는 매우 작은 액적을 토출할 수 있었다.

• Clean Technology
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• v.19 no.4
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• pp.410-415
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• 2013

The supercapacitors were fabricated using silver (Ag) nano paste and activated carbon paste on the polyimide (PI) film and 5% potassium polyacrylate (PAAK) was used for gel electrolyte. In this paper, the current collector film and the electrode film were fabricated using screen printing. The thickness of printed silver paste was $7.3{\mu}m$ and the sheet resistance has the range of $5-7m{\Omega}/square$. An activated carbon with a surface area of $1,968m^2/g$, an electronic conducting agent (SUPER P, TIMCAL) and poly (4-vinylphenol) were mixed in 2-(2-buthoxyethoxy) ethyl acetate (BCA) with a ratio of 7:1:3 to fabricate the electrode paste. To analyze electrochemical characteristics, cyclic voltammetry was performed to evaluate the stability of the devices under the voltage range of -0.5-0.5 V. The calculated specific capacitances were 44.04 and 8.62 F/g for 10 and 500 mV/s scan rates, respectively.