• 제목/요약/키워드: plating process

검색결과 480건 처리시간 0.027초

Ni Sulfamate-chloride 전기도금 용액에서 전류밀도와 첨가제의 농도 변화가 Ni 박막에 미치는 영향 (Effects of the Changes of Current Density and Additive Concentration on Ni Thin Films in Ni Sulfamate-chloride Electrodeposition Baths)

  • 윤필근;박덕용
    • 한국표면공학회지
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    • 제51권1호
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    • pp.62-70
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    • 2018
  • Sulfamate plating solution containing a small amount of chloride bath was fabricated to study the properties of the electrodeposited Ni thin films. Effects of the changes of current density and additive concentration on current efficiency, residual stress, surface morphology and microstructure of Ni thin films electrodeposited from Ni sulfamate-chloride baths were investigated. The current efficiency was measured to be more than about 95%, independent of the changes of current density and saccharin concentration in the baths. Residual stress of Ni thin film was appeared to be the compressive stress modes in the range of $5{\sim}30mA/cm^2$ current density. Maximum compressive stress was observed at the current density of $10mA/cm^2$. Compressive stress values of Ni thin/thick films were increased to be about -85~-100 MPa with increasing saccharin concentration from 0 to 0.0195 M(4 g/L). Surface morphology was changed from smooth to nodule surface appearance with increasing the current density. Smooth surface morphology of Ni thin films electrodeposited from the baths containing saccharin was observed, independent of the saccharin concentration. Ni thin/thick films consist of FCC(111), FCC(200), FCC(220), FCC(311) and FCC(222) peaks. It was revealed that the FCC(200) peak of Ni thin films is the preferred orientation in the range of $5{\sim}30mA/cm^2$ current density. The intensity of FCC(200) peak was gradually decreased and the intensity of FCC(111) peak was increased with increasing saccharin concentration in the baths.

RF용 MCM-D 기판 내장형 인덕터 (Embedded Inductors in MCM-D for RF Appliction)

  • 주철원;박성수;백규하;이희태;김성진;송민규
    • 마이크로전자및패키징학회지
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    • 제7권3호
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    • pp.31-36
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    • 2000
  • RF(radio Frequency)용 MCM(Multichip Module)-D 기판 내장형 인덕터를 개발하였다. MCM 기술은 고밀도 패키징 기술로서 주로 디지털회로에 많이 적용되어 왔으나, 최근에는 아날로그회로 및 디지털회로가 혼재된 혼성신호 및 초고주파 회로에도 적용되고 있다. 혼성신호에서는 능동소자 주변에 많은 수의 수동소자가 연결되므로 MCM-D 기판에 수동소자를 내장시키면 원가절감과 시스템의 크기 축소 및 경량화를 이를 수 있을 뿐 아니라, 성능과 신뢰성을 향상시킬 수 있다. 본 논문에서 MCM-D 기판은 Cu/감광성 BCB(Benzocyclobutene)를 각각 금속배선 및 절연막 재료로 사용하였고, 금속배선은 Ti/Cu를 각각 1000 $\AA$/3000 $\AA$으로 스퍼터한 후 fountain 방식으로 전기 도금하여 3 $\mu\textrm{m}$ Cu를 형성하였으며, 인덕터는 coplanar구조로 하여 기존의 반도체 공정을 이용하여 MCM-D기판에 인덕터를 안정적으로 내장시키고 전기적 특성을 측정하였다.

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음이온 교환막에서 염산의 이동특성 연구 (A Study on Transport Characteristics of Hydrochloric Acid in an Anion Exchange Membrane)

  • 강문성;오석중;문승현
    • 멤브레인
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    • 제8권3호
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    • pp.148-156
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    • 1998
  • 이온교환막을 이용하는 확산투석은 농도차가 구동력인 막공정으로서 철강 산업, 금속 제련 산업, 전기 도금 산업 등으로부터 발생되어지는 폐산으로부터 염산 및 기타 산들을 회수하는데 사용된다. 이론적으로는 초기산 농도가 증가함에 따라 구동력인 농도차가 커지므로 선형적으로 산의 투과속도가 증가하게 된다. 그러나 염산의 경우 약 3 N 이상의 고농도 범위에서는 투과속도 증가율이 농도차가 커짐에 따라 감소하였다. 본 연구에서는 막흡수 실험과 확산투석조 실험을 통해 염산을 회수하기 위한 확산투석에 산의 농도가 미치는 영향과 농도 범위에 따른 음이온 교환막 내부에서의 산의 이동 기작을 고찰하였다. 실험 결과 저농도(<2 N)산의 경우에는 산의 분자확산, 그리고 고농도 (>2 N)산의 경우에는 수소이온 투과현상 (proton leakage)이 막에서의 지배적인 이동 기작임을 알 수 있었다. 또한 고농도 범위에서는 삼투압에 의한 물분자의 이동과 막의 탈수현상이 수소이온의 이동을 방해하므로 막에서의 산 플럭스 증가율이 감소하였다.

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나노결정질 Ni-W 합금전착의 내부응력에 미치는 공정조건 변수의 영향 (Influences of Electrodeposition Variables on the Internal Stess of Nanocrystalline Ni-W Films)

  • 김경태;이정자;황운석
    • Corrosion Science and Technology
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    • 제11권6호
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    • pp.275-279
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    • 2012
  • Ni-W alloy deposits have lately attracted the interest as an alternative surface treatment method for hard chromium electrodeposits because of higher wear resistance, hardness at high temperature, and corrosion resistance. This study deals with influences of process variables, such as electodeposition current density, plating temperature and pH, on the internal stress of Ni-W nanocrystalline deposits. The internal stress was increased with increasing the applied current density. With increasing applied current density, the grain size of the deposit decreases and concentration of hydrogen in the deposit increases. The subsequent release of the hydrogen results in shrinkage of the deposit and the introduction of tensile stress in the deposit. Consequently, for layers deposited at high current density, cracking occurs readily owing to high tensile stress value. By increasing the temperature of the electrodeposition from $60^{\circ}C$ to $80^{\circ}C$, the internal stress was decreased. It seems that an increase in the number of active ions overcoming the activation energy at elevated temperature caused a decline in the concentration polarization and surface diffusion. It decreased the level of hydrogen absorption due to the lessened hydrogen evolution reaction. Therefore, the lower level of hydrogen absorption degenerated the hydride on the surface of the electrode, resulting in the reduction of the internal stress of the deposits. By increasing the pH of the electrodeposition from 5.6 to 6.8, the internal stress in the deposits were slightly decreased. It is considered that the decrease in internal stess of deposits was due to supply of W complex compound in cathode surface, and hydrogen ion resulted from decrease of activity.

Pulse-reverse도금을 이용한 다층 PCB 빌드업 기판용 범프 생성특성 (Characteristics of Plated Bump on Multi-layer Build up PCB by Pulse-reverse Electroplating)

  • 서민혜;공만식;홍현선;선지완;공기오;강계명
    • 한국재료학회지
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    • 제19권3호
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    • pp.151-155
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    • 2009
  • Micro-scale copper bumps for build-up PCB were electroplated using a pulse-reverse method. The effects of the current density, pulse-reverse ratio and brightener concentration of the electroplating process were investigated and optimized for suitable performance. The electroplated micro-bumps were characterized using various analytical tools, including an optical microscope, a scanning electron microscope and an atomic force microscope. Surface analysis results showed that the electroplating uniformity was viable in a current density range of 1.4-3.0 A/$dm^2$ at a pulse-reverse ratio of 1. To investigate the brightener concentration on the electroplating properties, the current density value was fixed at 3.0 A/$dm^2$ as a dense microstructure was achieved at this current density. The brightener concentration was varied from 0.05 to 0.3 ml/L to study the effect of the concentration. The optimum concentration for micro-bump electroplating was found to be 0.05 ml/L based on the examination of the electroplating properties of the bump shape, roughness and grain size.

A Study on the Friction and Wear Properties of Tribaloy 800 Coating by HVOF Thermal Spraying

  • Cho, Tong-Yul;Yoon, Jae-Hong;Kim, Kil-Su;Youn, Suk-Jo;Song, Ki-Oh;Back, Nam-Ki;Chun, Hui-Gon;Hwang, Soon-Young
    • 한국표면공학회지
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    • 제39권5호
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    • pp.240-244
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    • 2006
  • Tribaloy 800 (T800) powder is coated on the Inconel 718 substrate by the optimal High Velocity Oxy-Fuel (HVOF) thermal spray coating process developed by this laboratory. For the study of the possibility of replacing of the widely used classical chrome plating, friction, wear properties and sliding wear mechanism of coatings are investigated using reciprocating sliding tester both at room and at an elevated temperature of $1000^{\circ}F\;(538^{\circ}C). Both at room temperature and at $538^{\circ}C$, friction coefficients and wear debris of coatings are drastically reduced compared to those of non-coated surface of Inconel 718 substrate. Friction coefficients and wear traces of both coated and non-coated surfaces are drastically reduced at higher temperature of $538^{\circ}C$ compared with those at room temperature. At high temperature, the brittle oxides such as $CoO,\;Co_3O_4,\;MoO_2,\;MoO_3$ are formed rapidly on the sliding surfaces, and the brittle oxide phases are easily attrited by reciprocating slides at high temperature through complicated mixed wear mechanisms. The sliding surfaces are worn by the mixed mechanisms such as oxidative wear, abrasion, slurry erosion. The brittle oxide particles and melts and partial-melts play roles as solid and liquid lubricant reducing friction coefficient and wear. These show that the coating is highly recommendable for the durability improvement coating on the surfaces vulnerable to frictional heat and wear.

Ag 코팅한 W-Ag 전기접점/Cu 모재간의 브레이징 접합 특성 (Brazing Adhesion Properties of Ag Coated W-Ag Electric Contact on the Cu Substrate)

  • 강현구;강윤성;이재성
    • 한국분말재료학회지
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    • 제13권1호
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    • pp.18-24
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    • 2006
  • The brazing adhesion properties of Ag coated W-Ag electric contact on the Cu substrate have been investigated in therms of microstructure, phase equilibrium and adhesion strength. Precoating of Ag layer ($3{\mu}m$ in thickness) on the $W-40\%Ag$ contact material was done by electro-plating method. Subsequently the brazing treatment was conducted by inserting BCuP-5 filler metal (Ag-Cu-P alloy) layer between Ag coated W-Ag and Cu substrate and annealing at $710^{\circ}C$ in $H_2$ atmosphere. The optimum brazing temperature of $710^{\circ}C$ was semi-empirically calculated on the basis of the Cu atomic diffusion profile in Ag layer of commercial electric contact produced by the same brazing process. As a mechanical test of the electric contact after brazing treatment the adhesion strength between the electric contact and Cu substrate was measured using Instron. The microstructure and phase equilibrium study revealed that the sound interlayer structure was formed by relatively low brazing treatment at $710^{\circ}C$. Thin Ag electro-plated layer precoated on the electric contact ($3{\mu}m$ in thickness) is thought to be enough for high adhesion strength arid sound microstructure in interface layer.

물질흐름 및 특허분석을 통한 주석 스크랩 재활용 기술 동향 (Trend on Recycling Technologies of Tin Scrap by Material Flows and Patent Analysis)

  • 김용환;손성호;최한신;한철웅;김태범;안재우;김홍인;이기웅
    • 자원리싸이클링
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    • 제23권3호
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    • pp.61-70
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    • 2014
  • 주석은 땜납, 주석도금강판, 청동 합금, 투명전극용 타겟 및 화학첨가제 등에 널리 사용되고 있다. 최근 자원의 희소성 및 경제성으로 인해 주석 스크랩에 대한 재활용 기술이 연구되고 있다. 본 논문에서는 주석이 함유된 공정 스크랩, 슬러지, 도금 폐액 및 합금의 재활용 기술에 대하여 1970년부터 2013년까지 공개/등록된 한국, 미국, 중국, 일본, 유럽의 특허에 대하여 조사하였다. 특허는 키워드를 사용하여 수집하였으며, 기술의 정의에 의해 필터링 하여 연도, 국가, 출원인 및 기술에 따라 분석하였다.

Adhesive Behaviors of the Aluminum Alloy-Based CrN and TiN Coating Films for Ocean Plant

  • Murakami, Ri-Ichi;Yahya, Syed Qamma Bin
    • International Journal of Ocean System Engineering
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    • 제2권2호
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    • pp.106-115
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    • 2012
  • In the present study, TiN and CrN films were coated by arc ion plating equipment onto aluminum alloy substrate, A2024. The film thickness was about 4.65 ${\mu}m$. TiN and CrN films were analyzed by X-ray diffraction and energy dispersive X-ray equipments. The Young's modulus and the micro-Vickers hardness of aluminum substrate were modified by the ceramic film coatings. The difference in Young's modulus between substrate and coating film would affect on the wear resistance. The critical load, Lc, was 75.8 N for TiN and 85.5 N for CrN. It indicated from the observation of optical micrographs for TiN and CrN films that lots of cracks widely propagated toward the both sides of scratch track in the early stage of MODE I. TiN film began to delaminate completely at MODE II stage. The substrate was finally glittered at MODE III stage. For CrN film, a few crack can be observed at MODE I stage. The delamination of film was not still occurred at MODE II and then was happened at MODE III. This agrees with critical load measurement which the adhesive strength was greater for CrN film than for TiN film. Consequently, it was difficult for CrN to delaminate because the adhesive strength was excellent against Al substrate. The wear process, which the film adheres and the ball transfers, could be enhanced because of the increase in loading. The wear weight of ball was less for CrN than for TiN. This means that the wear damage of ball was greater for TiN than for CrN film. It is also obvious that it was difficult to delaminate because the CrN coating film has high toughness. The coefficient of friction was less for CrN coating film than for TiN film.

Nanocomposite Coating with TiAlN and Amorphous Carbon Phases Synthesized by Reactive Magnetron Sputtering

  • Kim, Bom Sok;Kim, Dong Jun;La, Joung Hyun;Lee, Sang Yong;Lee, Sang Yul
    • 대한금속재료학회지
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    • 제50권11호
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    • pp.801-808
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    • 2012
  • TiAlCN coatings with various C contents were synthesized by unbalanced magnetron sputtering. The characteristics, the crystalline structure, surface morphology, hardness, and friction coefficient of the coatings as a function of the C content were investigated by X-ray diffraction (XRD), atomic force microscopy (AFM), a microhardness tester, and a wear test. In addition, their corrosion behaviors in a deaerated 3.5 wt% NaCl solution at $40^{\circ}C$ were investigated by potentiodynamic polarization tests. The results indicated that the $Ti_{14.9}Al_{15.5}C_{30.7}N_{38.9}$ coating had the highest hardness, elastic modulus, and a plastic deformation resistance of 39 GPa, 359 GPa, and 0.55, respectively, and it also had the lowest friction coefficient of approximately 0.26. Comparative evaluation of the TiAlCN coatings indicated that a wide range of coating properties, especially coating hardness, could be obtained by the synthesis methods and processing variables. The microhardness of the coatings was much higher than that from previously reported coating using similar magnetron sputtering processes. It was almost as high as the microhardness measured from the TiAlCN coatings (~41 GPa) synthesized using an arc ion plating process. The potentiodynamic test showed that the corrosion resistance of the TiAlCN coatings was significantly better than the TiAlN coatings, and their corrosion current density ($i_{corr}$), corrosion potentials ($E_{corr}$) and corrosion rate decreased with an increasing C content in the coatings. The much denser microstructure of the coatings due to the increased amount of amorphous phase with increasing C contents in the coatings could result in the the improved corrosion resistance of the coatings.