Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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An Experimental Study on Wafer Demounting by Water Jet in a Waxless Silicon Wafer Mounting System

  • Kim, Kyoung-Jin (School of Mechanical Engineering, Kumoh National Institute of Technology) ;
  • Kwak, Ho-Sang (School of Mechanical Engineering, Kumoh National Institute of Technology) ;
  • Park, Kyoung-Seok (School of Mechanical Engineering, Kumoh National Institute of Technology)
  • Published : 2009.06.30
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Abstract

In the silicon wafer polishing process, the mounting stage of silicon wafer on the ceramic carrier block has been using the polishing template which utilizes the porous surface instead of traditional wax mounting method. Here in this article, the experimental study is carried out in order to study the wafer demounting by water jet and the effects of operating conditions such as the water jet flowrate and the number of water jet nozzles on the wafer demounting time. It is found that the measured wafer demounting time is inversely proportional to the water flowrate per nozzle, regardless of number of nozzles used; implying that the stagnation pressure by the water jet impingement is the dominant key factor. Additionally, by using the transparent disk instead of wafer, the air bubble formation and growth is observed under the disk, making the passage of water flow, and subsequently demounting the wafer from the porous pad.

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References

  1. Pei, Z. J., Fisher, G. R., and Liu, J., "Grinding of Silicon Wafers: A View from Historical Perspectives," International Journal of Machine Tools and Manufacture, Vol. 48, pp. 1297-1307, 2008. https://doi.org/10.1016/j.ijmachtools.2008.05.009
  2. Sun, W., Pei, Z. J., Fisher, and G. R., "Fine Grinding of Silicon Wafers: Effects of Chuck Shape on Grinding Marks," International Journal of Machine Tools and Manufacture, Vol. 45, pp. 673-686, 2005. https://doi.org/10.1016/j.ijmachtools.2004.09.020
  3. Noh, Y. M., Im, I. T., and Kim, K. S., "A Numerical Study on Combined Solution and Evaporation during Spin Coating," Journal of The Korean Society of Semiconductor & Display Equipment Technology, Vol. 2, pp. 25-29, 2003.
  4. Combe, S., Cullen, J., and O'Keefe, M., "Reversible Wafer Bonding: Challenges in Ramping up 150 mm GaAs Wafer Production to Meet Growing Demands," CS MANTECH Conference, Vancouver, British Columbia, Canada, 2006.