• Transactions on Electrical and Electronic Materials
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• v.10 no.3
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• pp.71-74
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• 2009

Electroplated Cu is a cost efficient metallization method in microelectronic packaging applications. Typically in 3-D chip staking technology, utilizing through silicon via (TSV), electroplated Cu metallization is inevitable for the throughput as well as reducing the cost of ownership (COO).To achieve a comparable film quality to sputtering or CVD, a pre-cleaning process as well as plating process is crucial. In this research, atmospheric plasma is employed to reduce the usage of chemicals, such as trichloroethylene (TCE) and sodium hydroxide (NaHO), by substituting the chemical assisted organic cleaning process with plasma surface treatment for Cu electroplating. By employing atmospheric plasma treatment, marginally acceptable electroplating and cleaning results are achieved without the use of hazardous chemicals. The experimental results show that the substitution of the chemical process with plasma treatment is plausible from an environmentally friendly aspect. In addition, plasma treatment on immersion Sn/Cu was also performed to find out the solderability of plasma treated Sn/Cu for practical industrial applications.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.5
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• pp.64-69
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• 2014

This article presents machining experiments to assess the relationship between the profile accuracy and the workpiece hardness using a natural diamond tool on an ultra-precision diamond turning machine. The study is intended to secure a corner cube prism pattern for reflective film capable of high-quality outcomes. The optical performance levels and edge images of corner cubes having various hardness levels of the copper-coated layer on a carbon steel plate are analyzed. The hardness of the workpiece has a considerable effect on the profile accuracy. The higher the hardness of the workpiece, the better the profile accuracy and the worse the edge wear of the diamond tool.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.281-285
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• 2001

This technology Provides an economical Production of high value added goods applicable to electro chemicals by recycling of waste products in EGL(Electro Galvanizing Line). The waste products produced in EGL contain potassium chloride (KCI), nickel and zinc. Highly pure KCI and Zinc Chloride which are raw material of electro plating, can be produced by the development of the recycling process. The scope of this study ranges from laboratory experiments to pilot test in plant. We have developed the whole process of recycling technology such as purification method of waste products, fabrication methods of electro chemicals, basic design of plant, pilot scale production and evaluation of pilot goods, Developed electro chemicals were pure enough to satisfy the specification of steel company.

• Journal of the Korean institute of surface engineering
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• v.38 no.6
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• pp.212-215
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• 2005

Novel continuous electroforming process equipped with a rotating patterned mandrel, soluble/insoluble anode and multiple stage of rolling wheels was proposed to produce precision nickel mesh, which is known as a very efficient electromagnetic interference (EMI) shielding material. Continuously electroformed nickel deposits showed a tendency to form small-sized particles as the plating solution temperature increased and mandrel rotation speeded up and the applied current density decreased. Along the honeycomb patterns of mandrel, nickel was accurately electrodeposited on the surface of rotating mandrel, but quite different visual/structural characteristics were measured on both sides.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.11-16
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• 2013

Through-silicon-via (TSV) is a major technology in microelectronics for three dimensional high density packaging. The 3-dimensional TSV technology is applied to CMOS sensors, MEMS, HB-LED modules, stacked memories, power and analog, SIP and so on which can be employed to car electronics. The copper electroplating is widely used in the TSV filling process. In this paper, the various Cu filling methods using the control of the plating process were described in detail including recent studies. Via filling behavior by each method was also introduced.

• Journal of the Korean institute of surface engineering
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• v.24 no.2
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• pp.73-79
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• 1991

Recent studies son surface coatings have shown that the change of physical, chemical and crystallographic structure analysed and observed according to the deposition process variables has the effects on the resultant film properties. Under the same preparation condition conditions of the substrate and process variables, physical morphology variations characterized by substrate temperature and bias which offect the surface mobility of adatom and adhesion variations related to the formation of Ti interlayer were considered in the present study. Microhardness showed the highest value around 40$0^{\circ}C$ of the substrate temperature and increased with the substrate bias. Adhesion was improved with the increase of substrate temperature and bias. An interlayer of pure titanium formed prior to deposition of TiN improves the adhesion at its optimum thickness. These results were explained by the change of physical morphology and phase analysis.

• Journal of the Korean institute of surface engineering
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• v.36 no.1
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• pp.48-58
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• 2003

This paper will present an overview of toxicity of hexavalent chromium as well as effort for its replacement by a wide spectrum of alternative materials and technologies. Cr-based materials such as trivalent electrodeposit will be one of strong candidates for hard chromium by surface modification of its surface hardness. Ni-base alloy deposits has proved its application in specific mold for glass. HVOF has been studied in aircraft and military sector. There are still under way of development for commercially available alternatives. To date, no single coating has been identified as universal process as comparable to conventional hard chromium electroplating.

• Journal of the Korean institute of surface engineering
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• v.37 no.1
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• pp.22-27
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• 2004

Copper electroforming process has been applied to duplicate Koryo Tripitaka (Taejang'kyong), wooden printing block. Thin copper replica printing plates of 1 mm thickness was successfully manufactured from the printing face (54.5${\times}$25.5 cm) of wooden printing plate. Major processes are (1) silicon rubber replication of the master (2) silvering on silicon rubber (3) copper electroforming (4) separation of copper from the silicon mandrel (5) final coloring by brass plating and trimming. This process has various Potential applications in making thin metallic objects such as plaques, statues, bust and hollow metal objects for jewelry.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.65 no.3
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• pp.224-234
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• 2016

This study developed the conductivity pattern of solid surface using laser direct pattern and compound polymer material technology. For development direct patterning system of solid surface, we used the laser power stabilizer, the dynamic focusing, 3D scanner S/W and the auto aligning techniques. Also For conductivity pattern, we are developed compound polymer material with additive by electro-less plating. These technologies are already used commercially. However operation and control integrated system for direct patterning of solid surface are not yet developed. The objective of this paper is to introduce the laser direct structuring for simple process improvement instead complex PCB process, and develop the operating stability and integration system. Also we implemented new application of laser direct structuring through sample manufacture.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.5 no.5
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• pp.433-437
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• 2004

The MmSH is a process of injecting ABS to produce innovated physical properties compared to the conventional injection process. Physical properties such as thickness and adhesion strength of Ni plate electrolessly coated on a conventional and a MmSH injected ABS have been studied in the pH range 4~8. Thickness of the plate on the MmSH and the conventionally injected ABS appeared to be directly proportional to pH. The ABS processed by the conventional injection showed adhesion strength corresponded to ASTM 4B above pH 5. On the other hand, the ABS processed by the MmSH injection showed a superior adhesion strength corresponded to ASTM 5B above pH 6. It was calculated the shielding effectiveness of above 50 dB in all conditions.