• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.74-78
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• 2002

Ultra-Precision CNC polishing system including on-machine measurement system, a corrective polishing algorithm is developed. The unit removal profiles for various polishing tools and analyzed and tested and dwell time distributions and residual errors for a target removal shape are calculated. The corrective polishing algorithm is tested with various workpieces. This result will be used for the software development of the CNC polishing system.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2001년도 춘계학술대회 논문집(한국공작기계학회)
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• pp.327-331
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• 2001

In the process of optical parts machining, polishing has been applied. Traditional polishing process is suitable for spherical optical parts. But it is very difficult to apply traditional process for aspheric optical parts. Nowadays, as growing needs for aspherical optic parts, many researches have been conducted. In this study, we developed computer controlled polishing system which consists of three major parts of active pressure control for correcting polishing process, mechanical on-machine measurement for rough polishing, and optical on-machine measurement for finish polishing, respectively. In this paper, a systematic stretegy for correcting polishing process, pressure control scheme for polishing tool, and on-machine measurement methods for automated and precise polishing are suggested. The information about developed machine is also included.

• 한국정밀공학회지
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• 제20권3호
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• pp.42-49
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• 2003

In this paper, we provide the results of polishing temperature distribution by way of infrared ray measurement system as well as polishing resistance, which can be interpreted as tribological aspects of CMP, using force measurement system. The results include the trend of polishing temperature, its distribution profile and temperature change during polishing. The results indicate that temperature affects greatly to the removal rate. Polishing temperature increases gradually and reaches steady state temperature and the period of temperature change occurs first tens of seconds. Furthermore, the friction force also varies as the same pattern with polishing temperature from high friction to low. These results suggest that the first period of the whole polishing time greatly affects the nonuniformity of removal rate.

• 한국정밀공학회지
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• 제17권4호
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• pp.69-80
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• 2000

Generally, die polishing is a lime consuming process, resulting in 30∼50％ of the whole die manufacturing time. However, die polishing has not been automated yet, since it needs a great deal of experience and skill. This paper describes a new development of automated system for die polishing and focuses on the successful achievements of the element techniques to realize from hand skill to automation, as followings: (1) The 5 axes polishing system by the aid of robot with 2 degrees of freedom, is developed for the application of curved surface die. (2) The CAM system realizes a 5 axes tool path control for polishing and measuring. (3) The conductive elastic tool is able to meet curved surfaces of die and gives a high efficient and quality polishing characteristics. (4) The surface roughness measurement device with noncontact laser is developed and has a high reliability without surface damage.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1579-1582
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• 2005

Polishing is cutting process that polished workpiece by relative motion of abrasive grain between polishing tool and workpiece. According to relative motion forms(polishing patterns) of abrasive grain, the surface quality is different. Then, polishing patterns are important essential in polishing process. In work field, polishing patterns are determined by an expert of experience. Therefore, to work effective polishing, it is necessary that evaluate polishing characteristics for polishing patterns. And, polishing machine is made with cartesian coordinate robots, we estimate polishing characteristics by measurement of surface roughness.

• 한국정밀공학회지
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• 제19권1호
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• pp.99-106
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• 2002

For the development of a ultra-precision CNC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We calculated unit removal profiles for various flat type polishing tools and polishing tool positions. Using these results we simulate the corrective polishing process based on dwell time control. We calculate dwell time distributions and residual error of the polishing simulation method and the FFT calculation method. We test corrective polishing algorithm with an optical glass. The target removal shape is a sine wave that has amplitude 0.3 micro meters. We find this polishing process has a machining resolution of nanometer order and is effective for sub-micrometer order machining. This result will be used for the software development of the CNC polishing system.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1993년도 한국자동제어학술회의논문집(국제학술편); Seoul National University, Seoul; 20-22 Oct. 1993
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• pp.541-544
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• 1993

This paper attempts to propose new procedures to evaluate roughness of ground metallic surface in the range of 1-10.mu.m from data gained by an optical, in-process measurement of the surfaces. Studies are made to process the data of reflected lights pointed at the surface to be measured. Results obtained are compared with those of measurement by stylus roughness meter. Correlations between the two types of roughness measurement are well. The proposed method can be used as a sensor for a polishing robot.

• 한국정밀공학회지
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• 제21권1호
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• pp.40-45
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• 2004

Recently, aspheric optical lenses and mirrors, which are harder to manufacture and measure than the conventional spherical ones, are widely used, particularly in electronic fabrication process. Generally, interferometric optical method is used for the measurement of spherical optical surface. However, the interferometric method for aspheric surface measurement is difficult because it needs a precise null corrector and strict environmental conditions such as constant temperature, humidity and vibrations. We have been studied on the manufacturing of aspheric optics to improve the surface profile accuracy and productivity using a corrective polishing process. For the corrective polishing, a practical method of On-Machine Measurement (OMM) is required. For this purpose, an optical OMM system has been studied using the Shach-Hartmann test, which is very robust to the practical polishing environment. The wavefront has been reconstructed from the measured data using the primary aberration polynomial function by the least squares fitting. The measured result of the OMM system shows that the maximum deviation is less than 200 nm for the one of commercial Fizeau interferometer Wyko 6000.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.950-955
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• 2001

For the development of an ultra-precision CNC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We analyze and test the unit removal profiles for a ball type polishing tool. Using these results we calculate dwell time distributions and residual errors for a target removal shape. We use the polishing simulation method and feed rate calculation method for the dwell time calculation. We test corrective polishing algorithm with an optical glass. The target removal shape is a sine wave that has amplitude 0.3 micro meters. We find this polishing process has a machining resolution of nanometer order and is effective for sub-micrometer order machining. This result will be used for the software development of the CNC polishing system.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.783-786
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• 2000

For the development of a ultra-precision CMC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We calculated unit removal profiles for various polishing tools and polishing tool positions. Using these results we simulate the corrective polishing process based on dwell time control. We calculate dwell time distributions and residual error of the polishing simulation method and the FFT calculation method. We got good dwell time distributions and small residual when we used the FFT calculation method. This results will be used for the optimization of corrective polishing process.