• 한국정밀공학회지
• /
• 제17권4호
• /
• pp.69-80
• /
• 2000

Generally, die polishing is a lime consuming process, resulting in 30∼50％ of the whole die manufacturing time. However, die polishing has not been automated yet, since it needs a great deal of experience and skill. This paper describes a new development of automated system for die polishing and focuses on the successful achievements of the element techniques to realize from hand skill to automation, as followings: (1) The 5 axes polishing system by the aid of robot with 2 degrees of freedom, is developed for the application of curved surface die. (2) The CAM system realizes a 5 axes tool path control for polishing and measuring. (3) The conductive elastic tool is able to meet curved surfaces of die and gives a high efficient and quality polishing characteristics. (4) The surface roughness measurement device with noncontact laser is developed and has a high reliability without surface damage.

• 소성∙가공
• /
• 제21권2호
• /
• pp.138-143
• /
• 2012

A polishing method using magnetorheological (MR) fluid has been developed as a new precision technique to obtain a fine surface. The process uses a MR fluid that consists of magnetic carbonyl iron (CI) particles, nonmagnetic polishing abrasives, water and stabilizers. But the CI particles in MR fluids cause a severe corrosion problem. When coated with Xanthan gum, the CI particles showed long-term stability in corrosive aqueous environment. The surface roughness obtained from the MR polishing process was evaluated. A series of experiments were performed on fused silica glass using prepared slurries and various process conditions, including different polishing times. Outstanding surface roughness of Ra=2.27nm was obtained on the fused silica glass. The present polishing method could be used to produce ultra-precision micro parts.

• 한국생산제조학회지
• /
• 제21권5호
• /
• pp.848-854
• /
• 2012

SCM420 steel cutting gear to improve the durability is quenched. When quenching, increases surface hardness, a change of the physical properties and machinability or fall. This study, using a solid carbide hobs skiving hobbing gear cutting finishing. And cutting tool solid carbide TiAlN coating hove when TiAlN coating on the surface of multi-con polishing hob conducted aero lap nano polishing for each cutting. Experimental results conducted aero lap nano coating on the surface polishing tool machinability was excellent. And aero lap nano polishing tool results were reduced 2.5 times the tool wear compared to TiAlN coated tools. Excellent results were 1.42 times longer tool life.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 1999년도 추계학술대회 논문집 - 한국공작기계학회
• /
• pp.525-529
• /
• 1999

A cone shape drum polisher was developed to make up for the demerits of conventional CMP apparatus. The developed equipment has several superiorities. First of all, it can achieve uniform velocity profile on all the contact line because of its shape and easy to control the amount of slurry at the position of use. The whole area of wafer surface is exposed to the visual area except the contact line between wafer and drum, hence we can detect polishing end point more easily than any other polishing equipments. Also it has additional merits such as small foot print and polishing load. Polishing characteristics were investigated by developed equipment.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제51권7호
• /
• pp.311-315
• /
• 2002

Chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD), inter-level dielectric (ILD) layers of multi-layer interconnections. In this paper, we studied the characteristics of polishing pad, which can apply shallow trench isolation (STI)-CMP process for global planarization of multi-level interconnection structure. Also, we investigated the effects of different sets of polishing pad, such as soft and hard pad. As an experimental result, hard pad showed center-fast type, and soft pad showed edge-fast type. Totally, the defect level has shown little difference, however, the counts of scratch was detected less than 2 on JR111 pad. Through the above results, we can select optimum polishing pad, so we can expect the improvements of throughput and device yield.

• Design & Manufacturing
• /
• 제13권3호
• /
• pp.12-18
• /
• 2019

Fluid jet polishing is a method of jetting a fluid to polish a concave or free-form surface. However, the fluid jet method is difficult to form a stable polishing spot because of the lack of concentration. In order to solve this problem, MR fluid jet polishing system using an abrasive mixed with an MR fluid whose viscosity changes according to the intensity of a magnetic field is under study. MR fluid jet polishing is not easy to formulate for precise optimal conditions and material removal due to numerous fluid compositions and process conditions. Therefore, in this paper, quantitative data on the factors that have significant influence on the machining conditions are presented using various simulations and the correlation studies are conducted. In order to verify applicability of the fabricated MR fluid jet polishing system by nozzle diameter, the flow pattern and velocity distribution of MR fluid and polishing slurry of MR fluid jet polishing were analyzed by flow analysis and shear stress due to magnetic field changes was analyzed. The MR fluid of the MR fluid jet polishing and the flow pattern and velocity distribution of the polishing slurry were analyzed according to the nozzle diameter and the effects of nozzle diameter on the polishing effect were discussed. The analysis showed that the maximum shear stress was 0.45 mm at the diameter of 0.5 mm, 0.73 mm at 1.0 mm, and 1.24 mm at 1.5 mm. The cross-sectional shape is symmetrical and smooth W-shape is generated, which is consistent with typical fluid spray polishing result. Therefore, it was confirmed that the high-quality surface polishing process can be stably performed using the developed system.

• 대한소아치과학회지
• /
• 제43권3호
• /
• pp.275-283
• /
• 2016

본 연구는 복합레진의 연마방법에 따른 표면특성을 평가하기 위해, microhybrid 레진(Filtek$^{TM}$ Z250)과 nanofill 레진(Filtek$^{TM}$ Z350)을 연마 전, abrasive disk(Sof-lex) 연마 후, polishing brush(Occlubrush) 연마 후로 나누어 분석하였다. 그 결과 레진 표면조도는 연마 후 증가하였는데, 미세조도는 연마방법에 따른 차이가 없었으나 거시조도는 Occlubrush를 이용한 경우 현저하게 커졌다(p < 0.05). Sof-lex 연마의 경우 레진의 filler까지 연마되어 표면이 보다 균일한 형상을 보였으나 Occlubrush 연마시편은 기질층이 뜯겨져 나간 불균일한 형상을 보였다. 두 연마방법 간의 미세경도 유의차는 없었으며(p > 0.05), 연마 후 경도 값이 약 25% 상승하였다. 결론적으로, 복합레진의 표면경도 향상을 위하여 적합한 연마가 필요하며, Sof-lex를 이용한 연마가 더 우수한 것으로 사료된다.

• 대한기계학회논문집A
• /
• 제29권7호
• /
• pp.983-989
• /
• 2005

The effects of mechanical parameters on the characteristics of chemical mechanical polishing(CMP) can be directly evaluated by friction force. The piezoelectric quartz sensor for friction force measurement was installed, and friction force could be detected during CMP process. Furthermore, friction energy can be calculated by multiplying relative velocity by integration of the friction force throughout the polishing time. $SiO_2$ slurry for interlayer dielectric(ILD) CMP was used in this experiment to consider the relation of frictional characteristics and polishing results. From this experiment, it is proven that the friction energy is an essential factor of removal rate. Also, the friction force is related to removal amount per unit length(dH/ds) and friction energy has corelation to the removal rate(dH/dt) and process temporature. Moreover, within wafer non-unifornity(WIWNU) is related to coefficient of friction because of the mechanical moment equilibrium. Therefore, the prediction of polishing result would be possible by measuring friction force.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2003년도 춘계학술대회
• /
• pp.1014-1020
• /
• 2003

We have developed the ultrasonic polishing system to get super finishing that consist of machine part that can rotate and travel the main shaft with power 1.5kW, ultrasonic generator with frequency 20kHz. By using this system we were investigated the characteristics of ultrasonic polishing and deduced the major facters which affect the surface roughness by the experimental plans for three different materials such as ceramic, glass, and wafer, and so could be obtained following results. We could be obtained the excellent surface for hard-to-difficult cutting materials. The rotating speed could be found to be major factor influencing the surface roughness. In the case of ceramic and wafer, we were able to obtain good surface roughness when the feed rate and ultrasonic output is higher. In the case of glass, the surface roughness becames worse when ultrasonic output is higher because of increasing of load affacting on the particles in slurry.

• 한국공작기계학회논문집
• /
• 제16권5호
• /
• pp.90-95
• /
• 2007

Single side final polishing is a very important role to stabilize a wafer finally before the device process on the wafer is executed. In this study, the machining variables, such as pressure, machining time, and the velocity of pad table were adopted. These parameters have the major influence on the characteristics of wafer polishing. We investigated the surface roughness changing these variables to find the optimal polishing condition. Pad, slurry, slurry quantity, and oscillation distance were set to the fixed variables. In order to reduce defects and find a stable machining condition, a hall sensor was used on the polishing process. AE sensor was attached to the polishing machine to verify optimal condition. Applying data analysis of the sensor signal, experiments were performed. We can get better surface roughness from loading the quasi static force and improving wafer-holding method.