• Journal of the Korean Society for Precision Engineering
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• v.20 no.2
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• pp.146-153
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• 2003

Ultrasonic inspection of defects has been focused on the existence of defect in structural material and need has much time and expenses in inspecting all the coordinates (x, y) on material surface. Neural networks can have an application to coordinates (x, y) of defects by multi-point inspection method. Ultrasonic inspection modeling is optimized by neural networks Neural networks has trained training example of absolute and relative coordinate of defects, and defect pattern. This method can predict coordinates (x, y) of defects within engineering estimated mean error $\psi$.

• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.2
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• pp.164-169
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• 2008

The effects of the antisite related defects on the electronic structure of silica and the gate leakage current have been investigated using first-principles calculations. Energy levels related to the antisite defects in silicon dioxide have been introduced into the bandgap, which are nearly 2.0 eV from the top of the valence band. Combining with the electronic structures calculated from first-principles simulations, tunneling currents through the silica layer with antisite defects have been calculated. The tunneling current calculations show that the hole tunneling currents assisted by the antisite defects will be dominant at low oxide field whereas the electron direct tunneling current will be dominant at high oxide field. With increased thickness of the defect layer, the threshold point where the hole tunneling current assisted by antisite defects in silica is equal to the electron direct tunneling current extends to higher oxide field.

• Journal of Auto-vehicle Safety Association
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• v.7 no.4
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• pp.20-25
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• 2015

The basic point of a vehicle recall is to remove vehicle defects as soon as possible and thus prevent possible road traffic accidents caused by the defects beforehand. Therefore, the core of vehicle recall under the self-certification system consists of a timely response and fast remedy of defects. The present study aimed to deduce a plan for improvement of the system necessary for the fast remedy of defects through a phased analysis of defect investigation procedure based on defect investigation statistical data. There will be a need to make the TSB(Technical Service Bulletin) or service campaign data submission of a manufacturer compulsory for the collection of broad defect information in the stage of information analysis and to impose a higher penalty when the manufacturer violates the data submission in the investigation stage. In addition, it is considered that an active service campaign should be induced and a punishment for late recall will be needed for consumer protection.

• Journal of the Korean Ceramic Society
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• v.32 no.12
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• pp.1377-1382
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• 1995

A high-resolution transmission electron microscopy study on the lattice defects formed in the high energy P ion implanted silicon was carried out on an atomic level. Results show that Lomer dislocations, 60$^{\circ}$perfect dislocations, 60$^{\circ}$ dislocation dipole and extrinsic stacking fault formed in the near Rp of as-implanted specimen. In the annelaed specimens, interstitial Frank loops, 60$^{\circ}$perfect disolations, 60$^{\circ}$dislocation dipoles, stacking faults, precipitates, perfect dislocation loops and <112> rodlike defects existed exclusively near in the Rp with various annealing temperature and time. From these results, it is concluded that extended secondary defects as well as the point defect clusters could be formed without annealing. Even at low temperature annealing such as 55$0^{\circ}C$, small interstitial Frank loops could be formed and precipitates were also formed by $700^{\circ}C$ annealing. The defect band annealed at 100$0^{\circ}C$ for 1 hr could be divided into two regions depending on the distribution of the secondary defects.

• Journal of the Semiconductor & Display Technology
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• v.17 no.1
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• pp.27-34
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• 2018

Industrially, die-casting products are formed through casting, and so the methods to inspect the defects inside them are very restrictive. External inspection methods including visual inspection, sampling judgment, etc. enables researchers to inspect possible external defects, but x-ray inspection equipment has been generally used to inspect internal ones. Recently, they have been also applying three-dimensional internal inspections using CT equipment. However, they have their own limitations in applying to the use of industrial inspection due to limited detection size and long calculation time. To overcome the above problems, this paper has suggested a method to inspect internal defects by comparing the CAD data of the product to be inspected with the 3D data of the CT image. In this paper, we proposed a method for fast and accurate inspection in three dimensions by applying x-ray inspection to find internal defects in industrial parts such as aluminum die casting products. To show the effectiveness of the proposed method, a series of experiments have been carried out.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.157-161
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• 2019

Independent control of electronic and thermal transport behaviors is one of the most effective approaches to enhance the performance of thermoelectric materials. To address this, many researches on the relationship between defect structures and thermoelectric properties have been carried out since defects are intrinsic ingredients of polycrystalline materials. Recently, experimental results of simultaneously improved electronic and thermal transport properties have been reported via the formation of 0-dimensional point defects. Here, theoretical backgrounds to the engineering of electronic and thermal transport behaviors by the formation of point defects are discussed and related experimental considerations are also presented in order to provide a practical guide for the development of highperformance thermoelectric materials.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.9
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• pp.707-713
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• 2001

As the integrated circuit device shrinks to smaller dimensions, chemical mechanical polishing (CMP) process was requirdfo the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the IMD layer gest thinner, micro-scratches are becoming as major defects. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. To prevent agglomerated slurry particle from inflow, we installed 0.5${\mu}{\textrm}{m}$ point of use (POU) filter, which is depth-type filter and has 80% filtering efficiency for the 1.0${\mu}{\textrm}{m}$ size particle. In this paper, we studied the relationship between defect generation and polished wafer counts to understand the exact efficiency fo the slurry filteration, and to find out the appropriate pad usage. Our experimental results showed that it sis impossible to prevent defect-causing particles perfectly through the depth-type filter. Thus, we suggest that it is necessary to optimize the slurry flow rate, and to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of depth type filter.

• Korean Journal of Materials Research
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• v.15 no.5
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• pp.293-300
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• 2005

ZnO:Li epilayers were synthesized on sapphire substrates by the pulesd laser deposition (PLD) after the surface of the ZnO:Li sintered pellet was irradiated by the ArF (193 nm) excimer laser. The growth temperature was fixed at $400^{\circ}C$. The crystalline structure of epilayers was investigated by the photoluminescence (PL) and double crystal X-ray diffraction (DCXD). The carrier density and mobility of epilayers measured by van der Pauw-Hall method are $2.69\times10cm^{-3}$ and $52.137cm^2/V{\cdot}s$ at 293 K, respectively. The temperature dependence of the energy band gap of epilayers obtained from the absorption spectra is well described by the Varshni's relation, $E_g(T)=3.5128eV{\cdot}(9.51\times10^{-4}eV/K)T^2/(T+280K)$. After the as-grown ZnO:Li epilayer was annealed in Zn atmospheres, oxygen and vaccum the origin of point defects of ZnO:Li has been investigated by PL at 10 K. The Peaks of native defects of $V_{zn},\;V_o,\;Zn_{int},\;and\;O_{int}$ showned on PL spectrum are classified as a donors or accepters type. We confirm that $ZnO:Li/Al_2O_3$ in vacuum do not form the native defects because ZnO:Li epilayers in vacuum existe in the form of stable bonds.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.100-101
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• 2008

To obtain the single crystal thin films, $CuGaSe_2$ mixed crystal was deposited on thoroughly etched semi-insulating GaAs(100) substrate by the hot wall epitaxy (HWE) system. The source and substrate temperatures were $610^{\circ}C$ and $450^{\circ}C$, respectively. After the as-grown $CuGaSe_2$ single crystal thin films was annealed in Cu-, Se-, and Ga-atmospheres, the origin of point defects of $CuGaSe_2$ single crystal thin films has been investigated by the photoluminescence(PL) at 10 K. The native defects of $V_{CU}$, $V_{Se}$, $Cu_{int}$, and $Se_{int}$ obtained by PL measurements were classified as a donors or acceptors type. And we concluded that the heat-treatment in the Cu-atmosphere converted $CuGaSe_2$ single crystal thin films to an optical n-type. Also, we confirmed that Ga in $CuGaSe_2$/GaAs did not form the native defects because Ga in $CuGaSe_2$ single crystal thin films existed in the form of stable bonds.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.4
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• pp.402-416
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• 1999

The thermal distributions near the growth interface of 150nm CZ crystals were measured by three thermocouples installed at the center, middle (half radius) and edge (10nm from surface) of the crystals. The results show that larger growth rates produced smaller thermal gradients. This contradicts the widely used heat flux balance equation. Using this fact, it is confirmed in CZ crystals that the type of point defects created is determined by the value of the thermal gradient(G) near the interface during growth, as already reported for FZ crystals. Although depending on the growth systems the effective length of the thermal gradient for defect generation are varied, we defined the effective length as 10n,\m from th interface in this experiment. If the G is roughly smaller than 20C/cm, vacancy rich CZ crystals are produced. If G is larger than 25C/cm, the species of point defects changes dramatically from vacancies to interstitials. The experimental results after detaching FZ and CZ crystals from the melt show that growth interfaces are filled with vacancies. We propose that large G produces shrunk lattice spacing and in order to relax such lattice excess interstitials are necessary. Such interstitials recombine with vacancies which were generated at the growth interface, nest occupy interstitial sites and residuals aggregate themselves to make stacking faults and dislocation loops during cooling. The shape of the growth interface is also determined by te distributions of G across the interface. That is, the small G and the large G in the center induce concave and convex interfaces to the melts, respectively.