• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.6
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• pp.146-151
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• 2011

Wax spin coating is a part of several wafer handling processes in the silicon wafer polishing station. It is important to ensure the wax layer free of contamination to achieve the high degree of planarization on wafers after wafer polishing. Three-dimensional air flow characteristics in a wax spin coater are numerically investigated using computational fluid dynamics techniques. When the bottom of the wax spin coater is closed, there exists a significant recirculation zone over the rotating ceramic block. This recirculation zone can be the source of wax layer contamination at any rotational speed and should be avoided to maintain high wafer polishing quality. Thus, four air suction ducts are installed at the bottom of the wax spin coater in order to control the air flow pattern over the ceramic block. Present computational results show that the air suction from the bottom is quite an effective method to remove or minimize the recirculation zone over the ceramic block and the wax coating layer.

• Journal of the Korean Applied Science and Technology
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• v.21 no.4
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• pp.335-344
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• 2004

In this work, the properties as polishing wax for automobile of O/W type microemulsion containing wax, liquid paraffine and quaternaryammonium salt was investigated. The microemulsions were prepared at $96{\sim}97^{\circ}C$ by the phase inversion method, and polyoxyethylene(20) sorbitan monooleate (POE(20)SMO) and distearyl dimethyl ammonium chloride(D.D.A.C) as the emulsifiers were used. The mean particle size of the rnicroemulsions was about 7${\pm}$0.5nm and as the properties of polishing wax, gloss increased degree, water resistant gloss degree, initial and final contact angle after water resistance were tested. The result was that the value of water resistantance and contact angle were decreased with increasing amount of POE(20)SMO and D.D.A.C., while the gloss degree values did not affected. And the rnicroemulsion blended with mono ethylene glycol(MEG) of 5${\sim}$15wt% showed smaller particle size and more stable particle size distribution than without MEG. Finally, this microemulsion showed more excellent values of gloss degree, the water resistant gloss degree and contact angle, than two kinds of commercial polishing wax for automobile.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.558-559
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• 2007

A commercially de-waxer which kinds of solvent after was used to remove a thick organic wax film after polishing process and several steps of SC-1 cleanings were followed for the removal of organic wax residues and particles which requires long process time and high cost of ownership (COO). DIO3 was used to remove organic wax residues too achieve low COO. In this study, 0103 rinsing could use instead of 01 water rinsing. The process time and chemical consumption were reduced by using DIO3.

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.1-6
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• 2011

In this paper, the air flow induced by the rotating flat disk is numerically investigated in a hope to better understand the air flow structures inside the wax spin coater for a silicon wafer polishing station. Due to the complex inner geometry of actual spin coater such as the casing around the rotating ceramic block and servo motor, recirculation of air flow is inevitably found on the coating target if the internal space of spin coater is closed at the bottom and it could be the possible source of contamination on the wax coating. By numerical flow simulation, we found that it is necessary to install the air vent at the bottom and to apply the sufficient air suction in order to control the path of air flow and to eliminate the air recirculation zone above the spinning surface of coating target.

• Journal of the Semiconductor & Display Technology
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• v.13 no.1
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• pp.13-17
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• 2014

Since the semiconductor manufacturing requires the silicon wafers with extraordinary degree of surface flatness, the surface polishing of wafers from ingot cutting is an important process for deciding surface quality of wafers. The present study introduces the development of wafer polishing equipment and, especially, the wafer polishing head that employs the forced self-driving of installed silicon wafer as well as the wax wafer mounting technique. A series of wafer polishing tests have been carried out to investigate the effects of self-driving function in wafer polishing head. The test results for wafer planarization showed that the LLS counts and SBIR of polished wafer surfaces were generally improved by adopting the self-driven polishing head in wafer polishing stations.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.1 no.2
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• pp.135-137
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• 1968

Bathythermograph (B. T) has been coumonly used to obtain a records of water temperature in the depth of 270m from the surface. We have, however, experienced some difficulties in obtaining smoked or coated glass which is used for the bathythermograph in this region, Therefore I introduce a easy method of preparing the smoked-glass slide. Preparing method is as follows. 1. Glass slides must be cleaned by dipping into the concentrated solution of sodium hydroxide ana hydrochloric acid then rinsing with hot water and polishing with a clean gauge. 2. The cleaned slide is immersed in the wax solution for coating, and dried on the filter paper. The Wax solution is prepared as follow : 1g of white wax is dissolved in 200CC of benzol or 1g of lard is dissolved in 300CC of gasoline. 3. A slide held in a fingertip is smoked on the flame of alcohol lamp, or Meter burner. When alcohol lamp is used the fuel alcohol must contain 1/5 of benzol, and when Meker burner is used, the air intake must be blocked up. The smoking on the glass slide should be light and uniform, after smoking the slide is cooled down. 4. The smoked glass slide is again dipped into the wax solution using a fingertip and the excessive wax solution on the slide is absorbed on the filter paper and drain off. 5. Thus prepared smoked slide can be used for B.T.

• Journal of the Semiconductor & Display Technology
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• v.8 no.2
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• pp.31-35
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• 2009

In the silicon wafer polishing process, the mounting stage of silicon wafer on the ceramic carrier block has been using the polishing template which utilizes the porous surface instead of traditional wax mounting method. Here in this article, the experimental study is carried out in order to study the wafer demounting by water jet and the effects of operating conditions such as the water jet flowrate and the number of water jet nozzles on the wafer demounting time. It is found that the measured wafer demounting time is inversely proportional to the water flowrate per nozzle, regardless of number of nozzles used; implying that the stagnation pressure by the water jet impingement is the dominant key factor. Additionally, by using the transparent disk instead of wafer, the air bubble formation and growth is observed under the disk, making the passage of water flow, and subsequently demounting the wafer from the porous pad.

• Journal of Korean Ophthalmic Optics Society
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• v.7 no.2
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• pp.95-99
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• 2002

To investigate the manual procedure for custom fitting of ocular prosthesis and the cytotoxicity induced by extract solution of prosthetic eye, this study was performed. These procedures included the trial fitting of the wax model, impression molding, the an of iris color duplication, sclera mold made from the prosthetic wax model, scleral tints and vascular pattern, finishing and polishing. Inhibition of cell growth for extract solution was measured by MTT assay. Extract solution did not show the cytotoxicity. This study suggests that the manual procedure for custom fitting of ocular prosthesis is good for education of students.

• The Journal of Korean Academy of Prosthodontics
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• v.28 no.2
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• pp.29-51
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• 1990

This study was designed to compre the tensile bond strength of 4-META containging denture base resin to Co-Cr alloys after various surface treatments. Especially the surface treatment of sandblasting the mental with aluminum oxide and treating in oxidizing solution composed of 3% aqueous sulfuric acid with 1% potassium manganate were compared. Effect of surface roughness on bonding was measured after sandblasting with 50um, 300um aluminun oxide and polishing with emery pater. Also the effects of wax and wax solvent on bonding were observed. According to the type of polymerization process, heat-cured Meta-Dent resin and autopolymerizing Meta-Fast resin were used. For some specimnens, the tensile bond strength were measured agter three pre-conditions : 1day after bonding, immersed in water at $75^{\circ}C{\pm}3^{\circ}C$ for 4weeks, under normal ambient condition for 4weeks. The following results were obtained from this study : 1. The bond strengths of resins containing 4-META were significantly higher than those of conventional denture base resins(p<0.05). 2. Autopolymerizing Meta-Fast resin had higher bond strength than heat-cured Meta-Dent, resin(p<0.05). 3. The bond strengths of Biosil and Nobilium to 4-META containging resins were not significally different(p>0.05). 4. Stable adhesion can be achieved when mechanically roughen the metal surface by snadblasting with $50{\mu}m$ aluminum oxide than treating in an oxidizing soluing with potassium manganate(p<0.05). 5. Once the metal surface is contaminated with wax, the bond srtength decreased greatly in spite of wax wash with boiling water. But the bond strength recovered significantly with the use of wax solvent 6. Meta-Dent resin had higher bond strength when roughen the metal surface with $50{\mu}m$ aluminum oxide than with $300{\mu}m$ aluminum oxide(p<0.05). In case of Meta-Fast, resin, the use of $300{\mu}m$aluminum oxide was a little advantageous of bonding, but was statistically insignificant(p>0.05).

• The Journal of Korean Academy of Prosthodontics
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• v.39 no.3
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• pp.250-259
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• 2001

Since the late 1930s, acrylic resins have been the materials of choice for the fabrication of complete denture bases. It has excellent esthetic properties, adequate strength, low water sorption, and low solubility. But acrylic resin has disadvantage of processing shrinkage that reduces denture retention and accuracy of denture occlusion. Metals also have been used in denture base material. Metals used in denture bases display excellent strength and dimensional stability. The major disadvantages associated with metal denture bases include increased cost, difficulty in fabrication, compromised esthetic qualities, and inability to re-base. The purpose of this study is to compare the artificial tooth movements of complete dentures with resin bases and metal bases after curing, deflasking, polishing immersion in water for 1 week and 4 weeks. Twenty-four maxillary complete resin denture bases with artificial teeth were fabricated. Twelve of them were resin based and other twelve of them were metal based. Fine crosses were marked on the incisal edges of right central incisors and distobuccal cusps of be second molars. Measurements were done for the changes of distances of reference points at the time of wax denture, after deflasking after decasting after polishing after immersion in water for 1 week and 4 weeks Meaurements were done to the accuracy of 0.001mm with a measuring microscope. The results were as follows : 1. Metal base showed significantly less tooth movement than resin base after curing and decasting (p<0.01). 2. Metal base showed significantly less tooth movement than resin base after polishing (p<0.01). 3. After immersion in water for 1 week and 4 weeks, metal base showed less movement than resin base. Difference was significant for anterior-posterior distances (p<0.01), but not significant for molar-to-molar distance (p>0.01). 4. 1 week and 4 weeks of immersion failed to compensate the initial processing shrinkage of metal and resin bases (p>0.01).