• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.783-786
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• 2000

For the development of a ultra-precision CMC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We calculated unit removal profiles for various polishing tools and polishing tool positions. Using these results we simulate the corrective polishing process based on dwell time control. We calculate dwell time distributions and residual error of the polishing simulation method and the FFT calculation method. We got good dwell time distributions and small residual when we used the FFT calculation method. This results will be used for the optimization of corrective polishing process.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2001년도 춘계학술대회 논문집(한국공작기계학회)
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• pp.327-331
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• 2001

In the process of optical parts machining, polishing has been applied. Traditional polishing process is suitable for spherical optical parts. But it is very difficult to apply traditional process for aspheric optical parts. Nowadays, as growing needs for aspherical optic parts, many researches have been conducted. In this study, we developed computer controlled polishing system which consists of three major parts of active pressure control for correcting polishing process, mechanical on-machine measurement for rough polishing, and optical on-machine measurement for finish polishing, respectively. In this paper, a systematic stretegy for correcting polishing process, pressure control scheme for polishing tool, and on-machine measurement methods for automated and precise polishing are suggested. The information about developed machine is also included.

• 한국정밀공학회지
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• 제17권4호
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• pp.69-80
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• 2000

Generally, die polishing is a lime consuming process, resulting in 30∼50％ of the whole die manufacturing time. However, die polishing has not been automated yet, since it needs a great deal of experience and skill. This paper describes a new development of automated system for die polishing and focuses on the successful achievements of the element techniques to realize from hand skill to automation, as followings: (1) The 5 axes polishing system by the aid of robot with 2 degrees of freedom, is developed for the application of curved surface die. (2) The CAM system realizes a 5 axes tool path control for polishing and measuring. (3) The conductive elastic tool is able to meet curved surfaces of die and gives a high efficient and quality polishing characteristics. (4) The surface roughness measurement device with noncontact laser is developed and has a high reliability without surface damage.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.57.4-57
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• 2001

Polishing a die that has free-form surfaces is a time-consuming and tedious job, and requires a considerable amount of high-precision skill. Some workers tend to gradually avoid the polishing work because of the poor working conditions caused by dust and noise. In the our previous study, an automatic polishing system was developed to reduce the polishing time and cope with the shortage of skilled workers. And, to operate the polishing robot system from remote sites, communication network was constructed and monitoring programs (a server program and a client program)) were developed. However, to monitor polishing process in remote sites, users have to install monitoring programs in a client PC. Thus, user can only operate the polishibg system ...

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 춘계학술대회 논문집
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• pp.625-631
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• 2002

In the previous study, a polishing robot system was developed to automate the polishing process and to cope with the shortage of skilled workers. This polishing robot system has several advantages: reduced time for setting polishing work, decreased labor costs, effective operation, continuous polishing work without an operator, improved machine accuracy, and the ability to polish a free curved surface die. However, still the problem remains that a worker must stay to monitor the polishing process in the poor working conditions for a long time. Nowadays some advanced manufacturing companies need to find a way to check the performance of their production equipments and plants from remote sites. Thus, this study constructed the communication network and developed the monitoring programs (a servo program and a client program) to operate the polishing robot from remote sites. Using these programs, workers are able to monitor and control the polishing robot on the web page, in any place where internet service is possible. To guarantee a stable operation in spite of a variable computer operating environment, the monitoring system is implemented in Java. The experimental results showed that the developed monitoring programs provided a stable communication.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 춘계학술대회 논문집
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• pp.24-28
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• 1996

Mirror-like polishing system of hemisphericall high-speed precision bearing for digital VTR drum was developed. Mechamism of the polishing process was analyzed in the view point of polishing contact range and contact length between the tool and the workpiece surface. It was suggested that the two stage polishing process adoptiong the diamond grinding wheel and polishing tool instead of multistage lapping processes, which enables the mass production of the bearing by reduction of polishing time.

• 한국정밀공학회지
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• 제20권3호
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• pp.42-49
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• 2003

In this paper, we provide the results of polishing temperature distribution by way of infrared ray measurement system as well as polishing resistance, which can be interpreted as tribological aspects of CMP, using force measurement system. The results include the trend of polishing temperature, its distribution profile and temperature change during polishing. The results indicate that temperature affects greatly to the removal rate. Polishing temperature increases gradually and reaches steady state temperature and the period of temperature change occurs first tens of seconds. Furthermore, the friction force also varies as the same pattern with polishing temperature from high friction to low. These results suggest that the first period of the whole polishing time greatly affects the nonuniformity of removal rate.

• 한국생산제조학회지
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• 제20권5호
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• pp.632-638
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• 2011

Recently, it has been studying for the polishing process of micro parts widely. However, present MR polishing system, it is difficult to minimize electromagnet and to polish sphere or slope parts. Then, it can not be obtained demanded surface quality. In this study, material removal characteristics of BK7 glass using round endmill type MR polishing system were investigated through series of experiment. The experiments were investigated by changing imposed polishing conditions, such as rotational speed and polishing depth. As a results, very high material removal was obtained at 0.7mm gap distance, 1,980rpm.

• 대한안전경영과학회지
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• 제6권4호
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• pp.171-181
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• 2004

A multi axis whetstone polishing system, which uses the flow system of the stone polishing machine head, has been developed. The test results show that the defect by line contact polishing does not occur in both ends of the stone and that it came to trim smoothly. In terms of the surface roughness, the corresponding index was decreased by 3.6 times, improving the polishing effect greatly. It decreased significantly the dust and noise with the wet polishing. The factors of the duty evasion at production site can thus be solved with the work environment improvement against the polishing process of the stone industry and work intensive reduction.

• Tribology and Lubricants
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• 제38권1호
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• pp.1-7
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• 2022

Chemical-mechanical polishing (CMP) process is a semiconductor process that planarizes a wafer surface using mechanical friction between a polishing pad and a substrate surface during a specific chemical reaction. During the CMP process, polishing pad conditioning is applied to prevent the rapid degradation of the polishing quality caused by polishing pad glazing through repeated material removal processes. However, during the conditioning process, uneven wear on the polishing pad is inevitable because the disk on which diamond particles are electrodeposited is used. Therefore, the abrasion of the polishing pad should be considered not only for the variables during the conditioning process but also when designing the CMP conditioning system. In this study, three design variables of the conditioning system were analyzed, and the effect on the pad wear profile during conditioning was investigated. The three design variables considered in this study were the length of the conditioner arm, diameter of the conditioner disk, and distance between centers. The Taguchi method was used for the experimental design. The effect of the three design variables on pad wear and uniformity was assessed, and new variables used in conditioning system design were proposed.