• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.1
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• pp.127-132
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• 2006

The present study deals with polishing machining of diamond for jewelry using developed automatic polishing machine that can cut diamond to have 58 facets in a brilliant cutting which has been hardly achieved by a conventional manually operating polishing machine. Upon the 3-dimensional Sarin M/C test and analysis on the machined diamond by the developed automatic polishing machine its proportion and finishing turned out to be better than the machined diamond by the conventional manually operating polishing machine.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.327-331
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• 2001

In the process of optical parts machining, polishing has been applied. Traditional polishing process is suitable for spherical optical parts. But it is very difficult to apply traditional process for aspheric optical parts. Nowadays, as growing needs for aspherical optic parts, many researches have been conducted. In this study, we developed computer controlled polishing system which consists of three major parts of active pressure control for correcting polishing process, mechanical on-machine measurement for rough polishing, and optical on-machine measurement for finish polishing, respectively. In this paper, a systematic stretegy for correcting polishing process, pressure control scheme for polishing tool, and on-machine measurement methods for automated and precise polishing are suggested. The information about developed machine is also included.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.74-78
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• 2002

Ultra-Precision CNC polishing system including on-machine measurement system, a corrective polishing algorithm is developed. The unit removal profiles for various polishing tools and analyzed and tested and dwell time distributions and residual errors for a target removal shape are calculated. The corrective polishing algorithm is tested with various workpieces. This result will be used for the software development of the CNC polishing system.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.2
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• pp.3-7
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• 2008

A polishing machine adopting a new unique structural mechanism has been developed, named as a swing-arm type polishing machine. The mechanism is such that the tool path tracks on a spherical surface, of which the diameter is adjusted by setting up the machine mechanism properly. It has a strong benefit especially for polishing axis-symmetric concave mirror surfaces. The swing-arm type polishing machine with 5-axes has been designed in order to polish a concave mirror surface lip to diameter of 2 meters. The drawings are made using 3D CAD and strain-stress analysis has been done by finite element method. AC servo-motor has been used to move the swing arm and a operating software has been developed using a LapVIEW tool. Result of the test run was satisfactory which convinces the usefulness of the swing-arm type polishing machine.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.10a
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• pp.139-144
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• 2004

This polishing machine has many advantages to polish complicated shaped molds due to spindle header with constant pressure. But, because of new polishing machine, there is no study of the standardization of polishing by polishing conditions yet. So we want to know the relation between polishing conditions(a kind of tool, grain size) and surface roughness. The result of experimental was obtained surface roughness of 0.061${\mu}{\textrm}{m}$ Ry in case of using wood tool and grain of 6${\mu}{\textrm}{m}$ diamond.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.6
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• pp.162-168
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• 2000

The automatic die polishing machine by liquid honing has been developed and experimented on the surface of machined die. The goal of development in the automatic die polishing machine by liquid honing is to increase the accuracy and the productivity in die polishing. To reach this goal, the polishing machine consists of the automatic measuring device for contour of die, the nozzle and pumping system to spray the powder mixed with liquid, and the 3-axis guides. Before polishing, the measuring device with a semiconductor laser scans the surface of mould to get the data of contour. The data store a PC and use to control the nozzle head to move above a couple of centimeters on the machined surface of die. The experimental parameters are the spraying time, the pressure, the size of abrasive grain and the mixing ratio between abrasive grain and liquid. The surface roughness is measured on the polished die which are SKDl 1 and Al7075 machined by NC. The surface roughness indicates the values of Rmax 0.5${\mu}{\textrm}{m}$ for Al7075 and Rmax 1.4${\mu}{\textrm}{m}$ for SKDl 1. It reduces the polishing time significantly and reduces the monotonous work for labors. As the results, the liquid honing system is useful method to apply for the die polishing and the automatic die polishing machine using liquid honing shows that it's very effective processing ability.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.5
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• pp.82-88
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• 2008

Conventional aspherical lens polishing methods by the small tool polishing use aspherical profile and the trajectory of the polishing tool is also controlled. In this paper, new full contact polishing mechanism is suggested to polish aspherical glass lens mold by both airbag polishing tool and eccentric motion. Full contact concept by airbag polishing tool and no position control make the easy polishing setup and do not need aspherical design profile. An aspherical lens polishing machine was made for this study and a verification experiment was performed for surface roughness improvements.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.2
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• pp.144-151
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• 2012

Polishing is not only one of the most frequently adopted processes in modern industries, but also the most critical one to the surface quality of the products such as semi conductor wafers and LED sapphire wafers. With the required specifications for the wafer surface quality getting more and more strengthened, the manufacturers are spending huge amount of cost to renew the machine to meet the enhanced surface specifications. Surface qualities of the wafers are mostly damaged by the structural vibrations of the polishing machines. In this paper, the dynamic characteristics of a wafer polishing machine have been analyzed through the frequency response test and the computer simulation. And the supporting structure of a polishing machine has been investigated to minimize the vibration transmissions, to improve the stability of the machine and further to reduce the defects of the polished products. The result of the study shows that simple design modifications of the supporting structure without altering the main structure of the machine can substantially suppress the vibrations of the machine with negligible expenses.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.314-318
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• 2002

Recently, new polishing tool which was made by magnetic intelligent compound(Magic) was invented. The distribution of abrasives in this new tool can be controlled by magnetic field. Therefore, we can make a special polishing tool which has well arranged abrasives after cooling. In this study, 3 dimensional polishing machine was developed in order to polish complicated - shaped inner surfaces of molds. The performance of developed machine was investigated by measuring the roughness of polished surface using new polishing tool.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.2 no.1
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• pp.15-21
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• 2003

The ultrasonic polishing machine was developed to get super finishing that consist of machine part that can rotate and travel the main shaft with power 1.5kW, ultrasonic generator with frequency 20kHz. By using this machine we were investigated the characteristics of ultrasonic polishing for three different ceramics, and so could be obtained following results. First, we could be obtained the excellent surface for hard-ta-difficult cutting materials. Second, the effect of surface roughness for the feed rate could be shown that the more the feed rate Increases, the more the value of surface roughness increases. Third, owing to the characteristics being progressed brittle fracture in $Al_2O_3$ polishing with this machine, the value of surface roughness is larger than other ceramics. Forth, because the ultrasonic polishing can be smoother than the existing grinding in discharging the chips, it could be possible to improve the surface roughness about up to 15%.