• Current Optics and Photonics
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• v.1 no.6
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• pp.618-625
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• 2017

In the present research, a new bending system using a segmented vacuum chuck for Stressed Mirror Polishing (SMP) is developed. SMP is a special fabrication method for thin aspheric mirrors, where simple flat or spherical fabrication is applied while a mirror blank is deflected. Since a mirror blank is usually glued to a bending fixture in the conventional SMP process, there are drawbacks such as long curing time, inconvenience of mirror replacement, risk of mirror breakage, and stress concentration near the glued area. To resolve the drawbacks, a new bending system is designed to effectively hold a mirror blank by vacuum. For the developed bending system, the optimal bending load to achieve the designated mirror deflection is found by finite element analysis and an optimization algorithm. With the measurement results of the deflected mirror surfaces with the optimal bending loads, the feasibility of the developed bending system is investigated. As a result, it is shown that the bending system is appropriate for the SMP process.

• International Journal of Control, Automation, and Systems
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• v.6 no.3
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• pp.386-393
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• 2008

A position control method for interpolating aspherical grinding and polishing tool path was reviewed and experimented in a nano precision machine. The position-base algorithm was reformed from the time-base algorithm, proposed in the previous study. The characteristics of the algorithm were in the velocity control loop with position feedback. The aspherical surface was divided by an interval at which each velocity and acceleration were calculated. The theoretical velocity was corrected by position error during processing. In the experiment, a machine was constructed and nano-scale linear encoders were installed at each axis. Relation between process parameters and the variation of position error was monitored and discussed. The best result from optimized parameters showed that the accuracy was 150nm and improved from the previous report.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.04b
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• pp.97-101
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• 1995

This paper describes a new surface finishing process which uses magnetic abrasive polishing. This is applied to automatic finishing of die & mold surface. Nowadays, most of die & mold meanufaturing procedures have been automated by the introduction of NC machine tool and CAD/CAM system. But the surface finishing of die & mold must be done by hand work of well-skilled workers. Though many attempts were tried in the past 15 years to eliminate this hand work, the automatic finishing of die & mold surface with 3D curvature has not been achieved yet. New magnetic abrasive finishing process is thought as one of the possible methods for the automation of 3D surface finishing. In order to improve the grindability of the method, ultra-high speed and 5-axis machining was introduce. The magnetic abrasive polishing which has adopted these methods was confirmend to improve the efficiencyof die & mold surface finishing.

• International Journal of Precision Engineering and Manufacturing
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• v.7 no.4
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• pp.51-56
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• 2006

This paper proposes a control algorithm, which is verified experimentally, for aspherical surface grinding and polishing. The algorithm provides simultaneous control of the position and interpolation of an aspheric curve. The nonlinear formula for the tool position was derived from the aspheric equation and the shape of the tool. The function was partitioned at specific intervals and the control parameters were calculated at each control section. The position, acceleration, and velocity at each interval were updated during the process. A position error feedback was introduced using a rotary encoder. The feedback algorithm corrected the position error by increasing or decreasing the feed speed. In the experimental verification, a two-axis machine was controlled to track an aspherical surface using the proposed algorithm. The effects of the control and process parameters were monitored. The results demonstrated that the maximum tracking error with tuned parameters was at the submicron level for concave and convex surfaces.

• Transactions on Electrical and Electronic Materials
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• v.3 no.4
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• pp.5-9
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• 2002

Chemical mechanical polishing (CMP) has become the preferred planarization method for multilevel interconnect technology due to its ability to achieve a high degree of feature level planarity. Especially, to achieve the higher density and greater performance, shallow trench isolation (STI)-CMP process has been attracted attention for multilevel interconnection as an essential isolation technology. Also, it was possible to apply the direct STI-CMP process without reverse moat etch step using high selectivity slurry (HSS). In this work, we determined the process margin with optimized process conditions to apply HSS STI-CMP process. Then, we evaluated the reliability and reproducibility of STI-CMP process through the optimal process conditions. The wafer-to-wafer thickness variation and day-by-day reproducibility of STI-CMP process after repeatable tests were investigated. Our experimental results show, quite acceptable and reproducible CMP results with a wafer-to-wafer thickness variation within 400$\AA$.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.12
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• pp.549-554
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• 2006

In this paper we first applied the chemical mechanical polishing (CMP) process to the planarization of ferroelectric film in order to obtain a good planarity between electrode and ferroelectric film. $Pb_{1.1}(Zr_{0.52}Ti_{0.48})O_3$ (shortly PZT) ferroelectric film was fabricated by the sol-gel method. And then, we compared the structural characteristics before and after CMP process of PZT films. Removal rate, WIWNU% and surface roughness have been found to depend on slurry abrasive types and their hardness, especially, surface roughness and planarity were strongly depends on its pH value. A maximum in the removal rate is observed in the silica slurry, in contrast with the minimum removal rate occurs at ceria slurry. We found that the surface roughness of PZT films can be significantly reduced using the CMP technique.

• Restorative Dentistry and Endodontics
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• v.17 no.1
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• pp.166-180
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• 1992

One disadvantage of Glass Ionomer Cement Restoration is the difficulty in polishing. To find the appropriate polishing method, we polished the surface of Glass Ionomer Cement Restorations by 11 combination methods serially using disks shared with large-small particles and evaluated the polishing process in terms of surface roughness, surface roughness curve, and SEM findings. In addition, a visible light curing type bonding material was applied to evaluate the possible improvement in surface properties. The following results were obtained. 1. The disk surface of Glass Ionomer Cement was polished serially by disks with superfine particles, but it didn't become smooth. 2. The surface of Microfilled Composite resin became smoother as using a disk with finer particles. 3. When a visible light curing type bonding material was applied in finishing process, the surface of Glass Ionomer Cement became smooth as much as the applied matrix.

• 제어로봇시스템학회:학술대회논문집
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• 1993.10b
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• pp.541-544
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• 1993

This paper attempts to propose new procedures to evaluate roughness of ground metallic surface in the range of 1-10.mu.m from data gained by an optical, in-process measurement of the surfaces. Studies are made to process the data of reflected lights pointed at the surface to be measured. Results obtained are compared with those of measurement by stylus roughness meter. Correlations between the two types of roughness measurement are well. The proposed method can be used as a sensor for a polishing robot.

• 제어로봇시스템학회:학술대회논문집
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• 1990.10a
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• pp.41-46
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• 1990

In the existing robot programming methods, off-line method becames important role of programming because of improvement of hardware and software of PC. The purpose of this study is to develop practical robot programming system for polishing task using PC. In the first place, we have investigated the existing robot programming systems, and derived the requirement of this programming system from the existing systems. And we have decided the structure of this system. After that, we have developed this system. Using Windows software, this programming system has man/machine interface function. So users can use easily and quickly.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.6
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• pp.239-244
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• 2005

Nano-sizedporearrayswerepreparedbytheself-organizationprocessesoftheanodicoxidationusingthealuminumplatewith99.999$\%$purity.Sincethealuminumplatehasaroughsurface,thealuminumplateof1mmthicknesswasanodizedafterthepre-treatmentsofpressing,mechanicalpolishing,thermaloxidation,chemicalpolishing,andelectrochemicalpolishing.Thediameterofthenano-sizedporesandthethicknessofbarrierlayercanbecontrolledbyappliedvoltage.Thethicknessofaluminamembranecanalsobecontrolledbytheanodizingcurrent.Thenano-sizedporeswithdiameterof60$\~$120nm,thedistancebetweenthenearestporesof30$\~$60nm,andthethicknessof6$\~$7Wwereobtainedbytheanodicoxidationprocess.Theporewideningprocesswasemployedforobtainingtheone-channelwithflatsurfacebecausetheporesofthealuminamembranepreparedbythefixedvoltagemethodshowsthestructureoftwo-channelwithroughsurface.