• Journal of the Korean institute of surface engineering
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• v.33 no.2
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• pp.126-134
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• 2000

This study investigated the bath compositions and plating conditions and crystal structure used for achieving nickel-thallium-phosphorus deposits by means electroless plating. The electroless nickel-thallium-phosphorus deposits were achieved with a bath using sodium hypophosphite as the reducing agent and sodium citrate as the complexing agent. The depositing rate was 10.5mg.$cm^{2-1}$ .$hr^{-1 }$ from the optimistic bath composition, 0.1M nickel sulfate, 0.005M thallium sulfate, 0.2M sodium hypophosphite, and 0.05M sodium citrat and the recommended plating conditions, pH 5.5 and $90^{\circ}C$. The composition of alloy deposits determined by X-ray analysis (EDS) that the Thallium was increased with major increasing concentration of complexing agent and thallium ion in bath solution, it decreased according to the increasing concentrations of reduction agent in the bath solution, Bit Phosphorus showed a contrary to the thallium. It was observed from X-ray diffraction analysis, Scanning Electron Microscopy and Transmission Electron Microscopy. The crystalline structure of deposits was amorphous at the first deposited state but it was changed $Ni-T1-Ni_{5}$ $P_2$ polycrystalline when subjected to 1 hour heat treatment of more than $350^{\circ}C$. TEM observation demonstrated that the microstructure was identical to the result of the XRD at as deposited but it became $Ni-Tl-Ni_{5}$ $P_2$ polycrystalline when heated. And grain size was 10-50nm.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.270-274
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• 2001

With Increasing importance of electroless nickel plating technology in many fields such as electronic and automobile industries, the treatment of the spent baths is becoming a serious problem. These spent baths contain iron and zinc as impurities, organic acids as complexing reagents, and phosphonate ions as oxidized species of tile reducing reagent. as well as several grams per liter of nickel. The spent baths are currently treated by conventional precipitation method. but a mettled with no sludge generation is desired. This work aims at establishing a recycling process of nickel from tile spent baths using solvent extraction. Extraction behaviors of nickel. iron. and zinc in various 쇼pes of real spent baths are investigated as a function of pH using LIX841, di (2-ethylhexyl)phosphoric acid (D2EHPA), and PC88A as tile extractants. Nickel is extracted by LIX84I at the equilibrium pH of more than 6 with high efficiency. For the weakly acid baths. iron and zinc are extracted by D2EHPA or PC88A without adjusting the pH of the baths leaving nickel in the aqueous phase. Stripping of nickel from LIX84I with sulfuric acid is also investigated. It is shown that concentrated nickel sulfate solution (> 100 ㎏-Ni/㎥) is obtained. This solution can be reused in the electroless plating process. Based on these findings, flow sheets for recovering nickel from the spent baths are proposed.

• Journal of the Korean institute of surface engineering
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• v.47 no.1
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• pp.1-6
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• 2014

The copper deposit on steel plate was prepared by pyrophosphate copper plating solution made with variation of inorganic additive. $NH_4OH$ and $NH_4NO_3$ were used as inorganic additives. The copper layer characteristics - tensile strength, crystallite size and crystal orientation - were evaluated by X-ray diffraction and Universal Test Machine. The presence of ammonium nitrate results in reduction of average roughness value from $0.08{\mu}m$ to $0.03{\mu}m$. In pyrophosphate copper plating solution without Inorganic additive, tensile strength of electrodeposit copper foil was reduced from 600 MPa to 180 MPa after 7 days aging. However, when adding ammonium nitrate, there was almost no change of tensile strength, intensity of crystal orientation - (111), (200) and (220) - and crystallite size (2~30 nm).

• Journal of the Korean institute of surface engineering
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• v.40 no.3
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• pp.125-130
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• 2007

Many fundamental studies have been carried out regarding waste water and hazardous gas treatment technology using the photolysis effect of $TiO_2$. However, photolysis of both organic and organic-inorganic binders immobilizing $TiO_2$ makes permanent use impossible. In this study we manufactured a catalytic electrode by nickel-$TiO_2$ composite plating in order to immobilize $TiO_2$. The surface properties according to the current density changes of cathode and concentration changes of $TiO_2$ powder in nickel plating bath has been analysed with EDX, XRF, SEM, Raman spectrometer etc. The characterization of the catalytic electrode in decomposition of organic compound has been obtained by using UV-Visible spectrophotometer through analysing concentration changes of methyl orange solution containing the catalytic electrode vs. time with projecting UV-light in the solution. The study shows that a catalytic electrode of nickel-$TiO_2$ composite plating with high-efficiency in decompostion of organic compound has been formed under high concentration of $TiO_2$ powder and low current density of cathode.

• Journal of Advanced Navigation Technology
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• v.28 no.4
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• pp.544-551
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• 2024

In this study, the electrochemical polarization data required for the simulation of the plating process, simulation of plating conditions, and characterization of the plating layer were discussed. The electrochemical polarization data obtained by potentiodynamic polarization tests and potentiostat analysis of Ni and Cu were used to observe changes in the overvoltage distribution with the flow conditions of the plating solution. In the simulation of plating conditions, the current density distribution and plating thickness distribution were evaluated under different variables to analyze the influence of the location and number of contacts on the rack pins on the plating quality. Simulation results under variables such as anode geometry, interpole distance, auxiliary anode placement, and variation of substrate spacing were used to explore ways to improve plating thickness deviation. Additionally, plating layer characterization analyzed the thickness, adhesion, and delamination of the plating layer with and without buffer layer formation. The simulation results can be utilized as important basic data for improving the efficiency and quality of the plating process.

• Resources Recycling
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• v.24 no.3
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• pp.51-58
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• 2015

In order to recover tin from the waste tin plating solution, we used the ion exchange method using three types of ion exchange resins. The ion exchange resin with tertiary functional group(Lewatit TP 272) has not adsorption ratio of tin. The ion exchange resin with iminodiacetic functional group(Lewatit TP 207) has high adsorption ratio of tin, but impurity content in the recovered tin solution was relatively high. Whereas, in case of the ion exchange resin with functional group of ethylhexyl-phosphate(Lewatit VP OC 1026), adsorption ratio of tin was less than that of Lewatit TP 207. However, it was possible to remove impurities in the recovered tin solution by controlling the pH of the solution. High purity tin solution can be recovered by removing the organic materials with water washing process.

• Journal of the Korean Magnetics Society
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• v.8 no.5
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• pp.295-299
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• 1998

The magnetic thin films can be prepared without vacuum process and under the low temperature(<100 $^{\circ}C$) by ferrite plating. We have performed ferrite plating of $Ni_xFe_{3-x}O_4$ (x=0.162~0.138) films on cover glass at the substrate temperature 80 $^{\circ}C$ and pH range of the oxidizing solution, 7.1~8.8. the crystal structure of the samples has been identified as a single phase of polycrystal spinel structure by x-ray diffraction technique. The deposition rate and the grain size of the film increased with the pH of oxidizing solution. The coercive force (H_C)$ decreased with the pH of oxidizing solution.

• Polymer(Korea)
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• v.34 no.1
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• pp.25-31
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• 2010

Polymer core and metal shell composite particles have been prepared by the electroless nickel plating on the surface of monodisperse polystyrene microspheres. Various sizes of polystyrene particles with highly monodisperse state could be synthesized by controlling the dispersion medium in dispersion polymerization. Electroless nickel plating was performed on the polystyrene particle with diameter of $3.4\;{\mu}m$. The morphology of polystyrene/nickel composite particles was investigated to see the effect of the plating conditions, such as the $PdCl_2$ and glycine concentrations and the dropping rate of nickel plating solution, on nickel deposition. With $PdCl_2$ and glycine concentrations at more than 0.4 g/L and 1 M, respectively, more uniform nickel layer and less precipitated nickel aggregates were formed. At the given plating time of 2 h, the same amount of plating solution was introduced by varying the dropping rate. Though the effect of dropping rate on particle morphology was not noticeable, the dropping rate of 0.15 mL/min for 60 min showed rather uniform plating.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.12
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• pp.1297-1303
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• 2015

The internal chromium plating of a long-axis tube is widely used in military and industrial application, with the thick hard plating formed using a mixed solution of Chromium acid and catalytic $H_2SO_4$. A large-caliber gun can endure a high explosive force as a result of the increased stiffness and wear resistance provided by this internal hard chromium surface. The internal chromium layer of a tube is prone to exfoliation caused by the high kinetic energy of the projectile and high pressure of the explosion. Therefore, we reviewed the plating process. Chromium plating comprises many steps, including the removal of Grease, water cleaning, electrolytic abrasion, etching, plating, water cleaning, and hydrogen brittleness removal. The exfoliated chromium plating layer is affected by the adhesion property of the plating. In particular, the Fe concentration of the electrolyte affects the adhesion property. The optimum Fe concentration for effectively suppressing the exfoliation of the plating layer was established by using a scanning electron microscope to determine the surface roughness, and the effectiveness was proved in an adhesion test, etc.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.79-84
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• 2014

To investigate the plating properties of a diethylene glycol-based Ag immersion plating solution containing citric acid, silver immersion plating was performed in a range from room temperature to $50^{\circ}C$ using sputtered Cu specimens. The used Cu specimens possessed surface structure with large numbers of pinholes which were created with over-acid etching. The Ag immersion plating performed at $40^{\circ}C$ exhibited that the pinholes and copper surface were completely filled with Ag just after 5 min mainly due to galvanic displacement reaction, indicating the best plating properties. Subsequently, the surface morphology of Ag-coated Cu became rougher as the plating time increased to 30 min because of the deposition of silver nanoparticles created by chemical reduction in the solution. The specimen that its overall surface was covered with silver indicated the start of oxidation at temperature higher than around $50^{\circ}C$ in air as compared with pure Cu, indicating enhanced anti-oxidation properties.