• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.534-537
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• 2007

To promote liquid crystal application of nanoimprint lithography, a polymer with new concept is proposed. The material consists of a polyamic acid for good LC alignment and an epoxy resin for good imprinting. The result of sum-frequency generation (SFG) vibrational spectroscopy proves that this material is a functionally gradient material. This material shows excellent capability as a nanoimprinting material as well as an LC alignment layer.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1754-1756
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• 2000

Organic semiconductors based on fused-ring polycyclic aromatic hydrocarbon have great potential to be utilized as an active layer for electronic and optoelectronic devices. In this study, pentacene thin films and electrode materials were deposited by Organic Molecular Beam Deposition(OMBD) and vacuum evaporation respectively. For the gate dielectric, polyamic acid was spin-coated and cured into polyimide at 350$^{\circ}C$. Electrical characteristics of the devices were investigated, where the channel length and width was 50${\mu}m$ and 5mm. It was found that field effect mobility was 0.012$cm^{2}/Vs$, and on/off current ratio was $10^5$.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.67-67
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• 2002

패키지 기술의 개발은 저비용, 고성능, 높은 패키징 효율의 추세로 가고 있다. 이러한 추세에 따라 기판재료의 개발 및 구조의 변형이 요구된다. 패키지의 한 형태인 MCM(Multi-Chip Module)에 연성기판을 사용할 경우 fine pattern이 가능하고 부피가 작기 때문에 패키지의 효율이 좋고 또한 reel to reel process에 적용이 가능하기 때문에 대량생산의 이점을 가지고 있다. 연성기판은 좋은 전기적 특성을 가진 polyimide와 구리 층으로 구성된다. 그러나 polyimide와 구리 계층 사이에 약한 접착력과 구리로의 polyamic acid의 diffusion, 다층 기판의 제조의 어려움 등의 문제점을 남겨두고 있다. 본 연구는 일반적인 polyimide/copper가 구조가 가지고 있는 문제점을 해결하고 구리 패턴을 제작하기 위해 에칭을 쓰는 것을 배제함으로 fine pattern을 이루어 내었으며 전기도금으로 완전하게 채워진 pluged via을 사용함으로 각층간의 연결에 신뢰성을 부여하였다. 또한, 연성기판의 구조적인 문제점인 해결하여 다층 연성기판을 제조하려고 한다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.475-478
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• 2000

Maxwell displacement current(MDC) was generated when the area per molecule was about 140${\AA}$$^2$and 100${\AA}$$^2$. MDC were investigated in connection with monolayer compression cycles. It was found that the maximum of MDC appeared at the molecular area just before the initial rise of surface pressure in compression cycles. The absorption spectra of polyamic acid containing p-methoxyazobenzene in a mixture of N,N-dimethylacetamide(DMAc) and benzene(1:1 by volume) solution was induced photoisomerization by UV and visible light irradiation. The precursor LB film was heated in a vacuum dry oven at 120$^{\circ}C$ in order to convert it into the LB film of polyimide. The absorption spectra of LB films were also induced photoisomerization by UV and visible light irradiation.

• Proceedings of the KIEE Conference
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• 1994.11a
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• pp.222-224
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• 1994

This paper describes the optimum conditions for depositing PAAS(polyamic acid alkylamine salts) Langmuir-Blodgett (LB) films, which are a precursor of polyimide LB films. The optimum conditions were studied by $\pi$-A isotherma with a varication of temperatures, spreading amounts or solution, compression speeds, and etc. Transfer ratio was also measured depending on the type of LB films.

• Polymer(Korea)
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• v.25 no.2
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• pp.254-262
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• 2001

Epoxy resin based upon the N,N'-diglycidylaniline which is widely used in optic, electronic and composite material. We modified this epoxy resin with poly(amic acid) (PAA) that is a precursor of polyimide. To improve the mechanical property we controlled PAA content and imidization ratio. PI-modified epoxy blends were prepared for the formation of IPN structure. The possible reaction in the epoxy resin/PAA blends were investigated by FT-IR and inherent viscosity techniques. Thermal properties are measured by TGA, DSC, and TMA. Mechanical properties are measured by UTM and impact test machine. Morphology is investigated by SEM. Thermal stability improved with increasing the content of PAA in blends. As the content of PAA increases in blend, the glass transition temperature and thermal expansion coefficient decreases. Increasing impact strengths in J/m in the range of 920∼2412 were observed in blends. The PAA segment may act as a toughening agent in the epoxy networks, thus contributing the impact strength improvement of the blends.

• Polymer(Korea)
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• v.30 no.2
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• pp.162-167
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• 2006

Polyamic acid (PAA) was prepared from cyclobutane-1,2,3,4-tetracarboxylic dianhydride (CBDA) and 4,4'-fiaminodiphenyl ether (DDE). In order to impart a photosensitivity to the PAA, diazonaphthoquinone (DNQ) derivative (DI) was added. However, the addition of the DI was not enough to inhibit the dissolution of the PAA for a aqueous alkal solution. Therefore, we had synthesized poly(amic acid ester)s by an adding 1,2-epoxy-3-phenoxypropane to the PAA. That is, an acidity of the PAA could be controlled by an esterification reaction of 1,2-epoxy-3-phenoxypropane with the PAA. Significant difference of a dissolution rate of the poly(amic acid ester) between an o(posed and unexposed area was observed at an acid content of 60% and less. Resolution of the positively patterned film showed about $25{\mu}m$ at the exposure dose of $200mJ/cm^2$.

• Applied Chemistry for Engineering
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• v.18 no.5
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• pp.483-489
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• 2007

Polyaniline (PANI)/Polyimide (PI) membranes were prepared and the effects of PANI contents and doping on the structural properties and gas separation properties were studied. The polyamic acid (PAA) solution was prepared by the polycondensation reaction of 4,4'-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) and 4,4'-oxydianiline (ODA) in 1-methyl-2-pyrrolydinone (NMP) solvent. The PANI/PI blends were obtained by mixing PAA solution and PANI solution, and were doped with 1 M aqueous HCl solution for 24 h. The structural characterizations of the as-cast and doped membranes were examined by FT-IR, XRD, and TGA. The gas permeation experiments with $H_2$, $CO_2$, $O_2$, $N_2$, and $CH_4$ were carried out by variable pressure method at $30^{\circ}C$ and 5 atm. For all gases tested, the permeability coefficients of the blends decreased with increasing PANI content and the magnitude of permeability was in the order of $H_2$ > $CO_2$ > $O_2$ > $N_2$ > $CH_4$. The permeability for PANI/PI membranes decreased after the doping process while the permselectivity increased. For $H_2/CH_4$ separation, the doped PANI/PI (75/25) membrane has a permselectivity of 991.

• Applied Chemistry for Engineering
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• v.32 no.2
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• pp.143-148
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• 2021

A thermally conductive 200 ㎛ thick polyimide-based film was made from a polyamic acid (PAA) precursor containing graphene prepared from graphite rod using an electrostatic discharge method in order to improve the thermal conductivity and expand the applicability of polyimide (PI) film. Properties of graphene produced by electrostatic discharge were measured by Raman spectroscopy, transmission electron microscopy and X-ray photoelectron spectroscopy (XPS). As a result of Raman spectrum and XPS analyses of as-prepared graphene, the ID/IG ratio was 0.138 and C/O value was 24.91 which are excellent structural and surface chemical properties. Moreover, thermal conductivities of polyimide films increased exponentially according to graphene contents but when the graphene content exceeded 40%, the polyimide film could not maintain its shape. The thermal conductivity of carbonized PI film made from PAA containing 40 wt% of graphene was 51 W/mK which is greatly enhanced from the pristine carbonized PI film (1.9 W/mK). This result could be originated from superior properties of graphene prepared from the electrostatic discharge method.

• Applied Chemistry for Engineering
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• v.2 no.4
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• pp.340-347
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• 1991

Siloxane containing copolyimide (SPI) was synthesized from 3, 3', 4, 4'-benzophenonetetracarboxylic dianhydride(BTDA), 4, 4'-methylene dianiline(MDA), 4, 4'-oxydianiline(ODA) and amine-terminated polydimethyl-siloxane(PDMS). Homopolyamic acid(HPAA) in tetrahydrofuran(THF) was reacted with PDMS to obtain siloxane containing polyamic acid(SPAA) followed by the thermal curing to manufacture SPI. SPAA and HPAA exhibited inherent viscosity value of 0.35~0.48dl/g. Glass transition temperature of SPI ranged in $258^{\circ}C{\sim}264^{\circ}C$. SPI had a lower $T_g$ than that of HPI. ODA based HPI and SPI showed slightly higher $T_g$ values, thermal stability, and water content.