• Title/Summary/Keyword: polycrystalline

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Analysis of Electrical Characteristics of Low Temperature and High Temperature Poly Silicon TFTs(Thin Film Transistors) by Step Annealing (스텝 어닐링에 의한 저온 및 고온 n형 다결정 실리콘 박막 트랜지스터의 전기적 특성 분석)

  • Lee, Jin-Min
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.7
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    • pp.525-531
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    • 2011
  • In this paper, experimental analyses have been performed to compare the electrical characteristics of n channel LT(low temperature) and HT(high temperature) poly-Si TFTs(polycrystalline silicon thin film transistors) on quartz substrate according to activated step annealing. The size of the particles step annealed at low temperature are bigger than high temperature poly-Si TFTs and measurements show that the electric characteristics those are transconductance, threshold voltage, electric effective mobility, on and off current of step annealed at LT poly-Si TFTs are high more than HT poly-Si TFT's. Especially we can estimated the defect in the activated grade poly crystalline silicon and the grain boundary of LT poly-Si TFT have more high than HT poly-Si TFT's due to high off electric current. Even though the size of particles of step annealed at low temperature, the electrical characteristics of LT poly-Si TFTs were investigated deterioration phenomena that is decrease on/off current ratio depend on high off current due to defects in active silicon layer.

Effects of In-situ doping Concentration on the Characteristics of Porous 3C-SiC Thin Films (In-situ 도핑량이 다공성 3C-SiC 박막의 특성에 미치는 영향)

  • Kim, Kang-San;Chung, Gwiy-Sang
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.6
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    • pp.487-490
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    • 2010
  • This paper describes the elecrtical and optical characteristics of $N_2$ doped porous 3C-SiC films. Polycrystalline 3C-SiC thin films are anodized by $HF+C_2H_5OH$ solution with UV-LED exposure. The growth of in-situ doped 3C-SiC thin films on p-type Si (100) wafers is carried out by using APCVD (atmospheric pressure chemical vapor deposition) with a single-precursor of HMDS (hexamethyildisilane: $Si_2(CH_3)_6)$. 0 ~ 40 sccm $N_2$ was used for doping. After the growth of doped 3C-SiC, porous 3C-SiC is formed by anodization with $7.1\;mA/cm^2$ current density for anodization time of 60 sec. The average pore diameter is about 30 nm, and etched area is increased with $N_2$ doping rate. These results are attributed to the decrease of crystallinity by $N_2$ doping. Mobility is dramatically decreased in porous 3C-SiC. The band gaps of polycrystalline 3C-SiC films and doped porous 3C-SiC are 2.5 eV and 2.7 eV, respectively.

Dielectric and Pyroelectric Properties of Dy-doped BSCT Thick Films by Screen-printing Method

  • Noh, Hyun-Ji;Lee, Sung-Gap;Nam, Sung-Pill
    • Journal of Electrical Engineering and Technology
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    • v.4 no.4
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    • pp.527-530
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    • 2009
  • $(Ba_{0.57}Sr_{0.33}Ca_{0.10})TiO_3$(=BSCT) powders, prepared by the sol-gel method, were doped using $MnCO_3$ as the acceptor and $Dy_2O_3$ as the donor. This powder was mixed with an organic vehicle. BSCT thick films were fabricated by the screen-printing techniques on the alumina substrate. The structural and dielectric properties of BSCT thick films were investigated with variation of the $Dy_2O_3$ amount. As a result of the differential thermal analysis (DTA), the exothermic peak was observed at around $670^{\circ}C$ due to the formation of the polycrystalline perovskite phase. All the BSCT thick films showed the XRD patterns of a typical polycrystalline perovskite structure. The average grain size of BSCT thick films decreased with an increasing amount of $Dy_2O_3$. The relative dielectric constant and dielectric loss of the BSCT thick film doped $Dy_2O_3$ 0.1mol% were 4637.4 and 1.6% at 1kHz, respectively.

Digital X-ray Detector에 적용을 위한 Polycrystalline CdTe 구조에 따른 전기적 신호 연구

  • Kim, Jin-Seon;O, Gyeong-Min;Jo, Gyu-Seok;Song, Yong-Geun;Hong, Ju-Yeon;Heo, Seung-Uk;Nam, Sang-Hui
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.484-484
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    • 2013
  • 기존 진단용 Digital X-ray Detector이 직접방식에서는 a-Se (Amorphous Selenium)이 대중화되었지만 고전압을 인가하여야한다는 점과 그로 인한 물질 자체의 Life time 감소 등 여러 단점들 때문에 기타 후보물질들로 HgI2, PbI2, PbO, CdTe, CdZnTe가 연구 되고 있다. 이러한 후보 물질들 중 본 연구에서는 PVD (Physical Vapor Deposition)방식을 이용하여 Polycrystalline CdTe 박막을 제작하고 특성 향상을 위해 유전물질을 Passive layer와 Protect layer로써 증착하였다. 또한 유전체층의 위치에 따른 특성 분석을 위해 제작된 박막은 FE-SEM (Field Emission Scanning Electron Microscope), XRD (X-ray Diffraction)을 통해 구조적인 특성을 확인하였다. 그리고 입사되는 X-ray 선량에 의해 생성되는 전기적 특성을 분석하였다, 그 결과 박막의 Grain Size는 약 $5{\mu}M$이며 (111)방향의 주 peak를 띄는 Poly CdTe형태로 증착된 것을 확인하였다. 전기적인 신호 결과 Passive layer와 Protect layer를 증착한 박막 모두 Darkcurrent가 감소된 것을 확인하였다. 또한 Sensitivity 측정 결과 Passive layer를 삽입한 경우 신호 값이 감소하였으며 Protect layer를 삽입한 경우 신호 값의 변화가 일어나지 않았다. 그러므로 Protect layer를 등착한 박막의 경우 SNR이 현저히 높아지는 결과를 낳았다.

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Characteristics of poly-Si TFTs using Excimer Laser Annealing Crystallization and high-k Gate Dielectrics (Excimer Laser Annealing 결정화 방법 및 고유전 게이트 절연막을 사용한 poly-Si TFT의 특성)

  • Lee, Woo-Hyun;Cho, Won-Ju
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.1
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    • pp.1-4
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    • 2008
  • The electrical characteristics of polycrystalline silicon (poly-Si) thin film transistor (TFT) crystallized by excimer laser annealing (ELA) method were evaluated, The polycrystalline silicon thin-film transistor (poly-Si TFT) has higher electric field-effect-mobility and larger drivability than the amorphous silicon TFT. However, to poly-Si TFT's using conventional processes, the temperature must be very high. For this reason, an amorphous silicon film on a buried oxide was crystallized by annealing with a KrF excimer laser (248 nm)to fabricate a poly-Si film at low temperature. Then, High permittivity $HfO_2$ of 20 nm as the gate-insulator was deposited by atomic layer deposition (ALD) to low temperature process. In addition, the solid phase crystallization (SPC) was compared to the ELA method as a crystallization technique of amorphous-silicon film. As a result, the crystallinity and surface roughness of poly-Si crystallized by ELA method was superior to the SPC method. Also, we obtained excellent device characteristics from the Poly-Si TFT fabricated by the ELA crystallization method.

Magnetic hysteresis loops of the polycrystalline superconductor ${SmBa_2}{Cu_3}{O_x}$ (다결정 초전도체 ${SmBa_2}{Cu_3}{O_x}$의 자기 이력곡선)

  • Lee J. H;Jung M. S;Lee B. Y;Kim G. C;Kim Y. C;Jeong D. Y
    • Progress in Superconductivity
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    • v.6 no.1
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    • pp.84-88
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    • 2004
  • The polycrystalline superconductor $SmBa_2$$Cu_3$$O_{x}$ is fabricated, and intergranular magnetic properties are investigated using the critical state model, from which some useful parameters such as the critical current density and the intergranular volume fraction are obtained. The curve fitting for M-H hysteresis loop shows that the intergranular critical current density of $SmBa_2$$Cu_3$$O_{x}$ / decreases in the form of ($1-T/T_{c}$ )$^{1.5}$ . The intergranular volume fraction is influenced by granular morphology. From SEM image, the grains of $SmBa_2$$Cu_3$$O_{x}$ are found to be randomly shaped. This mean:; that the intergranular volume fraction of $SmBa_2$$Cu_3$$O_{x}$ / should be smaller than those of superconductors, of which grains are plate-shaped such as Tl-based superconductor.

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A New Method for Deep Trench Isolation Using Selective Polycrystalline Silicon Growth (다결정 실리콘의 선택적 성장을 이용한 깊은 트랜치 격리기술)

  • 박찬우;김상훈;현영철;이승윤;심규환;강진영
    • Journal of the Korean Vacuum Society
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    • v.11 no.4
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    • pp.235-239
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    • 2002
  • A new method for deep trench isolation using selective growth of polycrystalline silicon is proposed. In this method, trench filling is performed by forming polysilicon-inner sidewalls within the trench, and then selectively growing them by reduced chemical vapor deposition using $SiH_2C1_2$gas at $1100^{\circ}C$. The surface profiles of filled trenches are determined mainly by the initial depth of inner sidewalls and the total thickness of selective growth. No chemical mechanical polishing(CMP) process is needed in this new method, which makes the process flow simpler and more reliable in comparison with the conventional method using CMP process.

The effect of process variations and post thermal annealing on the properties of LPCVD polycrystalline silicon (공정변수와 후속 열처리가 저압화학증착 다결정 실리콘 박막의 특성에 미치는 영향)

  • 황완식;최승진;이인규
    • Journal of the Korean Vacuum Society
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    • v.11 no.4
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    • pp.225-229
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    • 2002
  • LPCVD silicon films were deposited at temperatures between $560^{\circ}C$ and $650^{\circ}C$ Structure, surface roughness, films thickness and residual stress were measured by using XRD, SEM, ellipsometer, $Tektak^3$, Tencor FLX-2320 and other techniques. Polysilicon films of low stress, small surface roughness were obtained when the films are deposited at $560^{\circ}C$ in the amorphous phase and subsequently annealed to make polycrystalline silicon layers at $900^{\circ}C$ -$1100^{\circ}C$. The silicon films deposited in amorphous phase and crystallized by post thermal treatment showed better mechanical properties.

The study on the initial permeability of poly-crystalline $MgFe_{2}O_{4}$ With frequency (주파수 변화에 따른 다결정 $MgFe_{2}O_{4}$의 초기 투자율 특성 연구)

  • 김성재;정명득;백종규
    • Journal of the Korean Magnetics Society
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    • v.4 no.2
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    • pp.94-99
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    • 1994
  • This work addresses the relationship between initial complex permeability and porosity in polycrystalline Mg-ferrite material. The initial permeability corresponds to Snoek theory except the sample with large grains. The frequency which initial real permeability, $\mu$' equal 1 due to domain rotation are found in the frequency range 50-80 [MHz]. Internal magnetic field which is considered as mainly anisotropy field is 100[Oe] which is obtained from the relationship between initial complex permeability and porosity in polycrystalline Mg-ferrite material. This is almost the half value of reported anisotropy field of single Mg-ferrite. The difference between them is almost due to domain wall effect in polycrystalIine Mg-ferrite material.

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The Microstructure and Ferroelectric Properties of Ce-Doped Bi4Ti3O12 Thin Films Fabricated by Liquid Delivery MOCVD

  • Park, Won-Tae;Kang, Dong-Kyun;Kim, Byong-Ho
    • Journal of the Korean Ceramic Society
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    • v.44 no.8
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    • pp.403-406
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    • 2007
  • Ferroelectric Ce-doped $Bi_4Ti_3O_{12}$ (BCT) thin films were deposited by liquid delivery metal organic chemical vapor deposition (MOCVD) onto a $Pt(111)/Ti/SiO_2/Si(100)$ substrate. X-ray diffraction (XRD) and scanning electron microscopy (SEM) were used to identify the crystal structure, the surface, and the cross-section morphology of the deposited ferroelectric flims. After annealing above $640^{\circ}C$, the BCT films exhibited a polycrystalline structure with preferred (001) and (117) orientations. The BCT lam capacitor with a top Pt electrode showed a large remnant polarization ($2P_r$) of $44.56{\mu}C/cm^2$ at an applied voltage of 5 V and exhibited fatigue-free behavior up to $1.0{\times}10^{11}$ switching cycles at a frequency of 1 MHz. This study clearly reveals that BCT thin film has potential for application in non-volatile ferroelectric random access memories and dynamic random access memories.