• 제목/요약/키워드: polishing wax

검색결과 16건 처리시간 0.023초

실리콘 웨이퍼 생산공정용 왁스 스핀코팅장치 내 기류 특성에 대한 3차원 전산유동해석 (A Three-Dimensional CFD Study on the Air Flow Characteristics in a Wax Spin Coater for Silicon Wafer Manufacturing)

  • 김용기;김동주;우마로프 알리세르;김경진;박준영
    • 한국기계가공학회지
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    • 제10권6호
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    • pp.146-151
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    • 2011
  • Wax spin coating is a part of several wafer handling processes in the silicon wafer polishing station. It is important to ensure the wax layer free of contamination to achieve the high degree of planarization on wafers after wafer polishing. Three-dimensional air flow characteristics in a wax spin coater are numerically investigated using computational fluid dynamics techniques. When the bottom of the wax spin coater is closed, there exists a significant recirculation zone over the rotating ceramic block. This recirculation zone can be the source of wax layer contamination at any rotational speed and should be avoided to maintain high wafer polishing quality. Thus, four air suction ducts are installed at the bottom of the wax spin coater in order to control the air flow pattern over the ceramic block. Present computational results show that the air suction from the bottom is quite an effective method to remove or minimize the recirculation zone over the ceramic block and the wax coating layer.

광택용 왁스로서 4차 암모늄염을 함유한 마이크로에멀젼의 특성 (Properties of Microemulsion Containing Quaternary Ammonium Salt as Polishing Wax)

  • 이장원;김명수;정노희
    • 한국응용과학기술학회지
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    • 제21권4호
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    • pp.335-344
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    • 2004
  • In this work, the properties as polishing wax for automobile of O/W type microemulsion containing wax, liquid paraffine and quaternaryammonium salt was investigated. The microemulsions were prepared at $96{\sim}97^{\circ}C$ by the phase inversion method, and polyoxyethylene(20) sorbitan monooleate (POE(20)SMO) and distearyl dimethyl ammonium chloride(D.D.A.C) as the emulsifiers were used. The mean particle size of the rnicroemulsions was about 7${\pm}$0.5nm and as the properties of polishing wax, gloss increased degree, water resistant gloss degree, initial and final contact angle after water resistance were tested. The result was that the value of water resistantance and contact angle were decreased with increasing amount of POE(20)SMO and D.D.A.C., while the gloss degree values did not affected. And the rnicroemulsion blended with mono ethylene glycol(MEG) of 5${\sim}$15wt% showed smaller particle size and more stable particle size distribution than without MEG. Finally, this microemulsion showed more excellent values of gloss degree, the water resistant gloss degree and contact angle, than two kinds of commercial polishing wax for automobile.

오존수를 이용한 실리콘 웨이퍼 연마 후 지용성 왁스 및 오염입자 제거의 영향 (Effect of Organic wax residues and particles removal by DIO3 (ozonated DI water) after Silicon Wafer batch Polishing Process)

  • 이재환;이승호;김태곤;박진구;이건호;배소익
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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    • pp.558-559
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    • 2007
  • A commercially de-waxer which kinds of solvent after was used to remove a thick organic wax film after polishing process and several steps of SC-1 cleanings were followed for the removal of organic wax residues and particles which requires long process time and high cost of ownership (COO). DIO3 was used to remove organic wax residues too achieve low COO. In this study, 0103 rinsing could use instead of 01 water rinsing. The process time and chemical consumption were reduced by using DIO3.

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실리콘 웨이퍼 연마장비용 왁스 스핀코팅장치의 내부기류 제어에 관한 전산유동해석 (CFD Analysis on the Internal Air Flow Control in a Wax Spin Coater of Silicon Wafer Polishing Station)

  • 김경진;김동주;박중윤
    • 반도체디스플레이기술학회지
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    • 제10권1호
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    • pp.1-6
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    • 2011
  • In this paper, the air flow induced by the rotating flat disk is numerically investigated in a hope to better understand the air flow structures inside the wax spin coater for a silicon wafer polishing station. Due to the complex inner geometry of actual spin coater such as the casing around the rotating ceramic block and servo motor, recirculation of air flow is inevitably found on the coating target if the internal space of spin coater is closed at the bottom and it could be the possible source of contamination on the wax coating. By numerical flow simulation, we found that it is necessary to install the air vent at the bottom and to apply the sufficient air suction in order to control the path of air flow and to eliminate the air recirculation zone above the spinning surface of coating target.

실리콘 웨이퍼 연마헤드의 강제구동 방식이 웨이퍼 연마 평탄도에 미치는 영향 연구 (Effects of Forced Self Driving Function in Silicon Wafer Polishing Head on the Planarization of Polished Wafer Surfaces)

  • 김경진;박중윤
    • 반도체디스플레이기술학회지
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    • 제13권1호
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    • pp.13-17
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    • 2014
  • Since the semiconductor manufacturing requires the silicon wafers with extraordinary degree of surface flatness, the surface polishing of wafers from ingot cutting is an important process for deciding surface quality of wafers. The present study introduces the development of wafer polishing equipment and, especially, the wafer polishing head that employs the forced self-driving of installed silicon wafer as well as the wax wafer mounting technique. A series of wafer polishing tests have been carried out to investigate the effects of self-driving function in wafer polishing head. The test results for wafer planarization showed that the LLS counts and SBIR of polished wafer surfaces were generally improved by adopting the self-driven polishing head in wafer polishing stations.

Bathythermograph Smoked-glass slide의 간역제작법 (SELF-PREPARATION OF BATHYTHERMOGRAPH SMOKED-GLASS SLIDE)

  • 허종수
    • 한국수산과학회지
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    • 제1권2호
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    • pp.135-137
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    • 1968
  • 1938년 A. F. Spillaus에 의하여 Bathythermograph가 고안된 이내 현재까지 수차 개량된 것이 제작판매하게 되어 해양조사 또는 어장탐색에 총중한 측기로 세계 각국에서 널리 보급되었다. 이 측기는 항해중이라도 수심 270m까지 내렸다 올림으로써 수심에 대한 수온이 동시에 연속된 일선으로 도은 또는 Smoked한 유리 판상에 기록되어 신속하게 수온의 미세한 수직분포를 알 수 있어 어장탐사에 필요한 나층의 판별과 그 수탐 및 수온의 판단에 큰 도움을 준다. 여기에서는 1, 2연전 이내 수산진흥원 산하 각 해구 시험소 및 교육기관을 비롯한 해양조사 관계기관에 다수양이 공급되어 널리 사용되고 있는 B.T의 Smoked-glass slide가 없어 사용의 곤란성 및 일본 또는 미국으로부터의 수입의 귀찮은 수속을 해소시키기 위하여 본원에서 실험 제작사용한 결과로서 간단하게 B.T Smoked glass Slide를 제작할 수 있는 방법을 소개하고자 한다.

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An Experimental Study on Wafer Demounting by Water Jet in a Waxless Silicon Wafer Mounting System

  • Kim, Kyoung-Jin;Kwak, Ho-Sang;Park, Kyoung-Seok
    • 반도체디스플레이기술학회지
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    • 제8권2호
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    • pp.31-35
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    • 2009
  • In the silicon wafer polishing process, the mounting stage of silicon wafer on the ceramic carrier block has been using the polishing template which utilizes the porous surface instead of traditional wax mounting method. Here in this article, the experimental study is carried out in order to study the wafer demounting by water jet and the effects of operating conditions such as the water jet flowrate and the number of water jet nozzles on the wafer demounting time. It is found that the measured wafer demounting time is inversely proportional to the water flowrate per nozzle, regardless of number of nozzles used; implying that the stagnation pressure by the water jet impingement is the dominant key factor. Additionally, by using the transparent disk instead of wafer, the air bubble formation and growth is observed under the disk, making the passage of water flow, and subsequently demounting the wafer from the porous pad.

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의안의 제조 방법에 관한 연구 (A study of the manual procedure of ocular prosthesis)

  • 김재민;박동화;유근창;김순애;조승권
    • 한국안광학회지
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    • 제7권2호
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    • pp.95-99
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    • 2002
  • 단안을 잃은 사함의 외모를 인위적으로 보상하기 위한 방법으로 의안을 작용하게 되는데 본 연구에서는 의안의 제조 과정 중 가장 기본적인 방법을 소개하고 의안 용출액의 세포독성을 평가하여 의안 제조의 기술 발달을 촉진하고 안경사의 의안에 대한 관심과 연구가 활발해지기를 기대하며 본 연구를 수행하였다. 의안의 제작 과정은 왁스(wax)나 컨포머(conformer)를 이용한 기본형 제작, 석고 본뜨기, 공막 제작, 홍채 및 동공 제작, 각막 제작, 검열반 제작 그리고 연마과정을 거치는데 각 과정에 대하여 필요한 재료와 제작과정을 살펴보았다. 또한 의안의 세포 독성을 검정하기 위해 의안을 용출시켜 얻은 용액을 세포에 직접 처리하여 세포증식 저해정도를 MTT assay로 조사하였다. 본 연구에 이용된 의안의 용출액은 세포독성이 없는 것으로 나타났으며 제작과정은 가장 기본적인 제작과정을 보여줌으로써 앞으로의 의안 연구에 많은 도움을 줄 것으로 사료된다.

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4-META의치상레진과 Cobalt-Chromium계 합금의 접착강도에 관한 연구 (A STUDY ON THE BOND STRENGH OF 4-META ACRYLIC RESIN DENTURE BASE TO COBALT-CHROMIUM ALLOYS)

  • 성무경;김광남;장익태
    • 대한치과보철학회지
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    • 제28권2호
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    • pp.29-51
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    • 1990
  • This study was designed to compre the tensile bond strength of 4-META containging denture base resin to Co-Cr alloys after various surface treatments. Especially the surface treatment of sandblasting the mental with aluminum oxide and treating in oxidizing solution composed of 3% aqueous sulfuric acid with 1% potassium manganate were compared. Effect of surface roughness on bonding was measured after sandblasting with 50um, 300um aluminun oxide and polishing with emery pater. Also the effects of wax and wax solvent on bonding were observed. According to the type of polymerization process, heat-cured Meta-Dent resin and autopolymerizing Meta-Fast resin were used. For some specimnens, the tensile bond strength were measured agter three pre-conditions : 1day after bonding, immersed in water at $75^{\circ}C{\pm}3^{\circ}C$ for 4weeks, under normal ambient condition for 4weeks. The following results were obtained from this study : 1. The bond strengths of resins containing 4-META were significantly higher than those of conventional denture base resins(p<0.05). 2. Autopolymerizing Meta-Fast resin had higher bond strength than heat-cured Meta-Dent, resin(p<0.05). 3. The bond strengths of Biosil and Nobilium to 4-META containging resins were not significally different(p>0.05). 4. Stable adhesion can be achieved when mechanically roughen the metal surface by snadblasting with $50{\mu}m$ aluminum oxide than treating in an oxidizing soluing with potassium manganate(p<0.05). 5. Once the metal surface is contaminated with wax, the bond srtength decreased greatly in spite of wax wash with boiling water. But the bond strength recovered significantly with the use of wax solvent 6. Meta-Dent resin had higher bond strength when roughen the metal surface with $50{\mu}m$ aluminum oxide than with $300{\mu}m$ aluminum oxide(p<0.05). In case of Meta-Fast, resin, the use of $300{\mu}m$aluminum oxide was a little advantageous of bonding, but was statistically insignificant(p>0.05).

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A comparative study on the accuracies of resin denture bases and metal denture bases

  • Park Hwee-Woong;Kim Chang-Whe;Kim Yung-Soo
    • 대한치과보철학회지
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    • 제39권3호
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    • pp.250-259
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    • 2001
  • Since the late 1930s, acrylic resins have been the materials of choice for the fabrication of complete denture bases. It has excellent esthetic properties, adequate strength, low water sorption, and low solubility. But acrylic resin has disadvantage of processing shrinkage that reduces denture retention and accuracy of denture occlusion. Metals also have been used in denture base material. Metals used in denture bases display excellent strength and dimensional stability. The major disadvantages associated with metal denture bases include increased cost, difficulty in fabrication, compromised esthetic qualities, and inability to re-base. The purpose of this study is to compare the artificial tooth movements of complete dentures with resin bases and metal bases after curing, deflasking, polishing immersion in water for 1 week and 4 weeks. Twenty-four maxillary complete resin denture bases with artificial teeth were fabricated. Twelve of them were resin based and other twelve of them were metal based. Fine crosses were marked on the incisal edges of right central incisors and distobuccal cusps of be second molars. Measurements were done for the changes of distances of reference points at the time of wax denture, after deflasking after decasting after polishing after immersion in water for 1 week and 4 weeks Meaurements were done to the accuracy of 0.001mm with a measuring microscope. The results were as follows : 1. Metal base showed significantly less tooth movement than resin base after curing and decasting (p<0.01). 2. Metal base showed significantly less tooth movement than resin base after polishing (p<0.01). 3. After immersion in water for 1 week and 4 weeks, metal base showed less movement than resin base. Difference was significant for anterior-posterior distances (p<0.01), but not significant for molar-to-molar distance (p>0.01). 4. 1 week and 4 weeks of immersion failed to compensate the initial processing shrinkage of metal and resin bases (p>0.01).

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