• Tribology and Lubricants
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• 제33권3호
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• pp.106-111
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• 2017

Sapphire is an anisotropic material with excellent physical and chemical properties and is used as a substrate material in various fields such as LED (light emitting diode), power semiconductor, superconductor, sensor, and optical devices. Sapphire is processed into the final substrate through multi-wire saw, double-side lapping, heat treatment, diamond mechanical polishing, and chemical mechanical polishing. Among these, chemical mechanical polishing is the key process that determines the final surface quality of the substrate. Recent studies have reported that the material removal characteristics during chemical mechanical polishing changes according to the crystal orientations, however, detailed analysis of this phenomenon has not reported. In this work, we carried out chemical mechanical polishing of C(0001), R($1{\bar{1}}02$), and A($11{\bar{2}}0$) substrates with different sapphire crystal planes, and analyzed the effect of crystal orientation on the material removal characteristics and their correlations. We measured the material removal rate and frictional force to determine the material removal phenomenon, and performed nano-indentation to evaluate the material characteristics before and after the reaction. Our findings show that the material removal rate and frictional force depend on the crystal orientation, and the chemical reaction between the sapphire substrate and the slurry accelerates the material removal rate during chemical mechanical polishing.

• 한국기계가공학회지
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• 제2권1호
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• pp.15-21
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• 2003

The ultrasonic polishing machine was developed to get super finishing that consist of machine part that can rotate and travel the main shaft with power 1.5kW, ultrasonic generator with frequency 20kHz. By using this machine we were investigated the characteristics of ultrasonic polishing for three different ceramics, and so could be obtained following results. First, we could be obtained the excellent surface for hard-ta-difficult cutting materials. Second, the effect of surface roughness for the feed rate could be shown that the more the feed rate Increases, the more the value of surface roughness increases. Third, owing to the characteristics being progressed brittle fracture in $Al_2O_3$ polishing with this machine, the value of surface roughness is larger than other ceramics. Forth, because the ultrasonic polishing can be smoother than the existing grinding in discharging the chips, it could be possible to improve the surface roughness about up to 15%.

• 한국정밀공학회지
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• 제25권2호
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• pp.28-34
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• 2008

Recently, with the development of high speed machining technology for difficult-cutting materials, to improve the cutting performance of cutting tool, fine surface finish of complex shape tools using magnetic polishing technology is in high demand. This study is, therefore, discussed and compared the cutting characteristics of polished tools by the adopted various magnetic polishing moving types a point of view the cutting forces and the tool life. Moreover, the practicality of magnetic polished tools in the wide range cutting conditions is investigated. From obtained results, It is confirmed that the CW(clockwise) revolution and oscillation type as the polishing moving type is proper and magnetic polished tool shows the excellence in high cutting speed range.

• International Journal of Precision Engineering and Manufacturing
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• 제9권2호
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• pp.34-38
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• 2008

Commercially available magnetic barrel machines equipped with permanent magnets have certain limitations: work can only be finished effectively in limited areas of the container because permanent magnets are arranged two-dimensionally on the magnet disk. We overcame this problem by developing a new magnetic barrel machine equipped with a three-dimensional magnet arrangement. The effectiveness of the new machine has already been reported; this study improved the machine's polishing ability by changing the polarity of magnets on a magnet block. Polishing experiments confirmed the most effective arrangement of magnets on the magnet block. An alternating arrangement of north and south poles produced far superior polishing characteristics than a uniform arrangement of the same pole facing outward. Alternating polarity probably causes increased quantities of barrel media to work together. Finally, we introduced stronger permanent magnets to the magnet block, and found that the increased magnetic field also improved polishing ability.

• 한국전기전자재료학회논문지
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• 제20권4호
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• pp.303-307
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• 2007

This paper investigated the effect of the pad buffing process on the material removal characteristics and pad stabilization during silicon chemical mechanical polishing. The pads surface were controlled by the buffing process using a buffer made by the sandpaper. The buffing process is based on abrasive machining by using a high speed sandpaper. The controlled pad by the buffing process show less deformation deviation and stable material removal rate during the CMP process. In addition, the controlled pad ensure better uniformity of removal rate than comparative pads. As a result of monitoring, the controlled pad by the buffing process demonstrated constant and stable friction force signals from initial polishing stage. Therefore, the tufting process could control the pad surface to be uniform and improve the performance of the polishing pad.

• 한국정밀공학회지
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• 제17권6호
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• pp.162-168
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• 2000

The automatic die polishing machine by liquid honing has been developed and experimented on the surface of machined die. The goal of development in the automatic die polishing machine by liquid honing is to increase the accuracy and the productivity in die polishing. To reach this goal, the polishing machine consists of the automatic measuring device for contour of die, the nozzle and pumping system to spray the powder mixed with liquid, and the 3-axis guides. Before polishing, the measuring device with a semiconductor laser scans the surface of mould to get the data of contour. The data store a PC and use to control the nozzle head to move above a couple of centimeters on the machined surface of die. The experimental parameters are the spraying time, the pressure, the size of abrasive grain and the mixing ratio between abrasive grain and liquid. The surface roughness is measured on the polished die which are SKDl 1 and Al7075 machined by NC. The surface roughness indicates the values of Rmax 0.5${\mu}{\textrm}{m}$ for Al7075 and Rmax 1.4${\mu}{\textrm}{m}$ for SKDl 1. It reduces the polishing time significantly and reduces the monotonous work for labors. As the results, the liquid honing system is useful method to apply for the die polishing and the automatic die polishing machine using liquid honing shows that it's very effective processing ability.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 춘계학술대회 논문집
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• pp.78-83
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• 2009

In general, Light-hardening polymer was used UV nanoimprint technology. A light-hardening polymer was had the problem of poor hardness, durability. In order to overcome the problem of polymer, inter change optical glass. However glass is very manufacture and a lowering of standars transmittance. In order to glass recover was necessary polishing process. The process is magnetorheological fluids polishing. MR polishing has been developed as a new precision finishing technique to obtain a fine surface. Hence, Magnetorheological fluids has been used for micro polishing to get micro parts. This polishing process guarantees high polishing quality by controlling the fluid density electrically. The applied material in experiments is fused silica glass. Fused silica glass is widely used in the optical field because of high degree of purity. For MR polishing experiments, MR fluid was composed with DI-water, carbonyl iron and nano slurry ceria. The wheel speed and electric current were chosen as the variables for analyzing the characteristics of MR polishing process. Outstanding surface roughness of Ra=1.58nm was obtained on the fused silica glass specimen. And originally glass transmittance was recover on the fused silica glass.

• 한국전기전자재료학회논문지
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• 제16권5호
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• pp.385-389
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• 2003

There are four main components of the CMP process: polishing pad, slurry, elastic supporter, and pad conditioner. The polishing pad is an essential component to the reproducibility of polishing uniformity in CMP process. However, the polishing pad in recently using metal CMP raised the several points of high cost caused by the increase of cycle time and the many usage of slurry. It is necessary to develop the novel polishing pad which would lead the cost reduction by the higher pad life-cycle, minimized cycle time and lower slurry usage. The characteristics of polishing pad were studied on the effects of different sets of the Polishing pad, which can be applied to metal chemical mechanical polishing process for global planarization of multilevel interconnection structure. The main purpose of this experiment is cost reduction by the increase of pad life-time, the decrease of cycle time and the lower usage of slurry through the specific hard porous structured pad design. It is confirmed that the novel polishing pad made the slurry usage decrease to 60% as well as the pad life-time increase twice with the 25% improvement of removal rate. The polishing time could be decreased and it also helped the cycle time to diminish. It can be expected that this results will help both the process throughput and the device yield to be improved.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.715-718
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• 2004

In this paper, we studied the characteristics of new polishing pad, which can apply W-CMP process for global planarization of multi-level interconnection structure. The hardness and density were measured as a function of groove pattern. Also, we compared the pore size through the SEM photograph. Finally, we investigated the CMP characteristics with five different kind of groove pattern sample. Through the above results, we can select optimum groove pattern, so we can expect to begin home product of polishing pad.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1996년도 춘계학술대회 논문집
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• pp.137-142
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• 1996

Magnetic-electrolytic-abrasive polishing system(MEAPS) was developed for machining national standard electrode and its finishing characteristics was analyzed. The paper describes the operational principle of MEAP system by experimental results. The finishing characteristics and optimal finishing condition for national standard electrodes were experimented and analyzed. As a result, MEAPS can improve straightness as well as surface roughness.