• Title/Summary/Keyword: plating solution

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Gold Alloy Plating on Electronic Parts(II) (전자 부품상의 금도금에 관한 연구 (제 2 보))

  • 염희택
    • Journal of the Korean institute of surface engineering
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    • v.9 no.3
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    • pp.1-4
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    • 1976
  • In order to get high wear-resistant gold alloy plating on electronic parts, on attempt has been made, in which Cu, Ni, and Zn EDTA salts were added in gold palting solution. The results obtained on the wear resistance are as follows: 1. The addition of 0.5g/ι or over Cu in plating solution, showed 1.5 times more wear resistance than in case of no addition. 2. The addition of 1.5g/ι or over Ni, showed 3.5 times more wear-resistance . 3. The addition of 1.5g/ι and 4.0g/ι Zn , showed 3.5 times and 6.8 times more wear resistance , respectively. 4. The addition of 1.5g/ι Ni and 1.0g/ι Zn simultaneously , showed about 10 times more wear resistance than in case of no addition.

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Simultaneous Control of Au Nanotube Lengths and Pore Sizes with a Single Kind of Polycarbonate Membrane via Interfacial Deposition at the Air/Water Interface

  • Pyo, Myoung-Ho;Joo, Jung-Sook;Jung, Youn-Su
    • Bulletin of the Korean Chemical Society
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    • v.28 no.8
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    • pp.1285-1288
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    • 2007
  • Au was electrolessly deposited on polycarbonate (PC) membranes (0.1 μm pores) at the air/water interface. It was found that the Au nanotube dimension can be controlled by adjusting the plating temperature and the solution composition. Interfacial deposition of Au at relatively low temperatures (4℃) produced long nanotubes, which run through the whole membrane thickness with small openings. Increase of plating temperatures resulted in the decrease of nanotube lengths and Au film thicknesses. It was also disclosed that the inside-diameter of Au nanotubes can be controlled with negligible variations in length by changing the composition of a plating solution.

The Effect of Stabilizers on the Characteristics of Deposit in the Electroless Nikel Plating (무전해 니켈 도금용액에 사용되는 안정제의 도금피막 특성에 미치는 영향)

  • Lee Hong-Kee;Son Seong-Ho;Jeon Jun-Mi;Koo Suck-Bon;Hur Jin-Young
    • Journal of the Korean institute of surface engineering
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    • v.37 no.6
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    • pp.335-343
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    • 2004
  • Bath stabilizers in the electroless nickel(EN) plating solution are known to prevent sudden bath decomposition and extend its lifetime. Further, every stabilizer has a different role and function in EN solution and it influences the surface structure. In this study, the effects of various stabilizers on the deposition rate, surface morphology, deposition content of phosphor and hardness were investigated.

Determination of Nitrate in Chromium Plating Solution with Nitrate-Selective Electrodes

  • 강유라;이원;허황;차근식;남학현
    • Bulletin of the Korean Chemical Society
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    • v.16 no.3
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    • pp.221-226
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    • 1995
  • A method for determining nitrate in post treatment chromium plating solutions with PVC-based nitrate-selective electrodes is described. PVC-based nitrate-selective membranes which contain TDMANO3 ion-exchanger in PVC/NPOE, PVC/DOA or PVC/DBP matrices, and a commercially available Corning electrode (No. 476134) have been compared in respect of their detection limits, response slopes, selectivities at various pHs, and dynamic response to the hydrochromate ion in basic condition. The PVC/DBP/TDMANO3 membrane electrode was chosen as the ISE detector for the determination of nitrate in the presence of hydrochromate interference. The amount of nitrate in real post treatment chromium plating solution could be determined successfully with this electrode in both static and flow-injection measurements when the sample was properly diluted with an alkaline buffer.

Electroless Ni Plating on PC to Improve Adhesion by DBD Plasma Treatment

  • Song, T.H.;Lee, J.K.;Park, S.Y.
    • Corrosion Science and Technology
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    • v.4 no.6
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    • pp.222-225
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    • 2005
  • The adhesion strength of metal plating on PC was studied. In this study, surface was treated by chemical agents or DBD(dielectric barrier discharge) plasma to imporve the adhesion. The surface roughness, contact angle, gloss of plating and adhesive strength were measured. Adhesion strengths of Ni plating on prepared PC by NaOH and KOH solution were $12.3kgf/cm^2$ and $7.5kgf/cm^2$, respectively. The highest adhesion strength was obtained in the plasma treated one, $27.8kgf/cm^2$.

A Reliability Test for Pb-Free Plating Solution and its Deposit (Pb-Free 도금용액 및 피막의 신뢰성평가)

  • Hur, Jin-Young;Koo, Suck bone;Lee, Hong-Kee
    • Clean Technology
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    • v.11 no.3
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    • pp.153-164
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    • 2005
  • This study found a reliable evaluation for four kinds of pb-Free plating solutions and it's layers, through pure Sn, SnAg, SnBi and SnCu. These four kind of solutions are widely used to pb-Free plating. Hull-cell, Harring-blum, coverage, throwing power, current efficiency, stability, life-time, composition, hardness, roughness, abrasion, scratch, solderability, corrosion, contact angle, morphology, SIR(Surface insulation resistance) and Whisker test were experimented. Also, Using ICP, XRF, FE-SEM, EDS, temperature/humidity chamber, solderability tester, hardness tester, roughness tester, abrasion tester, salt spray tester, contact angle tester, SIR tester, and microscope. In this paper could be shown the systematic and various analysis for reliability about four kinds of pb-Free plating solutions, processes and it's deposit surface.

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Plating Rate of Electroless Nikel-Copper-Phosphorus Plating and Change in Microhardness and Corrosion Rate depending on. Heat treatment (무전해 니켈-구리-인 도금의 도금속도와 열처리에 따른 경도 및 내삭성 변화)

  • 오이식;황용길
    • Journal of the Korean institute of surface engineering
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    • v.23 no.4
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    • pp.208-217
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    • 1990
  • Electroless Ni-Cu-P plating was performed was performed to investigate for plating and changes in microhardness and corrosion rate of of electroless deposits depending on heat treatment. The activation energy for $75~85^{\circ}C$ were calculated to be 66.7KJ/mole. Plating rate increased to 34% with addition of 200ppm of NaF and 0.8ppm of thiourea to the bath. The highest hardness value was obtained by heat treatment deposits layer at$ 400^{\circ}C$, 1 hour. The increase in hardness of deposits by heating was confirmed to be associated with crystallization of the amorphous deposits. Corrosion resistance of deposir layer, which had been heated up to $300^{\circ}C$, was found to be exellent when immersed in 1N-H2SO4 solution, Change of the corrosion resistance seems to have some important bearing on content of amorpous, Ni3P and Cu3P.

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Trivalent chromiun plating by using pulse electrolysis (펄스 파형전해에 의한 3가 크롬도금)

  • 추현식;김연신;이홍로
    • Journal of the Korean institute of surface engineering
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    • v.30 no.2
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    • pp.104-110
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    • 1997
  • Conventional hexavlent chromium electroplating baths deposit the matal at low cathode efficiency and have poor covering and throwing power. The processs also generate hazardous wastes. To overcome many of the disadvantages of hexavalent chromium plating the use of trivalent chromium has advocted. After Yoshida, who first studied trivalent chromium plating, using ammonium sulfate and urea, there are numerous report describing the trivalent chromium electropating process using complexing agents. This study investigaten trivalent chromium plating electrolyte solutious containing formate as a complexing agent and ammouim chloride for conducting agent. The effects of composition and operating conditions on deposits and current efficiencies were investigated in trivalent chromium plating baths by analyzing the relationship pulse conditions and surface morphology The surface morphology of the deposits was observed by SEM. pulse electrolysis has been effective on obtaining a smooth with high current efficiency comparing with D.C. electrolysis in trivalent chromium solution.

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A Study on Ni Electroless Plating Process for Solder Bump COG Technology (COG용 Solder Bump 제작을 위한 Ni 무전해 도금 공정에 관한 연구)

  • Han, Jeong-In
    • Korean Journal of Materials Research
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    • v.5 no.7
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    • pp.794-801
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    • 1995
  • To connect the driver IC and Al coated glass, a method has been developed to plate electrolessly Ni on Al/PR system. It Is necessary to pretreat Al to remove oxide film before plating. In order to find pretreatment process which does not damage photoresist or glass, alkaline and fluoride zincate process have been investigated. Because photoresist and aluminum thin film can easily dissolve in alkaline solution, it is considered that the fluoride zincate process was a suitable one. After immersion in the zincate solution containing 1.5 g/$\ell$ ammonium bifluoride and 100 g/$\ell$ zinc sulfate, electroless nickel plating could be performed. The additive in the zincate solution and thiourea in the plating solution increased smoothness of the plated surface. Acld dip could improve the uniformit of the surface.

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Factors Influencing Edge Dendritic Plating of Steel Sheet in the Electro-Galvanizing Line

  • Du-Hwan Jo;Moonjae Kwon;Doojin Paik;Myungsoo Kim
    • Corrosion Science and Technology
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    • v.23 no.3
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    • pp.215-220
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    • 2024
  • Recently, the demand for Zn-Ni electrogalvanized steel sheets for home appliances and automobiles is increasing. Products should have a thick plating (30 to 40 g/m2) on both side with a thin thickness (≤ 0.8 mm) and the highest surface quality. By a high current density operation, current is concentrated in the edge part of the steel sheet, resulting in large surface dent defects due to dendritic plating. This can lead to a low productivity due to low line speed operation. To solve this problem, this study aimed to identify factors influencing dendritic plating. A cylindrical electroplating device was manufactured. Effects of cut edge shape and thickness of steel plate, current density, temperature, flow rate, electrolyte concentration, and pH on dendrite generation of Zn-Ni electroplating were examined. To investigate effect of edge shape of the steel sheet, the steel sheet was manufactured using three processing methods: shearing, polishing after shearing, and laser. Relative effects thickness and cut edge processing methods of the steel plate, current density, temperature, flow rate, electrolyte concentration, and pH of plating solution on dendrite plating were investigated. To prevent dendrite plating, an edge mask was manufactured and its application effect was investigated.